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Diodes Incorporated GDZ3V6LP3-7
- Part No.:
- GDZ3V6LP3-7
- Manufacturer:
- Diodes Incorporated
- Category:
- Single Zener Diodes
- Package:
- 0201 (0603 Metric)
- Datasheet:
-
GDZ3V6LP3-7.pdf
- Description:
- DIODE ZENER 3.6V 250MW 2DFN
- Quantity:
- Payment:
- Shipping:
Inventory:29,375
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Product details
Overview
GDZ3V6LP3-7 from Diodes Incorporated is a 3.6 V ±5.3% (3.41–3.79 V) ultra-small leadless Zener diode in X3-DFN0603-2 package, rated for 250 mW power dissipation at +25°C, with reverse leakage ≤10 µA at 1.0 V and thermal resistance of 500 °C/W - used for precision voltage reference and overvoltage protection in space-constrained portable electronics.
For engineers reviewing the GDZ3V6LP3-7 datasheet, GDZ3V6LP3-7 pinout, GDZ3V6LP3-7 application, or GDZ3V6LP3-7 equivalent, key selection criteria include zener voltage tolerance, low leakage at low reverse bias, AEC-Q101 qualification, ultra-low profile (0.3 mm), and compatibility with high-speed automated SMT assembly on FR-4 PCBs.
Technical Context
This device operates as a two-terminal silicon junction diode optimized for stable reverse-biased breakdown regulation. Its zener voltage is specified at 5 mA test current (IZT), with typical temperature coefficient near –0.05 %/°C for 3.6 V grade and reverse capacitance of ~2.5 pF at 1 MHz.
The X3-DFN0603-2 package features a cathode bar marking, matte tin-plated copper leadframe, and UL 94V-0 mold compound - enabling reliable solder joint formation and moisture resistance per J-STD-020 Level 1, critical for battery-powered wearables and IoT sensors.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Zener Voltage (VZ) | 3.6 V nominal, 3.41–3.79 V range at IZT = 5 mA - ensures tight regulation in low-voltage rail clamping |
| Power Dissipation (PD) | 250 mW at TA = +25°C - supports continuous operation in thermally limited PCB layouts |
| Reverse Leakage (IR) | ≤10 µA at VR = 1.0 V - minimizes standby current drain in battery-critical applications |
| Thermal Resistance (RθJA) | 500 °C/W - defines safe operating area under ambient conditions without heatsinking |
| Operating Temperature | –55°C to +150°C - validated for automotive cabin and industrial edge node environments |
| Package Size | 0.6 mm × 0.3 mm × 0.3 mm - fits 0201-class footprints with 0.355 mm pitch center-to-center |
Pinout & Package
Package: X3-DFN0603-2 - ultra-compact, leadless, surface-mount plastic package with exposed thermal pad not present; molded compound meets UL 94V-0; terminals are matte tin over copper leadframe; cathode identified by bar marking on top surface.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| Pin 1 | Cathode | Connected to higher-potential side in reverse-bias configuration; marked by cathode bar on top view |
| Pin 2 | Anode | Connected to lower-potential side; forms regulated output node when cathode tied to supply rail |
Key Features
| Feature | Design Value |
|---|---|
| AEC-Q101 qualified | Validated for automotive-grade reliability including temperature cycling, HAST, and mechanical shock |
| Ultra-low profile (0.3 mm) | Enables stacking under thin-film shields and integration into slim medical patches or smart tags |
| Halogen- and antimony-free "Green" construction | Meets RoHS 3 (2015/863/EU) with Br+Cl <1500 ppm and Sb <1000 ppm - compliant for EU and China RoHS markets |
| Low leakage at 1.0 V reverse bias | Max 10 µA enables use as voltage supervisor input in always-on wake-up circuits |
Applications
| Wearable Health Sensor | Automotive Cabin Controller |
|---|---|
Use Scenario: Regulating reference voltage for analog front-end of ECG/PPG sensor ASIC in compact wristband. IC Role / Device Role / Timing Role: Zener diode providing stable 3.6 V reference for ADC biasing and op-amp offset trimming. Use Value: Low 10 µA leakage preserves battery life over multi-week wearable runtime; 0.3 mm height avoids interference with flex circuit bending radius. | Use Scenario: Overvoltage clamp on LIN bus transceiver supply line in seat control module. IC Role / Device Role / Timing Role: Transient voltage suppressor limiting supply rail to 3.6 V during load dump events. Use Value: AEC-Q101 qualification ensures survival across –40°C to +125°C ambient; 250 mW rating handles short-duration surges without derating. |
| Smart Home Motion Detector | Industrial Wireless Node |
Use Scenario: Voltage reference for PIR signal conditioning circuit powered by coin cell. IC Role / Device Role / Timing Role: Precision shunt regulator stabilizing LDO feedback node against battery voltage sag. Use Value: Tight 5.3% VZ tolerance maintains consistent detection threshold across battery discharge curve; 0.2 mg weight reduces PCB mass loading. | Use Scenario: ESD protection and bias reference for sub-GHz RF transceiver power management IC. IC Role / Device Role / Timing Role: Dual-function device serving as both 3.6 V reference and I/O line clamp. Use Value: 0.6 × 0.3 mm footprint frees board space for antenna matching network; RoHS 3 compliance satisfies industrial CE marking requirements. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar Zener diode applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| BZX384-B3V6,115 (Nexperia) | Same 3.6 V nominal, but SOD-323 package (1.7 × 1.25 × 0.95 mm); 300 mW PD; 90 nA IR @ 1 V | Larger footprint limits use in ultra-dense layouts; lower leakage suits ultra-low-power sleep modes | Select when lower leakage outweighs size constraints and SOD-323 reflow compatibility is confirmed |
| MMSZ4685T1G (onsemi) | SOD-123 package (3.5 × 1.8 × 1.3 mm); 3.6 V nominal; 500 mW PD; 1 µA IR @ 1 V | Higher power rating allows higher surge handling; larger size precludes use in 0201-replacement designs | Choose for cost-sensitive industrial controls where board space is available and 500 mW margin is required |
Compared with BZX384-B3V6 and MMSZ4685T1G, GDZ3V6LP3-7 uniquely balances ultra-miniaturization (0.6 × 0.3 mm), AEC-Q101 qualification, and 10 µA leakage - making it optimal for next-gen wearables and automotive proximity sensors where volume and reliability are co-constrained.
Availability
GDZ3V6LP3-7 is available at Aetrix Electronics and suitable for wearable health sensors, automotive cabin controllers, and industrial wireless nodes requiring stable component supply with guaranteed long-term availability and traceable sourcing.
Supply support for GDZ3V6LP3-7 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Diodes Incorporated is a global manufacturer of discrete semiconductors and analog ICs, headquartered in Plano, Texas, with design and manufacturing operations across Asia and the Americas.
This part belongs to the GDZ-LP3 series of ultra-miniature Zener diodes, engineered specifically for high-density portable electronics and automotive modules where footprint, profile, and AEC-Q101 reliability are mandatory.
FAQ
What is the maximum reverse voltage this diode can withstand before breakdown?
The GDZ3V6LP3-7 is specified for zener breakdown at 3.6 V ±5.3% when tested at 5 mA. Its absolute maximum reverse voltage is not defined separately - operation above 3.79 V at IZT risks exceeding power rating unless current is strictly limited. The device is not rated for avalanche or transient suppression beyond its zener specification.
Is GDZ3V6LP3-7 suitable for use in high-frequency signal paths?
No - with typical junction capacitance of 2.5 pF at 1 MHz and no specified Cj vs. VR curve above 1 V, this diode is not characterized for RF coupling or high-speed switching. It is intended solely for DC voltage reference and low-frequency overvoltage clamping, not signal path applications.
How does the X3-DFN0603-2 package affect solder reflow profile requirements?
The X3-DFN0603-2 package requires standard SnAgCu reflow per J-STD-020 Level 1, with peak temperature ≤260°C and time above liquidus 60–90 seconds. Its small thermal mass demands precise thermal profiling to avoid tombstoning; recommended pad layout matches Diodes' published X3-DFN0603-2 footprint with 0.23 mm solder mask opening.
Does this part have an exposed thermal pad for enhanced heat dissipation?
No - the X3-DFN0603-2 package has no exposed thermal pad. Heat dissipation relies entirely on conduction through the two copper terminals and PCB copper pour. Thermal resistance is specified at 500 °C/W on FR-4 with minimum recommended pad layout; adding thermal vias beneath terminals is not supported by the package structure.
GDZ3V6LP3-7 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Diodes Incorporated
- Series:
- -
- Package/Case:
- 0201 (0603 Metric)
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Voltage - Zener (Nom) (Vz):
- 3.6 V
- Tolerance:
- ±5%
- Power - Max:
- 250 mW
- Impedance (Max) (Zzt):
- -
- Current - Reverse Leakage @ Vr:
- 10 µA @ 1 V
- Voltage - Forward (Vf) (Max) @ If:
- -
- Operating Temperature:
- -55°C ~ 150°C (TJ)
- Grade:
- Automotive
- Qualification:
- AEC-Q101
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- X3-DFN0603-2
GDZ3V6LP3-7 FAQ
1.How can I place an order for GDZ3V6LP3-7 through Aetrix?
Please submit a Request for Quotation (RFQ) for GDZ3V6LP3-7 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for GDZ3V6LP3-7 reliable?
The price and inventory of GDZ3V6LP3-7 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for GDZ3V6LP3-7 is usually 5 days.
3.What payment methods are accepted for GDZ3V6LP3-7?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for GDZ3V6LP3-7 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for GDZ3V6LP3-7?
GDZ3V6LP3-7 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your GDZ3V6LP3-7 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for GDZ3V6LP3-7?
For technical support, including GDZ3V6LP3-7 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your GDZ3V6LP3-7 requirements.
6.How does Aetrix verify that GDZ3V6LP3-7 is sourced from the original manufacturer or authorized distributors?
All GDZ3V6LP3-7 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that GDZ3V6LP3-7 meets industry standards.
7.What is the process for return or replacement of GDZ3V6LP3-7?
All GDZ3V6LP3-7 units undergo pre-shipment inspection (PSI). If there is an issue with GDZ3V6LP3-7, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The GDZ3V6LP3-7 part is unused and in its original packaging.
Return procedure for GDZ3V6LP3-7:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
GDZ3V6LP3-7 Tags
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MMBZ5240B-7-F
Diodes Incorporated
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BZT52C5V6T-7
Diodes Incorporated
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MMSZ5231B-7-F
Diodes Incorporated
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BZT52C15-7-F
Diodes Incorporated
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BZX84C3V3LT1G
onsemi
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MMSZ5245BS-7-F
Diodes Incorporated
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MMSZ4682T1G
onsemi
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BZT52C15S-7-F
Diodes Incorporated
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MM5Z5V1ST1G
onsemi
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SMAJ4744A-TP
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BZT52C3V6LP-7
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