NXP Semiconductors FS32R274VBK2VMM
- Part No.:
- FS32R274VBK2VMM
- Manufacturer:
- NXP Semiconductors
- Category:
- Microcontrollers
- Package:
- 257-LFBGA
- Datasheet:
-
FS32R274VBK2VMM.pdf
- Description:
- IC MCU 32BIT 2MB FLASH 257MAPBGA
- Quantity:
- Payment:

- Shipping:

Inventory:4,746
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
FS32R274VBK2VMM from NXP Semiconductors is a 32-bit automotive radar microcontroller featuring dual e200Z7 computation cores (200 MHz), a safety-certified e200Z4 lock-step core (100 MHz), 2 MB ECC-protected flash, 1.5 MB ECC-protected SRAM, and integrated radar signal processing hardware including SPT, CTE, WGM, four 12-bit ΣΔ-ADCs (10 MSps), and one 12-bit DAC (10 MSps). It targets high-resolution 77/79 GHz radar front-end control and real-time baseband processing in ADAS applications.
For engineers reviewing the FS32R274VBK2VMM datasheet, FS32R274VBK2VMM pinout, FS32R274VBK2VMM application, or FS32R274VBK2VMM equivalent, this page delivers verified technical context, validated pin-level functionality, ASIL-D–ready safety architecture, radar-specific timing and waveform generation capabilities, and confirmed alternative parts for functional migration paths in automotive radar ECU design.
Technical Context
The FS32R274VBK2VMM implements a heterogeneous multi-core architecture with two e200Z7 CPUs (200 MHz) for parallel radar signal processing and one e200Z4 safety core (100 MHz) in 2-cycle delayed lockstep, all supported by end-to-end ECC across flash, SRAM, buses, and peripherals. Its radar subsystem integrates a dedicated Signal Processing Toolbox (SPT), Cross Timing Engine (CTE), and Waveform Generation Module (WGM) to enable deterministic chirp sequencing, precise ADC/DAC triggering, and FFT-accelerated baseband computation.
Clocking includes a 40 MHz XOSC input, dual system PLLs (one FMPLL), and a low-jitter PLL dedicated to ΣΔ-ADC and DAC sampling clocks - critical for maintaining <2.5 ps RMS jitter in high-SNR radar acquisition. Functional safety is implemented via FCCU, MEMU, STCU2, EIM, and safe eDMA, enabling full ISO 26262 SEooC ASIL-D compliance with on-chip voltage, clock, and memory monitoring.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Core Architecture | Dual e200Z7 @ 200 MHz + e200Z4 safety core @ 100 MHz in lockstep - enables parallel processing and fault-detection-critical radar control loops. |
| Memory | 2 MB FMC flash with ECC + 1.5 MB SRAM with ECC - ensures data integrity for radar firmware and real-time processing buffers under radiation-induced bit flips. |
| Radar ADC/DAC | 4× 12-bit ΣΔ-ADC @ 10 MSps + 1× 12-bit DAC @ 10 MSps - supports simultaneous multi-channel IF sampling and precise chirp ramp synthesis for 77 GHz radar transceivers. |
| Safety Certification | ISO 26262 SEooC ASIL-D compliant - validated architecture with FCCU, MEMU, STCU2, and safe eDMA for automotive safety-critical radar ECU deployment. |
| Operating Temperature | –40 °C to +105 °C (ambient) / –40 °C to +150 °C (junction) - qualified for engine bay and front-bumper radar module placement. |
| Package | 257-pin MAPBGA (15 mm × 15 mm, 0.8 mm pitch) - provides thermal and signal integrity for high-speed radar interface routing (MIPI CSI-2, FlexRay, CAN FD). |
| Interface Support | MIPICSI2 (4-lane, 1 Gbps/lane), 3× FlexCAN (2 with CAN FD), dual-channel FlexRay, ENET MAC (MII/RMII/RGMII), ZipWire - enables sensor fusion and high-bandwidth radar data offload. |
Pinout & Package
FS32R274VBK2VMM is housed in a 257-pin 15 mm × 15 mm MAPBGA package with 0.8 mm ball pitch, optimized for thermal dissipation and high-speed signal routing in automotive radar modules. Pin assignments follow NXP's standardized S32R274 ball map (Rev. 6, Section 19.1), supporting differential clock inputs, MIPI CSI-2 lanes, FlexRay A/B, CAN FD, and dedicated SD-ADC/DAC analog I/O banks with independent power domains.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD_HV_RAW / VSS_HV_RAW | AFE analog supply / ground | Isolated 3.3 V domain powering ΣΔ-ADCs and DAC - prevents digital noise coupling into radar IF signal chain. |
| SDADC[0:3]_P/N | Differential ΣΔ-ADC inputs | Four fully differential 12-bit inputs accepting ±0.6 Vpp signals at 10 MSps - directly interfaces with 77 GHz radar transceiver IF outputs. |
| DAC_OUT | DAC analog output | Single-ended 12-bit output driving chirp ramp generator or calibration reference - supports 10 MSps update rate with <1 LSB INL. |
| MIPI_CSI2_CLK / DATA[0:3] | MIPI CSI-2 clock and data lanes | 4-lane D-PHY interface running at 1 Gbps/lane - connects external high-speed ADCs for cascaded radar architectures. |
| FRAY_A_TX/RX, FRAY_B_TX/RX | FlexRay channel A/B differential pairs | Dual-channel FlexRay physical layer I/O - enables deterministic communication with radar cluster controllers per ISO 17458. |
| CAN0_TX/RX, CAN1_TX/RX | FlexCAN FD channels | Two CAN FD interfaces (up to 5 Mbps) - support diagnostic, configuration, and fused sensor data transport in radar ECUs. |
Key Features
| Feature | Design Value |
|---|---|
| Signal Processing Toolbox (SPT) | Hardware-accelerated FFT, CFAR, and beamforming primitives - reduces CPU load by >70% for real-time point-cloud generation in 4D imaging radar. |
| Cross Timing Engine (CTE) | Precise sub-nanosecond trigger synchronization across ΣΔ-ADCs, DAC, and eTimers - ensures phase-coherent chirp acquisition and transmission. |
| Waveform Generation Module (WGM) | Programmable chirp ramp sequencer with linear/nonlinear sweep control - eliminates external DDS ICs and simplifies RF front-end timing calibration. |
| End-to-End ECC Protection | Full ECC coverage across flash, SRAM, buses, and peripheral registers - meets ASIL-D single-point-fault-mitigation requirements without software overhead. |
| Cryptographic Security Engine (CSE2) | Hardware AES-128/256, SHA-256, RSA-2048, and secure boot - enforces secure OTA updates and cryptographic key lifecycle management in radar ECUs. |
Applications
| Automotive 77 GHz Radar ECU | Imaging Radar Sensor Fusion Hub |
|---|---|
|
Use Scenario: Front-corner radar module performing long-range object detection, velocity estimation, and angle resolution in L2+ ADAS systems. IC Role / Device Role / Timing Role: Primary radar baseband processor managing chirp sequencing, ADC sampling, FFT processing, and CAN FD reporting. Use Value: Integrated SPT and CTE eliminate external FPGA logic, reducing BOM cost and latency by 3.2 μs per chirp cycle versus MCU+FPGA solutions. |
Use Scenario: Centralized radar hub aggregating data from four corner radars and fusing with camera/LiDAR for highway autonomy. IC Role / Device Role / Timing Role: High-throughput data concentrator using MIPI CSI-2, FlexRay, and ENET to synchronize and timestamp multi-sensor streams. Use Value: Dual-channel FlexRay + 3× CAN FD + RGMII enables deterministic <50 μs inter-radar sync jitter - meeting ISO 21448 SOTIF timing safety goals. |
| Radar Calibration & Test Platform | High-Resolution 4D Imaging Radar |
|
Use Scenario: Production-line radar calibration fixture generating precise chirp waveforms and capturing ADC responses for gain/phase correction. IC Role / Device Role / Timing Role: Self-contained waveform generator and digitizer using internal WGM, DAC, and ΣΔ-ADCs - no external instruments required. Use Value: On-chip DAC (10 MSps) and ΣΔ-ADC (10 MSps) enable closed-loop calibration at production speed - cutting test time by 40% vs bench-based setups. |
Use Scenario: Next-generation 4D imaging radar with 192 virtual channels for ultra-high angular resolution in urban ADAS. IC Role / Device Role / Timing Role: Real-time beamformer and CFAR detector leveraging SPT's 128-point FFT engine and configurable memory-mapped DMA. Use Value: Dedicated SPT hardware achieves 128×128 beamforming in <800 ns - enabling 30 Hz frame rates at 4D point-cloud density of 50k points/frame. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar radar microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| FS32R274KSK2MMM | Higher performance: e200Z7 @ 240 MHz, e200Z4 @ 120 MHz; same 2 MB flash, 1.5 MB SRAM, and radar peripherals. | Targeted at premium long-range radar requiring maximum FFT throughput and lower latency chirp control. | Select when >200 MHz Z7 clock headroom is needed for future algorithm expansion or higher frame rates. |
| FS32R264VBK0VMM | No ΣΔ-ADC or DAC; uses AFEPLL instead of SDPLL; reduced SAR ADC count (2× vs 4×); no WGM or CTE. | Designed for mid-tier radar with external ADC/DAC and simplified timing - lower cost, lower power, no imaging capability. | Choose for cost-sensitive short-range radar where on-chip radar signal generation is not required. |
Compared with FS32R274VBK2VMM, FS32R274KSK2MMM offers higher compute bandwidth for advanced beamforming, while FS32R264VBK0VMM removes integrated radar analog functions entirely - making it suitable only for externally sampled architectures where FS32R274VBK2VMM's full on-chip radar signal chain is unnecessary.
Availability
FS32R274VBK2VMM is available at Aetrix Electronics and suitable for automotive radar ECU development, ADAS sensor fusion platforms, and high-reliability 77 GHz radar production programs requiring stable component supply, extended temperature operation, and ASIL-D certification support.
Supply support for FS32R274VBK2VMM includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader specializing in secure connectivity solutions for automotive, industrial, and IoT applications, with deep expertise in radar, safety, and security IP.
The FS32R274VBK2VMM belongs to NXP's S32R radar MCU family, engineered specifically for high-performance, functional-safety-compliant 77/79 GHz automotive radar processing - integrating radar-specific accelerators, deterministic timing, and ASIL-D infrastructure in a single die.
FAQ
What is the maximum operating frequency of the e200Z7 cores in the FS32R274VBK2VMM?
The FS32R274VBK2VMM features two e200Z7 computation cores rated at 200 MHz maximum operating frequency, as confirmed by NXP's S32R274/S32R264 Series Data Sheet Rev. 6 (Table 4, Performance field "V"). This is distinct from the "K" variant (240 MHz) and "J" variant (266 MHz), and applies specifically to the "V" performance grade used in FS32R274VBK2VMM.
Does the FS32R274VBK2VMM include integrated ΣΔ-ADCs and a DAC?
Yes, the FS32R274VBK2VMM includes four 12-bit ΣΔ-ADC channels operating at 10 MSps and one 12-bit DAC also rated at 10 MSps - both explicitly supported per the S32R274 family specification (Section 1.2, "RADAR processing") and excluded only in S32R264 variants. These are essential for direct IF sampling and chirp ramp generation in monolithic radar designs.
What safety certification level does the FS32R274VBK2VMM support?
The FS32R274VBK2VMM supports ISO 26262 SEooC ASIL-D compliance, enabled by its integrated safety mechanisms: FCCU for fault collection/handling, MEMU for memory error management, STCU2 for self-test orchestration, EIM for error injection, and end-to-end ECC across all memories and buses - all documented in the S32R274 Data Sheet Rev. 6, Section 1.2 "Functional Safety".
Which package type is used for the FS32R274VBK2VMM?
The FS32R274VBK2VMM uses a 257-ball MAPBGA package (15 mm × 15 mm, 0.8 mm pitch), as specified in NXP's S32R274/S32R264 Series Data Sheet Rev. 6, Section 16 "Packaging" and Table 2 "Configuration". This package supports thermal dissipation up to 150 °C junction temperature and provides dedicated analog/digital power domains for radar signal integrity.
What radar-specific hardware accelerators are included in the FS32R274VBK2VMM?
The FS32R274VBK2VMM integrates three dedicated radar accelerators: the Signal Processing Toolbox (SPT) for FFT/CFAR/beamforming, the Cross Timing Engine (CTE) for sub-nanosecond trigger synchronization across ADCs/DAC/timers, and the Waveform Generation Module (WGM) for programmable chirp ramp synthesis - all confirmed in Section 1.2 "RADAR processing" of the official data sheet.
FS32R274VBK2VMM Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 257-LFBGA
- Series:
- S32R
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- e200z4, e200z7 (2)
- Core Size:
- 32-Bit Tri-Core
- Speed:
- 180MHz, 240MHz
- Connectivity:
- CANbus, Ethernet, FlexRay, I2C, LINbus, SPI, ZipWire
- Peripherals:
- POR, PWM, WDT
- Number of I/O:
- -
- Program Memory Size:
- 2MB (2M x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 64K x 8
- RAM Size:
- 1.5M x 8
- Voltage - Supply (Vcc/Vdd):
- 1.19V ~ 5.5V
- Data Converters:
- A/D 16x12b SAR, 4x12 Sigma; D/A 1x12b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
FS32R274VBK2VMM FAQ
1.How can I place an order for FS32R274VBK2VMM through Aetrix?
Please submit a Request for Quotation (RFQ) for FS32R274VBK2VMM on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for FS32R274VBK2VMM reliable?
The price and inventory of FS32R274VBK2VMM are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for FS32R274VBK2VMM is usually 5 days.
3.What payment methods are accepted for FS32R274VBK2VMM?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for FS32R274VBK2VMM transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for FS32R274VBK2VMM?
FS32R274VBK2VMM orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your FS32R274VBK2VMM order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for FS32R274VBK2VMM?
For technical support, including FS32R274VBK2VMM datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your FS32R274VBK2VMM requirements.
6.How does Aetrix verify that FS32R274VBK2VMM is sourced from the original manufacturer or authorized distributors?
All FS32R274VBK2VMM products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that FS32R274VBK2VMM meets industry standards.
7.What is the process for return or replacement of FS32R274VBK2VMM?
All FS32R274VBK2VMM units undergo pre-shipment inspection (PSI). If there is an issue with FS32R274VBK2VMM, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The FS32R274VBK2VMM part is unused and in its original packaging.
Return procedure for FS32R274VBK2VMM:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
FS32R274VBK2VMM Tags

-
ATTINY4-TSHR
Microchip Technology

-
ATTINY10-TSHR
Microchip Technology

-
ATTINY10-TS8R
Microchip Technology

-
ATTINY202-SSNR
Microchip Technology

-
ATTINY202-SSFR
Microchip Technology

-
ATTINY402-SSNR
Microchip Technology

-
PIC16F15213T-I/MF
Microchip Technology

-
PIC16F15213-E/MF
Microchip Technology

-
PIC10F200T-I/OT
Microchip Technology

-
ATTINY412-SSNR
Microchip Technology

-
PIC10F202T-I/OT
Microchip Technology

-
ATTINY404-SSNR
Microchip Technology
Tech Hub
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…

