Send an Inquiry

To receive a quote for your project, please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Part Number*
Quantity*
Message
Submit Inventory List

Please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Upload My List
Message

Texas Instruments FX004

Part No.:
FX004
Manufacturer:
Texas Instruments
Category:
Special Purpose Regulators
Package:
20-WFQFN Exposed Pad
Datasheet:
AetrixFX004.pdf
Description:
FX004
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:2,032

Please send an inquiry. Send us your inquiry, and we will respond immediately.

Part Number
Quantity*
Price
Name*
Company
Email*
Comments

Product details

Overview

TPS51216 from Texas Instruments is a complete DDR2/DDR3/DDR3L memory power solution integrating a synchronous buck controller (VDDQ), 2-A sink/source tracking LDO (VTT), and buffered low-noise reference (VTTREF). It delivers 0.7–1.8 V VDDQ output with ±0.8% VREF accuracy, D-CAP™ fast transient response, and supports S3/S4/S5 power state control in a 20-pin QFN package.

For engineers reviewing the TPS51216 datasheet, TPS51216 pinout, TPS51216 application, or TPS51216 equivalent, key selection considerations include VDDQ/VTT tracking accuracy, MODE-configurable 300/400 kHz switching frequency, soft-off discharge behavior, RDS(on)-based OCL sensing, and thermal shutdown at 140°C - all critical for DDR termination stability and system-level power sequencing.

Technical Context

The TPS51216 employs D-CAP™ mode with adaptive on-time control, enabling pseudo-constant frequency operation without external compensation. Its VDDQ regulation uses REFIN feedback referenced to the internal 1.8-V VREF, while VTTREF tracks VDDQSNS/2 with ±0.8% accuracy across temperature.

Power state logic interprets S3/S5 inputs to drive three distinct modes: S0 (full ON), S3 (VTT high-Z), and S4/S5 (tracking or non-tracking discharge of VDDQ/VTT/VTTREF). MODE pin voltage selects switching frequency and discharge type via resistor-to-GND configuration.

Key Specifications

ParameterValue and Actual Design Meaning
VDDQ Output Range0.7 V to 1.8 V - programmable via REFIN resistor divider for DDR2/DDR3/DDR3L SSTL/HSTL termination compliance.
VREF Accuracy±0.8% over –40°C to 85°C - ensures stable VDDQ setpoint and precise VTTREF tracking.
Switching FrequencySelectable 300 kHz or 400 kHz - configurable via MODE pin resistor; balances efficiency, EMI, and inductor size.
VTT Sink/Source Current2 A peak - supports full DDR bus termination current demand during data transitions.
VTTREF Tracking Error±0.8% of VDDQSNS - enables accurate VTT regulation without external error amplifiers.
Thermal Shutdown140°C threshold with 10°C hysteresis - protects against sustained overload or poor PCB thermal design.
OCL SensingRDS(on)-based via PGND/SW - eliminates sense resistor, reducing BOM count and power loss.

Pinout & Package

TPS51216 is housed in a 20-pin, 3 mm × 3 mm QFN package with exposed thermal pad (PowerPAD™) tied to GND for enhanced thermal performance.

Pin/TerminalCircuit RoleDesign Meaning
VTTSNS (1)VTT output voltage sense inputRemote sensing point for VTT regulation; must connect to VTT capacitor positive node to reject trace IR drop.
VLDOIN (2)VTT LDO supply inputConnected to VDDQ output in standard design; powers VTT regulator and enables tracking discharge.
VTT (3)VTT LDO output2-A sink/source DDR termination rail; requires ≥10 μF ceramic capacitance at pin for stability.
VTTGND (4)VTT LDO ground returnDedicated low-noise ground path for VTT loop; separate from PGND to avoid switching noise coupling.
VTTREF (5)Buffered VTT reference outputTracks VDDQSNS/2 with ±0.8% accuracy; supplies 10 mA max; requires ≥0.22 μF local ceramic cap.
VREF (6)1.8-V precision reference output±0.8% accurate, 300 μA capable; feeds REFIN divider and serves as system reference source.
GND (7)Signal ground referenceAnalog ground for internal comparators, references, and logic; connects to system AGND plane.
REFIN (8)VDDQ feedback inputResistor-divider midpoint from VREF to GND; sets VDDQ output voltage (0.7–1.8 V range).
VDDQSNS (9)VDDQ output voltage senseDirect feedback for VDDQ regulation; also supplies VTTREF and enables tracking functionality.
PGND (10)Power ground for gate driversReturn path for DRVH/DRVL currents; used with SW for RDS(on) current sensing.
DRVL (11)Low-side MOSFET gate driverDrives synchronous rectifier; resistance 0.5–1.2 Ω (sink), supports high-efficiency CCM operation.
V5IN (12)5-V internal supply inputPowers control logic, gate drivers, and references; UVLO at 3.9 V nominal with 0.2 V hysteresis.
SW (13)Switch node connectionConnects to external high-side/low-side MOSFETs; used with PGND for RDS(on) current sensing.
DRVH (14)High-side MOSFET gate driverDrives upper FET; resistance 0.6–1.5 Ω (sink); bootstrap supplied via VBST capacitor to SW.
VBST (15)Bootstrap capacitor connectionConnects to SW through 0.1 μF ceramic capacitor; enables high-side gate drive above VIN.
S5 (16)System power state inputActive-high signal indicating S0/S3/S4/S5 state; initiates soft-start or discharge sequence on rising edge.
S3 (17)System suspend inputActive-low signal enabling S3 state (VTT high-Z); combined with S5 defines full power state machine.
TRIP (18)OCL threshold programmingCurrent-source pin (10 μA typ); resistor-to-GND sets OCL threshold as VTRIP/8.
MODE (19)Frequency/discharge mode select15-μA current source; resistor value selects 300/400 kHz and tracking/non-tracking discharge mode.
PGOOD (20)Open-drain power-good indicatorAsserts after 2.5 ms startup delay when VDDQ is within ±8% of target; enables downstream sequencing.

Key Features

FeatureDesign Value
D-CAP™ control architectureEliminates external compensation components; achieves fast load transient response using output ripple as feedback signal.
Auto-skip light-load modeReduces switching frequency under light loads to maintain >85% efficiency at 100 mA VDDQ output current.
Programmable soft-off dischargeSupports both tracking (fast, via VTT transistors) and non-tracking (slower, via internal MOSFETs) discharge in S4/S5 states.
Integrated protection suiteIncludes OCL (RDS(on)-based), OVP/UVP on VDDQ, UVLO on V5IN, and thermal shutdown - no external fault monitoring required.
Power state control logicHardware-based S3/S5 interpretation enables deterministic DDR power sequencing without firmware intervention.

Applications

DDR3L Notebook Memory SubsystemSSTL_15 Server DIMM Termination

Use Scenario: DDR3L memory interface in ultrabook platform requiring low quiescent current and fast resume from S3.

IC Role / Device Role / Timing Role: Provides VDDQ (1.35 V), VTT (0.675 V), and VTTREF (0.675 V) with S3 high-Z mode to minimize standby power.

Use Value: Enables <500 μA V5IN supply current in S3 state and 1.1-ms VDDQ soft-start for reliable boot timing.

Use Scenario: Dual-rank RDIMM termination in enterprise server with strict SSTL_15 voltage tolerance (±20 mV).

IC Role / Device Role / Timing Role: Delivers VTT with ±20 mV accuracy at 2 A sink/source and remote VTTSNS sensing to reject PCB trace resistance.

Use Value: Maintains VTT regulation within JEDEC SSTL_15 spec across temperature and load, eliminating need for external DAC calibration.

DDR2 Industrial PLC MemoryHSTL Termination for FPGA I/O Banks

Use Scenario: DDR2 memory interface in extended-temperature industrial PLC operating from –40°C to 85°C.

IC Role / Device Role / Timing Role: Supplies VDDQ (1.8 V), VTT (0.9 V), and VTTREF (0.9 V) with ±0.8% VREF accuracy and 140°C thermal shutdown.

Use Value: Guarantees stable DDR2 termination across full industrial temp range without derating or external trimming.

Use Scenario: HSTL Class I termination for high-speed FPGA I/O banks requiring matched VTT/VTTREF tracking.

IC Role / Device Role / Timing Role: Generates VTTREF from VDDQSNS/2 and regulates VTT to track it within ±40 mV at full 2-A load.

Use Value: Achieves <10 ps skew between VTT and VTTREF edges, meeting HSTL timing margin requirements for 333 MHz interfaces.

Equivalent & Alternatives

The following parts are listed as comparable options for similar DDR memory power supply applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
ISL6537IRZ-TDiscrete VDDQ controller + external VTT LDO; no integrated VTTREF buffer; requires external compensation.Lacks integrated tracking reference and soft-off discharge; needs additional ICs for full DDR solution.Choose when board space allows multi-chip implementation and design flexibility outweighs integration benefits.
RT8205AZSPSingle-channel buck controller only; no VTT/VTTREF functions; supports only VDDQ generation.Requires separate VTT LDO and reference IC; increases BOM count and layout complexity for DDR systems.Use only if VTT is implemented externally or not required; unsuitable for complete DDR2/3/3L power solutions.

Compared with ISL6537IRZ-T and RT8205AZSP, the TPS51216 reduces component count by integrating VDDQ control, VTT regulation, and VTTREF buffering into one QFN package - cutting PCB area by ~40% and eliminating inter-IC timing skew in DDR termination paths.

Availability

TPS51216 is available at Aetrix Electronics and suitable for DDR3L notebook designs, SSTL_15 server DIMMs, DDR2 industrial PLCs, HSTL FPGA interfaces, and embedded memory subsystems requiring stable component supply and long-term lifecycle support.

Supply support for TPS51216 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and power management technologies with over 90 years of innovation history.

The TPS51216 belongs to TI's DDR memory power management product line, designed specifically to consolidate VDDQ, VTT, and VTTREF functions into a single IC for JEDEC-compliant DDR2/DDR3/DDR3L systems.

FAQ

What is the recommended capacitor value for VTTREF on the TPS51216?

The TPS51216 datasheet specifies a minimum 0.22 μF ceramic capacitor connected close to the VTTREF pin for stable operation. This value ensures adequate phase margin in the VTTREF feedback loop and suppresses noise coupling from adjacent switching nodes. Larger values (e.g., 1 μF) may be used but do not improve regulation accuracy beyond the inherent ±0.8% tracking tolerance of the TPS51216.

How does the MODE pin configure discharge behavior in S4/S5 states for the TPS51216?

The MODE pin on the TPS51216 sources 15 μA to read a resistor-to-GND voltage at S5 assertion, selecting either tracking or non-tracking discharge mode. A 200-kΩ resistor configures 400 kHz switching and tracking discharge (fast VDDQ discharge via VTT transistors), while 47-kΩ selects non-tracking discharge (slower, internal-MOSFET-based). The TPS51216 implements this behavior automatically without firmware involvement.

Can the TPS51216 support DDR3L memory with 1.35-V VDDQ operation?

Yes, the TPS51216 supports DDR3L VDDQ operation at 1.35 V by configuring the REFIN resistor divider to set VDDQSNS = 1.35 V. Its 0.7–1.8 V output range, ±0.8% VREF accuracy, and D-CAP™ fast transient response meet JEDEC DDR3L specifications for voltage tolerance and load step recovery. The TPS51216 maintains VTT at 0.675 V and VTTREF at 0.675 V with tight tracking in this configuration.

What is the purpose of the VTTSNS pin on the TPS51216?

VTTSNS on the TPS51216 provides remote voltage sensing for the VTT LDO output. It must be connected directly to the positive terminal of the VTT output capacitor(s) via a dedicated trace, separate from the high-current VTT power path. This compensates for IR drop across PCB traces, ensuring VTT regulation accuracy remains within ±40 mV even with 2-A load current - critical for DDR signal integrity.

Does the TPS51216 require external compensation components for its D-CAP™ control loop?

No, the TPS51216 D-CAP™ control loop requires no external compensation components. Its architecture uses output capacitor ESR-induced ripple as the feedback signal, eliminating the need for Type II/III compensation networks. Stability is ensured by selecting output capacitors with sufficient ESR (typically ≥5 mΩ) and adhering to the f0 < fSW/3 guideline per Equation 1 in the TPS51216 datasheet.

FX004 Specifications

Product attributes
Attribute value
Manufacturer:
Texas Instruments
Series:
D-CAP™
Package/Case:
20-WFQFN Exposed Pad
Packaging:
Tape & Reel (TR)
Product Status:
Active
Applications:
Converter, DDR, DDR2, DDR3
Voltage - Input:
4.5V ~ 5.5V
Number of Outputs:
2
Voltage - Output:
0.7V ~ 1.8V
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
20-WQFN (3x3)

FX004 FAQ

1.How can I place an order for FX004 through Aetrix?

Please submit a Request for Quotation (RFQ) for FX004 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for FX004 reliable?

The price and inventory of FX004 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for FX004 is usually 5 days.

3.What payment methods are accepted for FX004?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for FX004 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for FX004?

FX004 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your FX004 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for FX004?

For technical support, including FX004 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your FX004 requirements.

6.How does Aetrix verify that FX004 is sourced from the original manufacturer or authorized distributors?

All FX004 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that FX004 meets industry standards.

7.What is the process for return or replacement of FX004?

All FX004 units undergo pre-shipment inspection (PSI). If there is an issue with FX004, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The FX004 part is unused and in its original packaging.

Return procedure for FX004:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

FX004 Tags

  • FX004
  • FX004 PDF
  • FX004 Datasheet
  • FX004 Specifications
  • FX004 Images
  • Texas Instruments
  • Texas Instruments FX004
  • Buy FX004
  • FX004 Price
  • FX004 Distributor
  • FX004 Supplier
  • FX004 Wholesale
Related Products
TPS51206DSQR
TPS51206DSQR

Texas Instruments

TPS51200DRCR
TPS51200DRCR

Texas Instruments

TPS51200DRCT
TPS51200DRCT

Texas Instruments

TPS62740DSSR
TPS62740DSSR

Texas Instruments

TPS51100DGQR
TPS51100DGQR

Texas Instruments

NCP51200MNTXG
NCP51200MNTXG

onsemi

NCP51400MNTXG
NCP51400MNTXG

onsemi

RT9026GSP
RT9026GSP

Richtek USA Inc.

LP2998MRX/NOPB
LP2998MRX/NOPB

Texas Instruments

TPS51200QDRCRQ1
TPS51200QDRCRQ1

Texas Instruments

DPA423GN-TL
DPA423GN-TL

Power Integrations

LM10011SD/NOPB
LM10011SD/NOPB

Texas Instruments

Tech Hub

Search

Search

PRODUCT

PRODUCT

PHONE

PHONE

USER

USER