Diodes Incorporated GDZ3V0LP3-7

Overview

GDZ3V0LP3-7 from Diodes Incorporated is a 3.0 V ±5% Zener diode in an ultra-small X3-DFN0603-2 (0.6 × 0.3 mm) leadless package, rated for 250 mW power dissipation at +25°C, with 10 µA max reverse leakage at 1.0 V and AEC-Q101 qualification for automotive-grade reliability. It serves as a precision voltage reference or overvoltage clamp in space-constrained, low-power circuits such as battery management ICs and sensor signal conditioning stages.

For engineers reviewing the GDZ3V0LP3-7 datasheet, GDZ3V0LP3-7 pinout, GDZ3V0LP3-7 application, or GDZ3V0LP3-7 equivalent, key selection criteria include its 3.0 V nominal Zener voltage with ±5% tolerance, 5 mA test current, 10 µA max IR at VR = 1.0 V, ultra-low 0.3 mm profile, and AEC-Q101 qualification-critical for automotive body electronics and portable industrial sensors.

Technical Context

This Zener diode operates in reverse breakdown to maintain stable voltage regulation across varying load currents and temperatures. Its thermal resistance of 500°C/W and -55°C to +150°C operating range enable reliable performance in thermally demanding PCB layouts without heatsinking.

The device uses a planar silicon junction with cathode-bar marking on the top surface, and its DFN0603-2 footprint supports high-density automated placement. Reverse leakage remains below 10 µA up to 1.0 V, ensuring minimal standby current draw in always-on battery-powered systems.

Key Specifications

Pinout & Package

Package: X3-DFN0603-2 - ultra-compact, leadless, surface-mount plastic package with matte tin-plated copper leadframe; cathode identified by bar marking on top surface.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar Zener diode applications.

Compared with BZX384-B3V0 and MMSZ3V0T1G, GDZ3V0LP3-7 delivers the smallest possible footprint (0.18 mm²), lowest profile (0.3 mm), and automotive qualification in one package-making it uniquely suited for next-generation compact, mobile, and automotive electronics where board area and height are constrained.

Availability

GDZ3V0LP3-7 is available at Aetrix Electronics and suitable for automotive interior electronics, portable medical sensors, and industrial wireless nodes requiring stable component supply with guaranteed long-term availability and AEC-Q101 compliance.

Supply support for GDZ3V0LP3-7 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Diodes Incorporated is a global manufacturer of discrete semiconductors and analog ICs, headquartered in Plano, Texas, with design, manufacturing, and sales operations across Asia, Europe, and North America.

GDZ3V0LP3-7 belongs to the GDZ-LP3 series of ultra-miniature Zener diodes engineered specifically for space-constrained, low-power, and automotive-qualified applications-emphasizing miniaturization, leakage control, and reliability in harsh environments.

FAQ

What is the maximum reverse voltage this diode can withstand before breakdown?

The GDZ3V0LP3-7 has a nominal Zener voltage of 3.0 V with a tolerance of ±5%, meaning breakdown occurs between 2.85 V and 3.15 V at 5 mA test current. It is not rated for sustained operation above its specified V_Z range; applying >3.15 V continuously exceeds its designed regulation window and risks thermal runaway if power dissipation limits are exceeded.

Is GDZ3V0LP3-7 suitable for ESD protection in USB-C data lines?

No-GDZ3V0LP3-7 is optimized for DC voltage regulation and low-leakage clamping, not high-speed transient suppression. Its capacitance is unspecified in the datasheet, and its response time is unsuitable for USB-C ESD events (IEC 61000-4-2). Use dedicated low-capacitance TVS diodes like D3V3M1U2UP for such interfaces.

How does the 0.3 mm package height impact thermal performance on a 2-layer PCB?

At 0.3 mm height, the X3-DFN0603-2 package minimizes thermal path length to the PCB, but its small copper area limits heat spreading. With R_θJA = 500°C/W on FR-4, junction temperature rises sharply above 100 mW; derating to 125 mW at +85°C ambient is recommended for continuous operation without thermal vias or enhanced copper pours.

Can GDZ3V0LP3-7 replace GDZ3V3LP3-7 in a 3.3 V reference circuit?

No-GDZ3V0LP3-7 has a nominal 3.0 V Zener voltage (2.85–3.15 V), while GDZ3V3LP3-7 is 3.3 V (3.14–3.47 V). Substituting them introduces a systematic 0.3 V error, exceeding typical ADC reference tolerances. The devices share identical packaging and ratings, but their voltage specifications are not interchangeable without circuit recalibration.