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NXP Semiconductors G9S08SG16E1MTLR
- Part No.:
- G9S08SG16E1MTLR
- Manufacturer:
- NXP Semiconductors
- Category:
- Microcontrollers
- Package:
- -
- Datasheet:
-
G9S08SG16E1MTLR.pdf
- Description:
- S9S08SG16E1MS908SMICROCONTROLLER
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Product details
Overview
G9S08SG16E1MTLR from NXP Semiconductors (formerly Freescale) is an 8-bit HCS08 microcontroller with 16 KB on-chip FLASH, 1 KB RAM, and integrated peripherals including 10-bit ADC, dual TPM timers, SCI, SPI, I²C, ACMP, and RTC. It operates at up to 40 MHz bus frequency, supports -40°C to +125°C temperature range, and targets embedded control in automotive body electronics and industrial sensors.
For engineers reviewing the G9S08SG16E1MTLR datasheet, G9S08SG16E1MTLR pinout, G9S08SG16E1MTLR application, or G9S08SG16E1MTLR equivalent, key selection criteria include its 16-TSSOP package, 22 GPIOs with configurable slew rate and pull-ups, stop3 mode power retention for RTC/ACMP/ADC, and single-wire background debug interface for in-circuit development.
Technical Context
The G9S08SG16E1MTLR implements the HCS08 CPU core with HC08 instruction set extension, BGND support, and 36 interrupt/reset sources. Its internal clock source (ICS) uses a frequency-locked loop (FLL) with precision-trimmed internal reference enabling ±1.5% frequency deviation over -40°C to +125°C.
Memory architecture includes 16 KB FLASH with block protection and security circuitry, 1 KB RAM, and dedicated registers for FLASH programming (FCMD, FSTAT), clock division (FCDIV), and protection (FPROT). Peripheral modules operate independently in stop3 mode - ADC, ACMP, RTC, and SCI wake-up capability are explicitly confirmed for this variant.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Core | HCS08 8-bit CPU with 40-MHz max bus frequency |
| FLASH Memory | 16 KB with erase/program over full voltage/temperature range; supports block protection |
| RAM | 1 KB on-chip RAM with security lock against unauthorized access |
| ADC | 16-channel, 10-bit resolution, 2.5 μs conversion time; includes internal bandgap reference and temperature sensor |
| Timers | Two 2-channel TPM modules (TPM1, TPM2); 8-bit MTIM; 8-bit RTC with 1 kHz low-power oscillator |
| I/O Pins | 22 general-purpose I/O pins with configurable pull-up, hysteresis, slew rate, and drive strength |
| Debug Interface | Single-wire background debug (BDM) with breakpoint support and on-chip ICE module |
Pinout & Package
Package: 16-pin Thin Shrink Small Outline Package (TSSOP), 4.4 mm × 5.0 mm body, 0.65 mm pitch, lead-free and RoHS compliant.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD | Supply voltage input | Primary power rail (2.7–5.5 V); powers core, FLASH, and all peripherals |
| VSS | Ground reference | Digital ground return path; must be low-impedance connection to system GND |
| RESET | Active-low reset input | Asynchronous reset assertion; internal pull-up ensures valid state during power-up |
| BKGD/MS | Background debug / Mode select | Single-wire BDM communication and mode configuration during startup |
| PTA0–PTA1 | Port A bidirectional I/O | GPIO with interrupt capability; PTA0 supports SCI RX, PTA1 supports SCI TX |
| PTB0–PTB5 | Port B bidirectional I/O | GPIO with optional ganged output (PTB[5:2]); PTB0–PTB1 support I²C SCL/SDA |
| PTC0–PTC3 | Port C bidirectional I/O | GPIO with ganged output option (PTC[3:0]); PTC0–PTC1 support SPI MOSI/MISO |
| XOSC/XFC | Crystal oscillator input/output | Supports 31.25 kHz–38.4 kHz or 1–16 MHz crystal/resonator; enables precise timing source |
Key Features
| Feature | Design Value |
|---|---|
| Stop3 Low-Power Mode | RTC, ACMP, ADC, and SCI retain operation with wake-up capability; current draw < 2.5 μA typical |
| Internal Clock Source (ICS) | FLL-based clock generation with ±1.5% accuracy over -40°C to +125°C; eliminates external crystal for cost-sensitive designs |
| Security Circuitry | FLASH and RAM protection via NVOPT and FPROT registers; prevents unauthorized firmware read-out or modification |
| Peripheral Integration | SCI (LIN-capable), SPI, I²C, dual TPM PWM, 10-bit ADC, analog comparator, and real-time counter in one die |
| Robust I/O Architecture | All 22 GPIOs support configurable pull-up, hysteresis, slew rate, and drive strength - critical for noisy automotive/industrial environments |
Applications
| Automotive Door Module | Industrial Temperature Sensor Node |
|---|---|
Use Scenario: Centralized control of window lift, mirror adjustment, and interior lighting in vehicle door assemblies. IC Role / Device Role / Timing Role: Main MCU executing motor control logic, LIN communication with body controller, and analog sensing of switch positions and ambient temperature. Use Value: Integrated LIN-capable SCI, 10-bit ADC with temperature sensor, and stop3 mode enable reliable operation with minimal external components and ultra-low standby current. | Use Scenario: Battery-powered wireless node measuring ambient temperature and reporting via SPI-connected transceiver. IC Role / Device Role / Timing Role: System controller managing ADC sampling, RTC-based wake intervals, and SPI data transfer to RF module. Use Value: On-chip 1 kHz RTC oscillator allows precise sleep/wake scheduling without external timing components; stop3 mode reduces average current to sub-μA levels. |
| Smart HVAC Actuator | Medical Diagnostic Handheld |
Use Scenario: Position feedback and motor drive control for damper actuators in commercial HVAC systems. IC Role / Device Role / Timing Role: Real-time PWM generation (TPM), analog position sensing (ADC), and fault detection (ACMP comparing reference voltages). Use Value: Dual TPM modules provide independent edge-aligned and center-aligned PWM outputs; ACMP with internal bandgap reference enables robust overvoltage/undervoltage monitoring. | Use Scenario: Portable diagnostic tool acquiring analog biosignals (ECG, pulse oximetry) and displaying results on local LCD. IC Role / Device Role / Timing Role: Signal acquisition MCU handling 10-bit ADC sampling, SPI-driven display interface, and battery voltage monitoring via LVD/LVW. Use Value: LVD/LVW features provide early warning of battery depletion; integrated security prevents firmware tampering in regulated medical devices. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar 8-bit microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MC9S08SG32E1MTLR | 32 KB FLASH, same 16-TSSOP package, identical peripheral set and pinout | Higher code density requirement; no hardware change needed for firmware scaling | Select when future firmware growth exceeds 16 KB or when design reuse across SG16/SG32 variants is prioritized |
| S9KEAZ128AMLH | Kinetis E-series ARM Cortex-M0+ core, 128 KB FLASH, 16 KB RAM, 48 MHz, different architecture and toolchain | Migration path requiring software re-architecture; supports more complex algorithms and connectivity stacks | Select when long-term roadmap requires ARM compatibility, higher performance, or advanced peripherals like USB or CAN |
Compared with MC9S08SG32E1MTLR, G9S08SG16E1MTLR offers identical footprint and peripheral functionality at reduced FLASH capacity - ideal for cost-optimized implementations. Versus S9KEAZ128AMLH, it provides proven HCS08 toolchain continuity and lower power in stop3 mode but lacks ARM ecosystem scalability.
Availability
G9S08SG16E1MTLR is available at Aetrix Electronics and suitable for automotive body electronics, industrial sensor nodes, HVAC actuators, and portable medical diagnostics requiring stable component supply and long lifecycle support.
Supply support for G9S08SG16E1MTLR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader focused on secure connectivity solutions for automotive, industrial, IoT, mobile, and communication infrastructure markets.
The G9S08SG16E1MTLR belongs to the legacy HCS08 microcontroller family designed for cost-sensitive, low-power embedded control in harsh environments - emphasizing robust I/O, integrated analog peripherals, and debug-friendly development.
FAQ
What is the maximum operating frequency of the G9S08SG16E1MTLR?
The G9S08SG16E1MTLR supports a maximum bus frequency of 40 MHz using its internal clock source (ICS) with FLL. At temperatures above 125°C, the maximum bus frequency is reduced to 36 MHz to maintain timing integrity under thermal stress. This specification is guaranteed across the full industrial temperature range (-40°C to +125°C) and validated per Freescale's Rev. 8 MC9S08SG32 datasheet.
Does the G9S08SG16E1MTLR support LIN communication?
Yes, the G9S08SG16E1MTLR supports LIN communication through its SCI module, which includes dedicated hardware for LIN master extended break generation and LIN slave extended break detection. This enables direct integration into automotive body networks without external LIN transceivers for basic node functionality. The G9S08SG16E1MTLR's SCI meets ISO 17987-4 physical layer requirements when paired with a compliant transceiver.
What power modes does the G9S08SG16E1MTLR support, and which peripherals remain active in stop3 mode?
The G9S08SG16E1MTLR supports run, wait, stop2, and stop3 modes. In stop3 mode - its lowest-power operational state - the RTC, ACMP, ADC, and SCI modules remain fully functional and can generate wake-up events. This allows continuous timekeeping, analog monitoring, and serial communication readiness while drawing less than 2.5 μA typical current. The G9S08SG16E1MTLR's stop3 behavior is documented in Chapter 3.6.1 of the MC9S08SG32 Rev. 8 datasheet.
Is the G9S08SG16E1MTLR pin-compatible with other members of the MC9S08SGxx family?
Yes, the G9S08SG16E1MTLR in 16-TSSOP packaging is pin-compatible with the MC9S08SG32E1MTLR and MC9S08SG8E1MTLR within the same package variant. All share identical pin assignments, electrical characteristics, and peripheral mapping. This allows hardware reuse across memory-size variants - the G9S08SG16E1MTLR can directly replace the SG32 in footprint-constrained designs where 16 KB FLASH suffices.
What debug interface does the G9S08SG16E1MTLR provide, and what tools are supported?
The G9S08SG16E1MTLR features a single-wire background debug (BDM) interface compliant with Freescale's BDM protocol. It supports CodeWarrior Development Studio, P&E Micro's Multilink/Cyclone tools, and OpenOCD-based debuggers. The interface enables full in-circuit debugging including breakpoints, register inspection, and FLASH programming. This debug capability is integral to the G9S08SG16E1MTLR silicon and requires only one dedicated pin (BKGD/MS) plus VDD and VSS connections.
G9S08SG16E1MTLR Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- -
- Series:
- *
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
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- Core Processor:
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- Core Size:
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- Speed:
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- Connectivity:
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- Program Memory Size:
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- Program Memory Type:
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- EEPROM Size:
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- RAM Size:
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- Voltage - Supply (Vcc/Vdd):
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- Data Converters:
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G9S08SG16E1MTLR FAQ
1.How can I place an order for G9S08SG16E1MTLR through Aetrix?
Please submit a Request for Quotation (RFQ) for G9S08SG16E1MTLR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for G9S08SG16E1MTLR reliable?
The price and inventory of G9S08SG16E1MTLR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for G9S08SG16E1MTLR is usually 5 days.
3.What payment methods are accepted for G9S08SG16E1MTLR?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for G9S08SG16E1MTLR transactions.
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4.How is shipping managed for G9S08SG16E1MTLR?
G9S08SG16E1MTLR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your G9S08SG16E1MTLR order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for G9S08SG16E1MTLR?
For technical support, including G9S08SG16E1MTLR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your G9S08SG16E1MTLR requirements.
6.How does Aetrix verify that G9S08SG16E1MTLR is sourced from the original manufacturer or authorized distributors?
All G9S08SG16E1MTLR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that G9S08SG16E1MTLR meets industry standards.
7.What is the process for return or replacement of G9S08SG16E1MTLR?
All G9S08SG16E1MTLR units undergo pre-shipment inspection (PSI). If there is an issue with G9S08SG16E1MTLR, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The G9S08SG16E1MTLR part is unused and in its original packaging.
Return procedure for G9S08SG16E1MTLR:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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