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NXP Semiconductors FS32V232CTN2VUB

Part No.:
FS32V232CTN2VUB
Manufacturer:
NXP Semiconductors
Category:
Microprocessors
Package:
621-FBGA, FCBGA
Datasheet:
AetrixFS32V232CTN2VUB.pdf
Description:
IC MPU FS32V23 1GHZ 621FCPBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:3,059

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Product details

Overview

FS32V232CTN2VUB from NXP Semiconductors is a dual-core ARM Cortex-A53 automotive vision processor operating at 1 GHz, featuring 256 KB L2 cache per cluster, 3 MB on-chip ECC-protected SRAM, and integrated APEX-2 image cognition accelerators. It supports LPDDR2/DDR3/DDR3L memory interfaces up to 1066 MT/s, dual MIPI-CSI2 camera inputs (4-lane, 1080p@30fps), and FD-CAN/FlexRay/Ethernet AVB for ADAS domain controller applications.

For engineers reviewing the FS32V232CTN2VUB datasheet, FS32V232CTN2VUB pinout, FS32V232CTN2VUB application, or FS32V232CTN2VUB equivalent, key selection considerations include its dual-A53 core configuration (vs. quad-core S32V234), 3 MB on-chip SRAM, -40°C to 125°C extended temperature grade, 621-pin FBGA (UB) package, and ISO 26262 ASIL-B ready safety architecture.

Technical Context

The FS32V232CTN2VUB implements a heterogeneous compute architecture with two ARM Cortex-A53 clusters (each with 2 cores and 256 KB L2 cache), one ARM Cortex-M4 core at 133 MHz, and dual APEX-2 CL image cognition processors-each configurable as single SIMD or dual MIMD engines with 32 × 16-bit computational units. It integrates a GC3000 GPU, 2D-ACE display controller, and H.264/JPEG video codecs.

Its safety-critical subsystem includes hardware CRC, eDMA with DMAMUX, Extended Resource Domain Controller (XRDC), Fault Containment Unit (FCU), and boot authentication via CSE with AES-128 and two-dimensional parity. Memory protection is enforced via MMU, MPU, and ECC/parity across all on-chip memories and DDR interfaces.

Key Specifications

Parameter Value and Actual Design Meaning
CPU Core Dual ARM Cortex-A53 @ 1 GHz (single cluster), 32 KB I-/D-cache per core, 256 KB shared L2 cache
Co-processor ARM Cortex-M4 @ 133 MHz with 32+32 KB TCM and ECC-protected memories
On-chip RAM 3 MB system SRAM with SEC-DED ECC, supporting safety-critical real-time buffers
Memory Interface 32-bit DRAM controller supporting LPDDR2/DDR3/DDR3L at 533 MHz (1066 MT/s) with SEC-DED-TED error correction
Video Input 2× MIPI-CSI2 (4-lane each), supporting dual 1080p@30fps camera streams with ISP preprocessing
Safety Certification ISO 26262 ASIL-B compliant; FMEDA report and safety manual available for functional safety integration
Package 621-ball Fine-Pitch BGA (FBGA), 17 mm × 17 mm, 0.8 mm pitch, RoHS-compliant
Operating Temp -40°C to +125°C junction temperature range, qualified for automotive powertrain and ADAS ECU deployment

Pinout & Package

FS32V232CTN2VUB is housed in a 621-ball FBGA (UB package) with 0.8 mm pitch and 17 mm × 17 mm body size. Ball assignment follows NXP's standardized S32V23x pinout layout, with dedicated voltage domains (VDD_LV_CORE, VDD_HV_IO, VDD_DDR_IO, etc.), differential clock pairs (DDR_CLK, MIPI_CLK), and functional groups including MIPI-CSI2 lanes, FD-CAN transceivers, FlexRay channels, and PCIe 2.0 interface.

Pin/Terminal Circuit Role Design Meaning
VDD_LV_CORE_SOC Core domain supply (1.0 V) Power rail for Cortex-A53/M4 cores, GPU, and interconnect; requires tight regulation ±50 mV
VDD_DDR_IO DDR I/O supply Configurable for DDR3 (1.5 V), DDR3L (1.35 V), or LPDDR2 (1.2 V); must be sequenced after VDD_LV_CORE
MIPI_CSI0_CLK_P/N Differential clock input LVDS-compatible reference clock for first MIPI-CSI2 receiver; enables 1.5 Gbps lane rate
CAN_FD0_TX/RX FD-CAN physical layer interface Supports CAN FD up to 5 Mbps; integrated transceiver biasing and fault protection
PCIE_REFCLK_P/N PCIe 2.0 reference clock 100 MHz differential input; required for root complex or endpoint operation with spread-spectrum support
BOOT_CFG[3:0] Boot configuration strap Defines boot source (QuadSPI, SD, USB, etc.) and security mode; sampled at POR reset

Key Features

Feature Design Value
Dual APEX-2 CL accelerators Each provides 64 × 16-bit CUs for real-time CNN inference and optical flow; supports INT8/FP16 precision
Heterogeneous safety monitor Hardware watchdog, fault containment unit (FCU), and redundant execution support for ASIL-B software partitioning
Secure boot & runtime protection CSE engine with 16 KB secure RAM/ROM, AES-128 CTR encryption, OCOTP fusing, and TrustZone isolation
Automotive-grade I/O GPIO with glitch filtering, configurable drive strength/slew rate, and LINFlex UART with LIN 2.1 compliance
High-bandwidth interconnect CCI-400 coherent interconnect with ECC-protected AXI bus, XRDC QoS enforcement, and FastDMA with CRC

Applications

Front Camera ADAS Rear Cross-Traffic Alert

Use Scenario: Real-time object detection and lane departure warning using forward-facing 1080p@30fps camera stream.

IC Role / Device Role / Timing Role: Primary vision SoC executing CNN-based perception stack on dual APEX-2 CL accelerators while managing sensor fusion via FD-CAN and Ethernet AVB.

Use Value: Sub-100 ms end-to-end latency enabled by on-die FastDMA, GC3000 GPU frame buffer compression, and 3 MB low-latency SRAM.

Use Scenario: Detecting moving vehicles during reverse parking using dual rear cameras with stereo depth estimation.

IC Role / Device Role / Timing Role: Dual MIPI-CSI2 receiver host with ISP preprocessing, APEX-2 CL stereo matching, and FlexRay communication to body control module.

Use Value: Deterministic timing via IEEE 1588 PTP Ethernet and hardware timestamping ensures synchronized multi-camera capture within ±1 µs.

Driver Monitoring System Central Domain Controller

Use Scenario: In-cabin monitoring of driver drowsiness and attention using IR camera feed and gaze tracking algorithms.

IC Role / Device Role / Timing Role: Low-power vision processor running lightweight CNN on Cortex-M4 + APEX-2 CL, with SAR ADC interfacing to thermal sensor array.

Use Value: 3 MB on-chip SRAM eliminates external memory access for critical real-time inference, reducing power and EMI.

Use Scenario: Consolidating ADAS, infotainment, and vehicle dynamics functions into single ECU with functional safety separation.

IC Role / Device Role / Timing Role: ASIL-B certified compute hub managing multiple virtual machines via hypervisor support, with XRDC-enforced resource partitioning.

Use Value: Hardware-enforced isolation between safety-critical (A53 cluster 0) and non-safety (A53 cluster 1, M4) domains prevents fault propagation.

Equivalent & Alternatives

The following parts are listed as comparable options for similar automotive vision processor applications.

Alternative Part Technical Difference Application Difference Selection Advice
FS32V234CTN4VUB Quad Cortex-A53 (1 GHz), 4 MB on-chip SRAM, dual APEX-2 CL, same UB package and pinout Higher compute throughput for multi-sensor fusion (≥4 cameras) and full-stack autonomous driving stacks Select when >2 camera inputs, H.264 encode, or GPU-accelerated rendering are required
MAX96712GTJ/V+T GMSL2 serializer with 12-bit ADC, no CPU/GPU/APEX; 40-pin TQFN, 3.3 V I/O only Camera bridge IC for point-to-point high-speed video transport-not a vision processor Use only as companion serializer for FS32V232CTN2VUB camera front-end, not as functional replacement

Compared with FS32V232CTN2VUB, FS32V234CTN4VUB delivers 2× CPU cores and 33% more on-chip SRAM for scalable ADAS development, while MAX96712GTJ/V+T serves strictly as a GMSL2 serializer-requiring FS32V232CTN2VUB for actual vision processing.

Availability

FS32V232CTN2VUB is available at Aetrix Electronics and suitable for automotive ADAS ECUs, driver monitoring systems, and central domain controllers requiring stable component supply across extended temperature ranges and long production lifecycles.

Supply support for FS32V232CTN2VUB includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor company headquartered in Eindhoven, Netherlands, specializing in secure connectivity solutions for automotive, industrial, and IoT markets.

The S32V232 is part of NXP's S32 Automotive Platform, designed specifically for vision-based ADAS and autonomous driving applications with integrated safety, security, and real-time processing capabilities.

FAQ

What is the core configuration of the FS32V232CTN2VUB?

The FS32V232CTN2VUB features a dual-core ARM Cortex-A53 configuration (two cores in a single cluster) running at 1 GHz, with 32 KB I-/D-cache per core and 256 KB shared L2 cache. It also integrates an ARM Cortex-M4 core at 133 MHz with 32+32 KB TCM. This asymmetric architecture enables concurrent real-time control and high-throughput vision processing within the FS32V232CTN2VUB device.

Does the FS32V232CTN2VUB support ISO 26262 functional safety certification?

Yes, the FS32V232CTN2VUB is designed to meet ISO 26262 ASIL-B requirements. It includes hardware safety mechanisms such as ECC/parity protection across all memories, fault containment units, hardware CRC, lockstep-capable peripherals, and a comprehensive FMEDA report. The FS32V232CTN2VUB safety manual and diagnostic coverage data are provided by NXP to support integration into ASIL-B compliant systems.

What camera interfaces does the FS32V232CTN2VUB support?

The FS32V232CTN2VUB supports two MIPI-CSI2 interfaces, each with four data lanes and one clock lane, capable of receiving 1080p@30fps video streams simultaneously. It also includes an integrated image signal processor (ISP) for exposure control and gamma correction. These interfaces are fully implemented in the FS32V232CTN2VUB silicon and validated for automotive camera use cases.

What is the package type and thermal rating of the FS32V232CTN2VUB?

The FS32V232CTN2VUB uses a 621-ball Fine-Pitch BGA (FBGA) package with 0.8 mm pitch and 17 mm × 17 mm footprint (UB designation). It is rated for operation from -40°C to +125°C junction temperature and qualified to AEC-Q100 Grade 0 standards, making it suitable for under-hood and ADAS ECU deployments where thermal robustness is critical for the FS32V232CTN2VUB.

How much on-chip memory does the FS32V232CTN2VUB include?

The FS32V232CTN2VUB integrates 3 MB of on-chip system RAM with SEC-DED ECC protection, plus additional dedicated memory resources: 64 KB ROM for boot code, 16 KB secure RAM in the CSE, and TCM for the Cortex-M4. This memory hierarchy is physically embedded in the FS32V232CTN2VUB die and does not rely on external DRAM for critical real-time tasks.

FS32V232CTN2VUB Specifications

Product attributes
Attribute value
Manufacturer:
NXP Semiconductors
Package/Case:
621-FBGA, FCBGA
Series:
FS32V23
Packaging:
Tray
Product Status:
Active
Core Processor:
ARM® Cortex®-A53
Number of Cores/Bus Width:
2 Core, 32/64-Bit
Speed:
1GHz
Co-Processors/DSP:
ARM® Cortex®-M4
RAM Controllers:
DDR3, DDR3L, LPDDR2
Graphics Acceleration:
No
Display & Interface Controllers:
APEX2-CL, DCU (2D-ACE), ISP, LCD, MIPICSI2, Video, VIU
Ethernet:
GbE
SATA:
-
USB:
-
Voltage - I/O:
1V, 1.8V, 3.3V
Operating Temperature:
-40°C ~ 125°C (TJ)
Grade:
-
Qualification:
-
Security Features:
AES, ARM TZ, Boot, CSE, OCOTP_CTRL, System JTAG
Mounting Type:
Surface Mount
Supplier Device Package:
621-FCPBGA (17x17)
Additional Interfaces:
I2C, SPI, PCI, UART

FS32V232CTN2VUB FAQ

1.How can I place an order for FS32V232CTN2VUB through Aetrix?

Please submit a Request for Quotation (RFQ) for FS32V232CTN2VUB on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for FS32V232CTN2VUB reliable?

The price and inventory of FS32V232CTN2VUB are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for FS32V232CTN2VUB is usually 5 days.

3.What payment methods are accepted for FS32V232CTN2VUB?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for FS32V232CTN2VUB transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for FS32V232CTN2VUB?

FS32V232CTN2VUB orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your FS32V232CTN2VUB order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for FS32V232CTN2VUB?

For technical support, including FS32V232CTN2VUB datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your FS32V232CTN2VUB requirements.

6.How does Aetrix verify that FS32V232CTN2VUB is sourced from the original manufacturer or authorized distributors?

All FS32V232CTN2VUB products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that FS32V232CTN2VUB meets industry standards.

7.What is the process for return or replacement of FS32V232CTN2VUB?

All FS32V232CTN2VUB units undergo pre-shipment inspection (PSI). If there is an issue with FS32V232CTN2VUB, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The FS32V232CTN2VUB part is unused and in its original packaging.

Return procedure for FS32V232CTN2VUB:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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