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NXP Semiconductors G9S08EL32F1MTLR
- Part No.:
- G9S08EL32F1MTLR
- Manufacturer:
- NXP Semiconductors
- Category:
- Microcontrollers
- Package:
- -
- Datasheet:
-
G9S08EL32F1MTLR.pdf
- Description:
- S9S08EL32F1MS908EMICROCONTROLLER
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Product details
Overview
G9S08EL32F1MTLR from NXP Semiconductors (formerly Freescale) is an 8-bit HCS08 microcontroller with 32 KB on-chip FLASH, 2 KB RAM, and 1 KB EEPROM. It features a 40-MHz CPU, 16-channel 10-bit ADC with temperature sensor, dual analog comparators, LIN-capable SLIC, and RTC - deployed in automotive body control modules for LIN network node management.
For engineers reviewing the G9S08EL32F1MTLR datasheet, G9S08EL32F1MTLR pinout, G9S08EL32F1MTLR application, or G9S08EL32F1MTLR equivalent, key selection criteria include stop3-mode operation with ADC/ACMP active, LIN 2.0 protocol compliance via SLIC, and 28-TSSOP package compatibility with legacy HCS08 designs.
Technical Context
The G9S08EL32F1MTLR implements the S08CPUV3 core with HC08 instruction set extension (BGND), supporting up to 32 interrupt/reset sources and single-wire background debug. Its internal clock source (ICS) uses a frequency-locked loop (FLL) with precision-trimmed internal reference (±0.2% resolution, ±2% deviation over voltage/temperature) to generate bus frequencies from 2–20 MHz.
Peripherals include two independent TPM modules (TPM1: 4-channel, TPM2: 2-channel), a slave LIN interface controller (SLIC) compliant with LIN 2.0 and SAE J2602, and an ADC that operates in stop3 mode with automatic compare and internal bandgap reference - enabling low-power sensor monitoring without external components.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | HCS08 S08CPUV3 with BGND instruction and 40-MHz max operation |
| Memory | 32 KB FLASH (in-circuit programmable/erasable), 2 KB RAM, 1 KB EEPROM |
| ADC | 16-channel, 10-bit, 2.5 μs conversion time; includes temperature sensor and internal bandgap reference |
| SLIC | LIN 2.0 & SAE J2602 compliant; supports up to 120 kbps with full message buffering and auto checksum |
| RTC | 8-bit modulus counter with binary/decimal prescaler; runs on free-running 1-kHz on-chip oscillator for cyclic wake-up |
| Power Modes | Stop3 (lowest power with ADC/ACMP active), Stop2, Wait, and Run modes; real-time interrupt available in all states |
| I/O Pins | 22 general-purpose I/O pins with configurable pull-up, slew rate, drive strength, and 16 interrupt-capable inputs |
Pinout & Package
Package: 28-pin Thin Shrink Small Outline Package (28-TSSOP), 4.4 mm × 9.7 mm body, 0.65 mm pitch, lead-free and RoHS-compliant.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD, VDDAD, VDDA | Supply voltage inputs | Digital (VDD), analog (VDDAD), and ADC reference (VDDA) rails - require separate decoupling per datasheet layout guidelines |
| VSS, VSSAD, VSSA | Ground terminals | Digital (VSS), analog (VSSAD), and ADC reference (VSSA) grounds - must be connected with low-inductance paths |
| XTAL, EXTAL | Crystal oscillator connections | Supports 31.25 kHz–38.4 kHz or 1–16 MHz crystals/resonators; optional bypass for internal clock source |
| BKGD/MS | Background debug / mode select | Single-wire debug interface pin; also selects active background mode during reset |
| PTA0–PTA7 | Port A I/O | 8-bit bidirectional port with interrupt capability, pull-up, and slew-rate control; PTA0–PTA3 support ACMP/TPM functions |
| PTB0–PTB7 | Port B I/O | 8-bit bidirectional port; PTB0–PTB1 support SCI/SLIC; PTB2–PTB3 support SPI; PTB4–PTB7 support IIC |
| PTC0–PTC5 | Port C I/O | 6-bit bidirectional port; PTC0–PTC1 support TPM1; PTC2–PTC3 support TPM2; PTC4–PTC5 support ADC channel inputs |
Key Features
| Feature | Design Value |
|---|---|
| Stop3 Mode Operation | Enables ADC, ACMP, and RTC to remain active while CPU and most peripherals are halted - reduces current draw to <1.5 μA |
| SLIC Protocol Engine | Hardware-accelerated LIN frame handling including sync-break detection/generation, ID filtering, checksum calculation, and automatic response timing |
| In-Circuit EEPROM | Allows field firmware updates and parameter storage without halting program execution - erase abort prevents data corruption during power loss |
| Single-Wire Background Debug | Enables full in-circuit debugging (breakpoints, memory access, register inspection) using only BKGD/MS pin - no dedicated debug header required |
| Temperature Sensor Integration | On-die sensor calibrated to ±3°C accuracy across –40°C to +125°C - eliminates need for external thermal monitoring ICs in cabin control nodes |
Applications
| Automotive Door Module | Seat Position Controller |
|---|---|
Use Scenario: Centralized control of power windows, locks, mirrors, and interior lighting via LIN subnetwork. IC Role / Device Role / Timing Role: Primary LIN slave node managing local actuator drivers and sensor feedback; RTC provides timed window auto-reverse logic. Use Value: G9S08EL32F1MTLR's SLIC handles LIN protocol overhead autonomously, freeing CPU cycles for real-time motor control and reducing BOM cost vs. external LIN transceiver + MCU solutions. | Use Scenario: Motorized seat position adjustment with memory recall, tilt sensing, and collision detection. IC Role / Device Role / Timing Role: Sensor fusion hub aggregating potentiometer, accelerometer, and current-sense inputs; ADC runs continuously in stop3 mode during sleep. Use Value: G9S08EL32F1MTLR's 10-bit ADC with internal temperature sensor enables closed-loop thermal derating of seat motors without external analog front-end components. |
| Roof Console Node | Trunk Release Actuator |
Use Scenario: Integrated control of sunroof, ambient lighting, and map lights with soft-touch interface and LIN connectivity. IC Role / Device Role / Timing Role: LIN slave with multi-function I/O handling capacitive touch inputs, LED dimming PWM, and ambient light ADC sampling. Use Value: G9S08EL32F1MTLR's dual TPM modules generate independent 8-bit PWM outputs for RGB LED control while SLIC maintains network responsiveness - no external timer IC needed. | Use Scenario: Electromechanical trunk latch with anti-pinch detection, status reporting, and battery-conscious wake-on-LIN. IC Role / Device Role / Timing Role: Low-power LIN endpoint that remains in stop3 mode until commanded; ACMP monitors motor current for stall detection. Use Value: G9S08EL32F1MTLR's analog comparators operate in stop3 with internal reference, enabling instantaneous overcurrent response without waking CPU - extends vehicle battery life during extended park mode. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar 8-bit automotive microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MC9S08EL16F1MTLR | 16 KB FLASH, 1 KB RAM, same peripheral set and pinout as G9S08EL32F1MTLR | Suitable for simpler LIN nodes with smaller firmware footprint and fewer calibration parameters | Select when application code size stays under 14 KB and EEPROM usage is limited to <512 bytes |
| S9S08SG48F1MTJR | 48 KB FLASH, 4 KB RAM, enhanced I/O drive strength, same HCS08 core and SLIC module | Required for designs needing larger OTA update partitions or additional diagnostic logging buffers | Choose when future firmware expansion headroom or higher GPIO sink/source capability (>25 mA) is mandatory |
Compared with MC9S08EL16F1MTLR and S9S08SG48F1MTJR, the G9S08EL32F1MTLR delivers optimal balance of nonvolatile memory (32 KB FLASH + 1 KB EEPROM), low-power peripheral operation (stop3), and LIN 2.0 compliance in the 28-TSSOP footprint - making it the preferred choice for mid-tier automotive body electronics where cost, power, and protocol fidelity are jointly constrained.
Availability
G9S08EL32F1MTLR is available at Aetrix Electronics and suitable for automotive body control, LIN network node development, and industrial sensor interface applications requiring stable component supply and long-term lifecycle support.
Supply support for G9S08EL32F1MTLR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor company formed from the spin-off of Philips' semiconductor division, specializing in secure connectivity solutions for automotive, industrial, and IoT markets.
The G9S08EL32F1MTLR belongs to NXP's legacy HCS08 microcontroller family, designed specifically for cost-sensitive, low-power automotive body electronics requiring robust LIN communication and integrated analog peripherals.
FAQ
What is the maximum operating frequency of the G9S08EL32F1MTLR CPU core?
The G9S08EL32F1MTLR features an HCS08 CPU core rated for up to 40 MHz operation. This maximum frequency is achievable when powered within the specified voltage range (2.7–5.5 V) and using the internal clock source (ICS) in FLL-engaged mode with appropriate bus divider settings. The actual bus frequency depends on ICS configuration and may range from 2–20 MHz per datasheet specifications.
Does the G9S08EL32F1MTLR support LIN 2.0 protocol natively in hardware?
Yes, the G9S08EL32F1MTLR includes a dedicated Slave LIN Interface Controller (SLIC) module that implements LIN 2.0 and SAE J2602 protocol layers in hardware. This includes automatic break detection/generation, frame synchronization, checksum calculation/verification, and full message buffering - eliminating software protocol stack overhead and ensuring deterministic timing compliance.
Can the G9S08EL32F1MTLR ADC operate while the CPU is in stop mode?
Yes, the G9S08EL32F1MTLR ADC remains fully functional in stop3 mode. It supports continuous conversions, automatic compare, and temperature sensor readings without CPU intervention. This capability enables ultra-low-power sensor monitoring in automotive applications such as cabin temperature logging or battery voltage supervision during vehicle sleep states.
What debug interface does the G9S08EL32F1MTLR provide?
The G9S08EL32F1MTLR provides a single-wire background debug interface via the BKGD/MS pin. This interface supports in-circuit debugging including breakpoint setting (one active breakpoint plus two more in debug module), memory/register access, and real-time execution control - requiring no additional debug pins or external JTAG adapter.
Is the G9S08EL32F1MTLR pin-compatible with other members of the HCS08 EL-series?
Yes, the G9S08EL32F1MTLR in 28-TSSOP packaging shares identical pin assignment and electrical characteristics with MC9S08EL16F1MTLR and MC9S08SL16F1MTLR. This allows direct PCB-level substitution between these variants when memory requirements change, provided firmware is recompiled for the target device's FLASH/RAM map.
G9S08EL32F1MTLR Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- -
- Series:
- *
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- -
- Core Processor:
- -
- Core Size:
- -
- Speed:
- -
- Connectivity:
- -
- Peripherals:
- -
- Number of I/O:
- -
- Program Memory Size:
- -
- Program Memory Type:
- -
- EEPROM Size:
- -
- RAM Size:
- -
- Voltage - Supply (Vcc/Vdd):
- -
- Data Converters:
- -
- Oscillator Type:
- -
- Operating Temperature:
- -
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- -
- Supplier Device Package:
G9S08EL32F1MTLR FAQ
1.How can I place an order for G9S08EL32F1MTLR through Aetrix?
Please submit a Request for Quotation (RFQ) for G9S08EL32F1MTLR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for G9S08EL32F1MTLR reliable?
The price and inventory of G9S08EL32F1MTLR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for G9S08EL32F1MTLR is usually 5 days.
3.What payment methods are accepted for G9S08EL32F1MTLR?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for G9S08EL32F1MTLR transactions.
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4.How is shipping managed for G9S08EL32F1MTLR?
G9S08EL32F1MTLR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your G9S08EL32F1MTLR order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for G9S08EL32F1MTLR?
For technical support, including G9S08EL32F1MTLR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your G9S08EL32F1MTLR requirements.
6.How does Aetrix verify that G9S08EL32F1MTLR is sourced from the original manufacturer or authorized distributors?
All G9S08EL32F1MTLR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that G9S08EL32F1MTLR meets industry standards.
7.What is the process for return or replacement of G9S08EL32F1MTLR?
All G9S08EL32F1MTLR units undergo pre-shipment inspection (PSI). If there is an issue with G9S08EL32F1MTLR, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The G9S08EL32F1MTLR part is unused and in its original packaging.
Return procedure for G9S08EL32F1MTLR:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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