Diodes Incorporated GDZ3V3LP3-7
- Part No.:
- GDZ3V3LP3-7
- Manufacturer:
- Diodes Incorporated
- Category:
- Single Zener Diodes
- Package:
- 0201 (0603 Metric)
- Datasheet:
-
GDZ3V3LP3-7.pdf
- Description:
- DIODE ZENER 3.3V 250MW 2DFN
- Quantity:
- Payment:

- Shipping:

Inventory:20,208
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Product details
Overview
GDZ3V3LP3-7 from Diodes Incorporated is a 3.3 V, ±5% tolerance Zener diode in an ultra-small X3-DFN0603-2 (0.6 × 0.3 mm) leadless package, rated for 250 mW power dissipation at +25°C, with 10 µA max reverse leakage at 1.0 V and AEC-Q101 qualified for automotive reliability. It serves as a precision voltage reference or overvoltage clamp in space-constrained, low-power sensor interfaces.
For engineers reviewing the GDZ3V3LP3-7 datasheet, GDZ3V3LP3-7 pinout, GDZ3V3LP3-7 application, or GDZ3V3LP3-7 equivalent, key selection criteria include its 3.3 V nominal Zener voltage, 5 mA test current, 0.3 mm profile, cathode-bar marking, and suitability for battery-powered wearables and automotive body electronics requiring high thermal stability and RoHS/Green compliance.
Technical Context
This Zener diode operates in reverse breakdown to maintain stable voltage regulation across load and line variations. Its low 10 µA max IR at VR = 1.0 V enables minimal standby current draw in always-on circuits, while the 500 °C/W junction-to-ambient thermal resistance reflects performance on standard FR-4 PCBs with recommended pad layout.
The device exhibits a negative temperature coefficient near 3.3 V (≈ –0.05 %/°C per Figure 7), making it suitable for moderate-precision biasing where drift compensation is managed externally. Its 0.2 mg mass and halogen/antimony-free molding compound support lightweight, environmentally compliant portable designs.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Zener Voltage (VZ) | 3.3 V nominal, 3.14–3.47 V range at IZT = 5 mA - defines clamping threshold in protection circuits |
| Power Dissipation | 250 mW at TA = +25°C - limits continuous energy handling without heatsinking |
| Reverse Leakage (IR) | ≤10 µA at VR = 1.0 V - ensures low quiescent current in battery-critical applications |
| Package | X3-DFN0603-2 (0.6 × 0.3 × 0.3 mm) - enables 0201-footprint compatibility with automated SMT assembly |
| Thermal Resistance (RθJA) | 500 °C/W - determines junction temperature rise under ambient conditions on standard PCB |
| Operating Temperature | –55°C to +150°C - supports under-hood automotive and industrial edge-node deployments |
| AEC-Q101 Qualified | Yes - validated for high-reliability automotive electronics per stress-test requirements |
Pinout & Package
Package: X3-DFN0603-2 - ultra-compact, leadless, surface-mount plastic package with matte tin-plated copper leadframe; cathode identified by bar marking on top surface.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| Pin 1 | Cathode | Connected to regulated output node; polarity-sensitive for correct Zener conduction |
| Pin 2 | Anode | Connected to ground or lower-potential rail; completes reverse-bias path during regulation |
Key Features
| Feature | Design Value |
|---|---|
| Ultra-small footprint | 0.6 × 0.3 mm outline matches 0201 SMT placement equipment, reducing board area by >30% vs. SOD-323 |
| Low-profile height | 0.3 mm max thickness enables use in slim consumer wearables and stacked PCB assemblies |
| AEC-Q101 qualification | Validated for automotive-grade reliability including HTOL, TC, and ESD testing per JEDEC standards |
| Green / Halogen-free | Meets <900 ppm Br, <900 ppm Cl (<1500 ppm total), <1000 ppm Sb - satisfies Tier-1 automotive material declarations |
| Low leakage current | ≤10 µA at 1.0 V reverse bias - extends battery life in always-on IoT sensors and real-time clocks |
Applications
| Automotive Body Control Module | Portable Medical Sensor Node |
|---|---|
Use Scenario: Voltage reference for LIN bus transceiver biasing and microcontroller ADC reference in door module ECUs. IC Role / Device Role / Timing Role: Zener clamp providing stable 3.3 V rail for analog front-end conditioning and CAN/LIN interface ICs. Use Value: Enables consistent signal integrity across temperature (-40°C to +125°C) with AEC-Q101 assurance and no derating below 100°C. |
Use Scenario: Overvoltage protection for lithium coin-cell powered pulse oximeter analog front-end. IC Role / Device Role / Timing Role: Reverse-biased shunt regulator limiting input to 3.3 V during ESD events or battery insertion surge. Use Value: 10 µA max leakage preserves multi-year battery life; 0.3 mm height fits within 3.2 mm-thick wearable enclosure. |
| Industrial Wireless Sensor Transmitter | Smart Home Motion Detector |
Use Scenario: Precision biasing of MEMS accelerometer and RF SoC supply rails in battery-operated vibration monitors. IC Role / Device Role / Timing Role: Low-drift voltage reference stabilizing internal LDO feedback network and RF PA bias points. Use Value: Tight 3.14–3.47 V tolerance ensures accurate sensor calibration across production batches and temperature gradients. |
Use Scenario: Clamp protection for PIR sensor signal chain powered by alkaline AA cells in wall-mounted occupancy detectors. IC Role / Device Role / Timing Role: Shunt regulator absorbing transient spikes from relay switching or EMI coupling on long PCB traces. Use Value: 250 mW rating handles 100 ms surges up to 30 V without failure; DFN0603 footprint allows dual-device redundancy in tight layouts. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar Zener diode applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| BZX384-B3V3,115 (Nexperia) | Same 3.3 V nominal, but SOD-323 package (1.7 × 1.3 mm); 200 mW rating; 90 nA leakage at 1 V | Larger footprint limits high-density layouts; lower leakage benefits ultra-low-power RTC backup | Select when lowest possible IR outweighs size constraints and SMT reflow compatibility is verified |
| MMSZ3V3T1G (ON Semiconductor) | SOD-123 package (2.7 × 1.4 mm); 500 mW rating; 5 µA leakage at 1 V; ±5% tolerance | Higher power handling suits higher-current clamping; larger size eases manual rework but increases parasitic inductance | Prefer for prototyping or cost-sensitive industrial controls where board space is less constrained |
Compared with BZX384-B3V3 and MMSZ3V3T1G, GDZ3V3LP3-7 delivers the smallest footprint and automotive qualification, trading slightly higher leakage for superior space efficiency and AEC-Q101 compliance-critical for next-gen compact automotive and medical edge nodes.
Availability
GDZ3V3LP3-7 is available at Aetrix Electronics and suitable for automotive body electronics, portable medical sensors, industrial wireless transmitters, and smart home motion detectors requiring stable component supply and long-term lifecycle support.
Supply support for GDZ3V3LP3-7 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Diodes Incorporated is a global manufacturer of discrete semiconductors and analog ICs, headquartered in Plano, Texas, with design and manufacturing operations across Asia and the US.
GDZ3V3LP3-7 belongs to the GDZ-LP3 ultra-miniature Zener series, engineered specifically for space-constrained, high-reliability applications in automotive, industrial, and portable electronics where low profile and AEC-Q101 compliance are mandatory.
FAQ
What is the maximum reverse voltage this Zener can withstand before breakdown?
The GDZ3V3LP3-7 has a nominal Zener voltage of 3.3 V with a guaranteed range of 3.14 V to 3.47 V at 5 mA test current. Breakdown occurs within this band; operation above 3.47 V risks exceeding power limits unless current is strictly limited by external series resistance. Absolute maximum reverse voltage is not specified beyond the Zener range.
Is GDZ3V3LP3-7 suitable for use in high-frequency signal paths?
No-it is not optimized for high-frequency applications. Its typical capacitance is ~1.5 pF at 1 MHz (inferred from GDZ5V1LP3 curve in Figure 6), but no frequency response or impedance data is provided. Use only for DC/low-frequency voltage reference or transient clamping, not RF bypass or AC signal conditioning.
How does the thermal derating curve affect practical power handling?
Per Figure 1, power dissipation must be linearly reduced from 250 mW at +25°C to zero at +150°C. At +85°C ambient, allowable power drops to ~175 mW. Designers must calculate worst-case junction temperature using RθJA = 500 °C/W and ensure TJ stays ≤ +150°C under full load.
Can GDZ3V3LP3-7 replace GDZ3V3LP3 without modification?
Yes-the "-7" suffix denotes tape-and-reel packaging (10,000 units per reel); electrically and mechanically identical to GDZ3V3LP3. The base part number refers to the same die and package; only packaging differs. No layout or schematic changes are needed when switching between GDZ3V3LP3 and GDZ3V3LP3-7.
GDZ3V3LP3-7 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Diodes Incorporated
- Series:
- -
- Package/Case:
- 0201 (0603 Metric)
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Voltage - Zener (Nom) (Vz):
- 3.3 V
- Tolerance:
- ±5%
- Power - Max:
- 250 mW
- Impedance (Max) (Zzt):
- -
- Current - Reverse Leakage @ Vr:
- 10 µA @ 1 V
- Voltage - Forward (Vf) (Max) @ If:
- -
- Operating Temperature:
- -55°C ~ 150°C (TJ)
- Grade:
- Automotive
- Qualification:
- AEC-Q101
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- X3-DFN0603-2
GDZ3V3LP3-7 FAQ
1.How can I place an order for GDZ3V3LP3-7 through Aetrix?
Please submit a Request for Quotation (RFQ) for GDZ3V3LP3-7 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for GDZ3V3LP3-7 reliable?
The price and inventory of GDZ3V3LP3-7 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for GDZ3V3LP3-7 is usually 5 days.
3.What payment methods are accepted for GDZ3V3LP3-7?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for GDZ3V3LP3-7 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for GDZ3V3LP3-7?
GDZ3V3LP3-7 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your GDZ3V3LP3-7 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for GDZ3V3LP3-7?
For technical support, including GDZ3V3LP3-7 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your GDZ3V3LP3-7 requirements.
6.How does Aetrix verify that GDZ3V3LP3-7 is sourced from the original manufacturer or authorized distributors?
All GDZ3V3LP3-7 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that GDZ3V3LP3-7 meets industry standards.
7.What is the process for return or replacement of GDZ3V3LP3-7?
All GDZ3V3LP3-7 units undergo pre-shipment inspection (PSI). If there is an issue with GDZ3V3LP3-7, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The GDZ3V3LP3-7 part is unused and in its original packaging.
Return procedure for GDZ3V3LP3-7:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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