NXP Semiconductors FRDM-STBC-AGM01

Overview

FRDM-STBC-AGM01 from NXP Semiconductors is a Freescale Freedom development board designed to evaluate the FXOS8700CQ 6-axis sensor (3-axis accelerometer + 3-axis magnetometer) in real-world embedded systems. It provides I²C/SPI interface access, onboard voltage regulation (1.8 V/3.3 V), dual interrupt outputs, and direct connection to Kinetis MCU headers for rapid prototyping of e-compass, orientation detection, and motion-triggered applications.

For engineers reviewing the FRDM-STBC-AGM01 datasheet, FRDM-STBC-AGM01 pinout, FRDM-STBC-AGM01 application, or FRDM-STBC-AGM01 equivalent, this board enables immediate validation of FXOS8700CQ sensor fusion performance, interrupt-driven event handling (tap, freefall, orientation), and low-power hybrid-mode ODR configuration up to 400 Hz across both sensors.

Technical Context

The FRDM-STBC-AGM01 implements a dedicated carrier board architecture with fixed 3.3 V and 1.8 V LDOs to meet FXOS8700CQ's dual-supply requirements (VDD = 1.95–3.6 V, VDDIO = 1.62–3.6 V). It routes all 16 pins of the QFN package-including SA0/SA1 for I²C address selection (0x1C–0x1F), Crst for magnetic reset, and INT1/INT2 for programmable interrupts-to accessible test points and Arduino-compatible headers.

It supports both I²C (fast mode, 400 kHz) and point-to-point SPI (≤1 MHz) communication without bus contention, with pull-up resistors pre-installed for SCL/SDA and optional external pull-ups for INT1/INT2 when configured as open-drain. The board includes bypass capacitors (100 nF ceramic + 4.7 μF bulk on VDD; 100 nF on VDDIO) per FXOS8700CQ layout guidelines.

Key Specifications

Availability

FRDM-STBC-AGM01 is available at Aetrix Electronics and suitable for industrial IoT edge sensing, wearable motion analytics, and automotive infotainment orientation interfaces requiring stable component supply and rapid sensor evaluation capability.

Supply support for FRDM-STBC-AGM01 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor company specializing in secure connectivity solutions for automotive, industrial, and IoT applications, with leadership in sensor fusion and embedded processing.

The FRDM-STBC-AGM01 belongs to NXP's Freedom Development Platform family, engineered to accelerate time-to-proof-of-concept for intelligent motion-sensing applications using integrated 6-axis sensors and Kinetis MCUs.

FAQ

What is the primary function of the FRDM-STBC-AGM01 development board?

The FRDM-STBC-AGM01 is a dedicated evaluation carrier board for the FXOS8700CQ 6-axis sensor. It provides regulated power, signal routing, and physical interface compatibility to enable rapid firmware development and sensor characterization - not a standalone sensor IC. The FRDM-STBC-AGM01 itself contains no sensing elements; its role is to host and exercise the FXOS8700CQ under real system conditions.

Does the FRDM-STBC-AGM01 support both I²C and SPI communication with the FXOS8700CQ?

Yes, the FRDM-STBC-AGM01 fully supports both I²C (up to 400 kHz) and point-to-point SPI (up to 1 MHz) protocols as specified for the FXOS8700CQ. All required pull-up resistors are pre-mounted for I²C lines, and the SPI bus is wired for single-master operation without contention - consistent with FXOS8700CQ's documented SPI limitations.

Can the FRDM-STBC-AGM01 be used with microcontrollers other than NXP Kinetis devices?

Yes, the FRDM-STBC-AGM01 features standard Arduino R3 pinout and 0.1" pitch breakout pads for all FXOS8700CQ signals (including SA0/SA1, INT1/INT2, RST, Crst), enabling direct integration with STM32, ESP32, PIC, or any MCU supporting I²C or SPI. Its dual-voltage LDOs ensure correct FXOS8700CQ biasing regardless of host controller I/O voltage.

What sensor features can be validated using the FRDM-STBC-AGM01?

The FRDM-STBC-AGM01 enables full validation of FXOS8700CQ capabilities: dynamic full-scale selection (±2/±4/±8 g), hybrid-mode ODR up to 400 Hz, embedded event detection (tap, freefall, orientation, magnetic threshold), FIFO buffering, self-test, and hard-iron calibration - all accessible via standard register reads/writes over I²C or SPI.

Is the FRDM-STBC-AGM01 RoHS-compliant and qualified for industrial temperature operation?

Yes, the FRDM-STBC-AGM01 is RoHS-compliant and rated for –40 °C to +85 °C operation, matching the environmental qualification of the FXOS8700CQ it hosts. All components - including LDOs, capacitors, and PCB materials - are selected to maintain functionality across this extended range without derating.