Diodes Incorporated GDZ24LP3-7

Overview

GDZ24LP3-7 from Diodes Incorporated is a 24 V ±5% Zener diode in an ultra-small X3-DFN0603-2 (0.6 × 0.3 mm) leadless package, rated for 250 mW power dissipation at +25°C, with reverse leakage ≤0.1 µA at 16.8 V and thermal resistance of 500 °C/W - used for precision voltage reference and overvoltage protection in space-constrained portable electronics.

For engineers reviewing the GDZ24LP3-7 datasheet, GDZ24LP3-7 pinout, GDZ24LP3-7 application, or GDZ24LP3-7 equivalent, key selection criteria include its 24 V nominal Zener voltage with ±5% tolerance, ultra-low 0.1 µA IR at VR = 16.8 V, 0.3 mm profile, AEC-Q101 qualification, and compatibility with high-speed automated SMT assembly on FR-4 PCBs.

Technical Context

This Zener diode operates in reverse breakdown to maintain stable voltage regulation across load and line variations. Its low leakage current (≤0.1 µA at 16.8 V) and tight 24.0 V ±5% (22.8–25.2 V) tolerance enable accurate clamping in battery-powered sensor nodes and low-power microcontroller I/O protection circuits.

The X3-DFN0603-2 package features matte tin-plated copper leads, J-STD-020 Level 1 moisture sensitivity, and UL 94V-0 flammability rating. Thermal derating begins above +25°C per Figure 1, reaching zero power at +150°C ambient.

Key Specifications

Pinout & Package

Package: X3-DFN0603-2 - ultra-compact, leadless, surface-mount plastic package with exposed thermal pad not electrically connected; case material is halogen/antimony-free "Green" molding compound (UL 94V-0).

Key Features

Applications

Availability

GDZ24LP3-7 is available at Aetrix Electronics and suitable for industrial sensor nodes, automotive body control modules, wearable health monitors, and smart home motion sensors requiring stable component supply with full traceability and long-term lifecycle support.

Supply support for GDZ24LP3-7 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Diodes Incorporated is a global manufacturer of discrete semiconductors and analog ICs, headquartered in Plano, Texas, with design centers across Asia and manufacturing in China, Taiwan, and Malaysia.

This device belongs to the GDZ-LP3 series of ultra-miniature Zener diodes engineered specifically for high-density portable and automotive electronics where board space, thermal performance, and regulatory compliance are critical.

FAQ

What is the maximum reverse voltage before breakdown for GDZ24LP3-7?

The GDZ24LP3-7 exhibits sharp Zener breakdown at 24.0 V nominal (22.8–25.2 V range) when tested at I_ZT = 5 mA. Below this, reverse current remains ≤0.1 µA up to 16.8 V - meaning it holds off voltages well below nominal Zener voltage without significant conduction.

Can GDZ24LP3-7 be used in place of a 24 V through-hole Zener diode?

No - GDZ24LP3-7 is a surface-mount DFN device with no leads or axial/radial form factor. It replaces other 0201-compatible Zeners only. Its 0.6 × 0.3 mm footprint and cathode-bar marking require specific PCB layout and reflow profile adjustments versus through-hole parts.

Is GDZ24LP3-7 suitable for bidirectional ESD protection?

No - it is a unidirectional Zener diode configured for reverse-bias clamping only. For bidirectional ESD protection, a dedicated TVS diode such as the D3V3M1U2SOT-7A (±3.3 V) or similar dual-rail device is required.

Does GDZ24LP3-7 require a heatsink in typical operation?

No - with 250 mW max power dissipation and 500 °C/W R_θJA, junction temperature rise is ≤125°C above ambient at full power. In typical 1–5 mA regulation use, self-heating is negligible; no external heatsink is needed, but thermal pad layout per Diodes' guidelines is essential.