Diodes Incorporated GDZ16LP3-7
- Part No.:
- GDZ16LP3-7
- Manufacturer:
- Diodes Incorporated
- Category:
- Single Zener Diodes
- Package:
- 0201 (0603 Metric)
- Datasheet:
-
GDZ16LP3-7.pdf
- Description:
- DIODE ZENER 16V 250MW 2DFN
- Quantity:
- Payment:

- Shipping:

Inventory:6,749
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Product details
Overview
GDZ16LP3-7 from Diodes Incorporated is a 16V ±5% ultra-small leadless Zener diode in X3-DFN0603-2 package (0.6 × 0.3 mm, 0.3 mm profile), rated for 250 mW power dissipation at +25°C, with 11.2 µA max reverse leakage at 11.2 V, and qualified to AEC-Q101 for automotive reliability. It provides precision voltage reference and overvoltage clamping in space-constrained battery-powered sensor nodes.
For engineers reviewing the GDZ16LP3-7 datasheet, GDZ16LP3-7 pinout, GDZ16LP3-7 application, or GDZ16LP3-7 equivalent, key selection criteria include zener voltage tolerance (±5%), low leakage (<0.1 µA typical at VR = 11.2 V), thermal resistance (500 °C/W), AEC-Q101 qualification, and compatibility with automated SMT assembly on FR-4 PCBs.
Technical Context
This device operates as a two-terminal voltage-reference diode, conducting in reverse breakdown at nominal 16.0 V with tight 15.2–16.8 V range. Its low-profile DFN package enables high-density routing and minimizes parasitic inductance in fast transient suppression paths.
Thermal derating follows a linear curve from 250 mW at 25°C to zero at 150°C ambient, with junction-to-ambient thermal resistance fixed at 500 °C/W under standard JEDEC test conditions on FR-4 board with recommended pad layout.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Zener Voltage (VZ) | 16.0 V nominal, 15.2–16.8 V min/max - defines precise clamping threshold for 12–15 V rail protection |
| Test Current (IZT) | 5 mA - standard bias point for guaranteed VZ specification and stable regulation |
| Max Reverse Leakage (IR) | 0.1 µA at VR = 11.2 V - ensures minimal standby current drain in battery-critical circuits |
| Power Dissipation (PD) | 250 mW at TA = +25°C - sets maximum continuous clamping energy before thermal runaway |
| Thermal Resistance (RθJA) | 500 °C/W - determines junction temperature rise per mW dissipated on standard FR-4 layout |
| Operating Temperature | −55°C to +150°C - supports under-hood automotive and industrial edge-sensing environments |
| Package | X3-DFN0603-2 (0.6 × 0.3 × 0.3 mm) - enables 0201 footprint replacement with improved thermal performance |
Pinout & Package
Package: X3-DFN0603-2 - ultra-compact, leadless, halogen-free molded plastic case with matte tin-plated copper leadframe; cathode identified by bar marking on top surface.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| Pin 1 | Cathode | Connected to higher-potential node during reverse-bias operation; marked by cathode bar on top view |
| Pin 2 | Anode | Connected to lower-potential node (e.g., ground or return path); unmarked side of package |
Key Features
| Feature | Design Value |
|---|---|
| Ultra-small footprint | 0.6 × 0.3 mm body - reduces PCB area by >40% vs. SOD-323, enabling dense sensor module layouts |
| AEC-Q101 qualification | Qualified for automotive-grade reliability - meets stress testing for temperature cycling, HTRB, and ESD per AEC standard |
| Low leakage current | <0.1 µA at 70% VZ - extends battery life in always-on IoT endpoints beyond 10 years |
| Lead-free & green construction | Halogen- and antimony-free molding compound (Br+Cl <1500 ppm, Sb <1000 ppm) - satisfies strict environmental compliance mandates |
| Automated assembly compatible | Matte tin finish, J-STD-020 Level 1 moisture sensitivity - eliminates pre-bake and supports high-speed pick-and-place |
Applications
| Automotive Cabin Sensors | Industrial Wireless Transmitters |
|---|---|
Use Scenario: Voltage clamping on LIN bus transceiver supply rail exposed to load-dump transients. IC Role / Device Role / Timing Role: Zener diode providing overvoltage protection at 16 V threshold to prevent IC damage. Use Value: Withstands 12 V system surges up to 27 V while maintaining <0.1 µA leakage to preserve sleep-mode current budget. | Use Scenario: Precision reference for ADC in battery-powered vibration sensor node. IC Role / Device Role / Timing Role: Stable 16 V Zener reference source for ratiometric analog front-end scaling. Use Value: ±5% VZ tolerance and −55°C to +150°C operation ensure consistent measurement accuracy across harsh factory environments. |
| Medical Wearable Monitors | Smart Meter Power Management |
Use Scenario: Reverse-polarity protection and voltage limiting for coin-cell powered ECG front-end. IC Role / Device Role / Timing Role: Bidirectional clamping element safeguarding op-amps and microcontroller I/O pins. Use Value: 0.3 mm profile allows placement adjacent to ASIC die without interfering with flex PCB bending radius. | Use Scenario: Overvoltage clamp on auxiliary 12 V supply feeding real-time clock and backup RAM. IC Role / Device Role / Timing Role: Fail-safe shunt regulator preventing data corruption during AC line surges. Use Value: AEC-Q101 qualification ensures long-term stability in utility-grade meter deployments exceeding 15-year field life. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar Zener diode applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| BZX384-B16,115 (Nexperia) | Same 16 V nominal, SOD-323 package (1.7 × 1.3 mm), 300 mW PD, higher leakage (5 µA @ 12.8 V) | Larger footprint limits high-density designs; higher leakage unsuitable for multi-year battery operation | Select when higher power rating is required and board space permits larger package |
| MMSZ4687T1G (onsemi) | 16 V nominal, SOD-123 package (3.7 × 1.6 mm), 500 mW PD, 100 nA leakage @ 12.8 V | Substantially larger size and different thermal profile; not AEC-Q101 qualified | Choose for cost-sensitive industrial applications where automotive qualification is unnecessary |
Compared with BZX384-B16 and MMSZ4687T1G, GDZ16LP3-7 uniquely combines AEC-Q101 qualification, ultra-miniature X3-DFN0603-2 packaging, and sub-0.1 µA leakage-making it optimal for next-generation automotive sensors and compact battery-powered systems where space, reliability, and quiescent current are simultaneously constrained.
Availability
GDZ16LP3-7 is available at Aetrix Electronics and suitable for automotive cabin sensors, industrial wireless transmitters, medical wearable monitors, and smart meter power management requiring stable component supply across extended product lifecycles.
Supply support for GDZ16LP3-7 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Diodes Incorporated is a global manufacturer of discrete semiconductors and analog ICs, headquartered in Plano, Texas, serving automotive, industrial, computing, and consumer markets with high-reliability components.
GDZ16LP3-7 belongs to the GDZ-LP3 series of ultra-miniature Zener diodes engineered specifically for space-constrained, high-reliability applications demanding AEC-Q101 qualification and ultra-low leakage in battery-operated systems.
FAQ
What is the maximum reverse voltage (VR) at which GDZ16LP3-7 guarantees ≤0.1 µA leakage?
GDZ16LP3-7 guarantees ≤0.1 µA reverse leakage current at VR = 11.2 V, which equals 70% of its nominal 16 V zener voltage. This value is specified in the Electrical Characteristics table under "Reverse Current (IR) @ VR" for GDZ16LP3, and is measured at TA = +25°C with short-duration pulse testing to minimize self-heating effects.
Is GDZ16LP3-7 suitable for reflow soldering per JEDEC J-STD-020?
Yes. GDZ16LP3-7 has Moisture Sensitivity Level 1 per J-STD-020, meaning it may be stored indefinitely at ≤30°C/60% RH and requires no baking prior to standard Pb-free reflow (peak 260°C). Its matte tin finish and X3-DFN0603-2 package are fully compatible with industry-standard SMT processes including SPI, placement, and convection reflow.
How does the thermal resistance of GDZ16LP3-7 affect its usable power at 85°C ambient?
With RθJA = 500 °C/W and TJ(max) = +150°C, the maximum allowable power at TA = +85°C is calculated as (150 − 85) / 500 = 0.13 W (130 mW). This derating is confirmed by Figure 1 in DS35065 Rev. 19, showing linear reduction from 250 mW at 25°C to 0 W at 150°C ambient.
Does GDZ16LP3-7 have polarity marking, and how is it oriented on the PCB?
Yes. GDZ16LP3-7 uses a cathode bar marking on the top surface of the X3-DFN0603-2 package to identify Pin 1 (cathode). When mounted with the bar aligned toward the positive rail, the anode (Pin 2) connects to ground or lower potential-ensuring correct reverse-bias operation during voltage regulation or clamping.
GDZ16LP3-7 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Diodes Incorporated
- Series:
- -
- Package/Case:
- 0201 (0603 Metric)
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Voltage - Zener (Nom) (Vz):
- 16 V
- Tolerance:
- ±5%
- Power - Max:
- 250 mW
- Impedance (Max) (Zzt):
- -
- Current - Reverse Leakage @ Vr:
- 100 nA @ 11.2 V
- Voltage - Forward (Vf) (Max) @ If:
- -
- Operating Temperature:
- -55°C ~ 150°C (TJ)
- Grade:
- Automotive
- Qualification:
- AEC-Q101
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- X3-DFN0603-2
GDZ16LP3-7 FAQ
1.How can I place an order for GDZ16LP3-7 through Aetrix?
Please submit a Request for Quotation (RFQ) for GDZ16LP3-7 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for GDZ16LP3-7 reliable?
The price and inventory of GDZ16LP3-7 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for GDZ16LP3-7 is usually 5 days.
3.What payment methods are accepted for GDZ16LP3-7?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for GDZ16LP3-7 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for GDZ16LP3-7?
GDZ16LP3-7 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your GDZ16LP3-7 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for GDZ16LP3-7?
For technical support, including GDZ16LP3-7 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your GDZ16LP3-7 requirements.
6.How does Aetrix verify that GDZ16LP3-7 is sourced from the original manufacturer or authorized distributors?
All GDZ16LP3-7 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that GDZ16LP3-7 meets industry standards.
7.What is the process for return or replacement of GDZ16LP3-7?
All GDZ16LP3-7 units undergo pre-shipment inspection (PSI). If there is an issue with GDZ16LP3-7, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The GDZ16LP3-7 part is unused and in its original packaging.
Return procedure for GDZ16LP3-7:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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