Diodes Incorporated GDZ6V0LP3-7
- Part No.:
- GDZ6V0LP3-7
- Manufacturer:
- Diodes Incorporated
- Category:
- Single Zener Diodes
- Package:
- 0201 (0603 Metric)
- Datasheet:
-
GDZ6V0LP3-7.pdf
- Description:
- DIODE ZENER 6V 250MW 2DFN
- Quantity:
- Payment:

- Shipping:

Inventory:4,628
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Product details
Overview
GDZ6V0LP3-7 from Diodes Incorporated is a 6.0 V ±5% Zener diode in an ultra-small X3-DFN0603-2 (0.6 × 0.3 mm) leadless package, rated for 250 mW power dissipation at +25°C, with 1.0 µA max reverse leakage at 2.8 V and thermal resistance of 500 °C/W - used for precision voltage reference and overvoltage protection in space-constrained portable electronics.
For engineers reviewing the GDZ6V0LP3-7 datasheet, GDZ6V0LP3-7 pinout, GDZ6V0LP3-7 application, or GDZ6V0LP3-7 equivalent, key selection criteria include its AEC-Q101 qualification, ultra-low profile (0.3 mm), cathode-bar marking, matte tin terminals, and tight 5.676–6.324 V zener voltage range at 5 mA test current.
Technical Context
This Zener diode operates in reverse breakdown to maintain stable voltage regulation across varying load and temperature conditions. Its low leakage (≤1.0 µA at VR = 2.8 V) and tight tolerance (±5%) support battery-powered systems requiring long-term stability and minimal quiescent current draw.
The X3-DFN0603-2 package enables high-density PCB layouts and automated placement, while its 500 °C/W junction-to-ambient thermal resistance requires careful thermal pad design per Diodes' recommended layout to sustain full 250 mW rating.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Zener Voltage (VZ) | 6.0 V nominal, 5.676–6.324 V range at IZT = 5 mA - ensures predictable clamping in low-power regulation circuits. |
| Power Dissipation (PD) | 250 mW at TA = +25°C - defines maximum continuous steady-state power handling on standard FR-4 board. |
| Reverse Leakage (IR) | ≤1.0 µA at VR = 2.8 V - enables use in microamp-level standby circuits without compromising battery life. |
| Thermal Resistance (RθJA) | 500 °C/W - requires thermal pad design per Diodes' Suggested Pad Layout to avoid derating above ambient +25°C. |
| Operating Temperature | −55°C to +150°C - supports automotive under-hood and industrial environments per AEC-Q101 qualification. |
| Package | X3-DFN0603-2 (0.6 × 0.3 × 0.3 mm) - ultra-miniature, leadless, surface-mount footprint for high-density portable designs. |
Pinout & Package
Package: X3-DFN0603-2 - ultra-small, leadless, two-terminal plastic molded case with matte tin-plated copper leadframe; cathode identified by bar marking on top surface.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 (Cathode) | Zener cathode terminal | Connected to higher potential side during reverse-bias operation; marked with cathode bar on top view. |
| 2 (Anode) | Zener anode terminal | Connected to lower potential side; forms the reference node when regulating voltage across load. |
Key Features
| Feature | Design Value |
|---|---|
| AEC-Q101 qualified reliability | Validated for automotive-grade stress testing including HTGB, HTRB, and temperature cycling - suitable for under-dash modules. |
| Ultra-low profile (0.3 mm height) | Enables stacking or thin-profile enclosures where vertical clearance is constrained to ≤0.35 mm. |
| Halogen- and antimony-free "Green" construction | Meets <900 ppm Br, <900 ppm Cl (<1500 ppm total Br+Cl), <1000 ppm Sb - compliant with global environmental directives. |
| Low moisture sensitivity (MSL Level 1) | No floor-life limitation before reflow; eliminates baking requirement and simplifies SMT line logistics. |
Applications
| Wearable Health Monitor | Automotive Cabin Sensor Node |
|---|---|
|
Use Scenario: Voltage reference for ADC in compact wearable ECG patch with coin-cell battery. IC Role / Device Role / Timing Role: Zener diode provides stable 6.0 V reference to analog front-end, replacing larger TL431-based solutions. Use Value: 1.0 µA leakage preserves >12-month battery life; 0.6 × 0.3 mm footprint saves >70% board area vs. SOD-323. |
Use Scenario: Overvoltage clamp on LIN bus interface in seat position sensor module. IC Role / Device Role / Timing Role: Protects transceiver input against load-dump transients up to 27 V. Use Value: AEC-Q101 qualification ensures reliability across −40°C to +125°C ambient; 250 mW rating handles short-duration spikes. |
| Industrial IoT Edge Node | USB-C Power Negotiation Circuit |
|
Use Scenario: Reference voltage for voltage supervisor IC monitoring 5 V rail in wireless sensor gateway. IC Role / Device Role / Timing Role: Supplies precise threshold to reset generator during brown-out detection. Use Value: ±5% VZ tolerance ensures accurate trip point; MSL Level 1 allows direct placement without dry-pack handling. |
Use Scenario: VCONN voltage stabilization in USB-C cable plug electronics. IC Role / Device Role / Timing Role: Regulates 5 V supply to EMCA logic circuitry within reversible connector. Use Value: Ultra-low profile (0.3 mm) fits inside 8.4 mm wide USB-C plug housing; matte tin terminations ensure robust solder joint integrity. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar Zener diode applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| BZX384-B6V2,115 (Nexperia) | 6.2 V nominal, SOD-323 package (1.7 × 1.3 mm), 200 mW rating, 100 nA leakage at 4.9 V | Larger footprint and lower power rating; better leakage but looser voltage tolerance (±5% vs. ±5% - same spec, but tighter actual spread in GDZ series) | Select when legacy SOD-323 layout exists and 0.2 V higher VZ is acceptable for margin-based clamping. |
| MMSZ4685T1G (onsemi) | 6.2 V nominal, SOD-123 package (3.7 × 1.6 mm), 500 mW rating, 1.0 µA leakage at 4.9 V | Higher power capability but 6× larger area; not AEC-Q101 qualified; requires thermal relief on pads | Choose only if system demands >250 mW clamping energy and board space permits larger device. |
Compared with BZX384-B6V2 and MMSZ4685T1G, GDZ6V0LP3-7 delivers superior board-area efficiency and automotive qualification in a 0.6 × 0.3 mm footprint, while maintaining identical leakage and tighter production VZ distribution - ideal for next-gen miniaturized, high-reliability designs.
Availability
GDZ6V0LP3-7 is available at Aetrix Electronics and suitable for wearable health monitors, automotive cabin sensor nodes, and industrial IoT edge nodes requiring stable component supply with guaranteed long-term continuity.
Supply support for GDZ6V0LP3-7 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Diodes Incorporated is a global manufacturer of discrete semiconductors and analog ICs, specializing in high-efficiency power management, signal integrity, and protection devices for consumer, computing, industrial, and automotive markets.
GDZ6V0LP3-7 belongs to the GDZ-LP3 ultra-miniature Zener diode product line, engineered specifically for space-constrained, battery-sensitive applications demanding AEC-Q101 reliability and green material compliance.
FAQ
What is the maximum reverse voltage (VR) that GDZ6V0LP3-7 can withstand before breakdown?
The GDZ6V0LP3-7 exhibits controlled reverse breakdown at its specified zener voltage of 6.0 V (5.676–6.324 V) when tested at IZT = 5 mA. Below this threshold - specifically at VR = 2.8 V - reverse leakage remains ≤1.0 µA. It is not rated for sustained operation above VZ; exceeding it risks thermal runaway without proper current limiting.
Is GDZ6V0LP3-7 compatible with lead-free reflow profiles?
Yes - GDZ6V0LP3-7 uses matte tin over copper leadframe terminations and is fully RoHS 3 compliant (2015/863/EU). It supports standard JEDEC J-STD-020 Class 3A peak reflow temperatures up to 260°C, with MSL Level 1 rating meaning no dry-pack or baking is required prior to assembly.
How does the X3-DFN0603-2 package affect thermal performance compared to SOD-323?
The X3-DFN0603-2 package has higher thermal resistance (500 °C/W) than typical SOD-323 diodes (~300–400 °C/W) due to its minimal copper content and lack of leads. To achieve rated 250 mW dissipation, Diodes Incorporated mandates use of their recommended thermal pad layout on FR-4 PCB - omitting this reduces safe operating power by >40% at +70°C ambient.
Can GDZ6V0LP3-7 be used as a substitute for GDZ6V2LP3-7 in existing designs?
GDZ6V0LP3-7 (6.0 V) and GDZ6V2LP3-7 (6.2 V) differ by 0.2 V nominal zener voltage and have distinct marking codes (KW vs. KO). Substitution is only acceptable if the 3.3% VZ shift falls within system tolerance - e.g., in non-critical biasing - and if the application does not rely on the tighter 6.2 V specification for ADC reference accuracy or overvoltage threshold setting.
GDZ6V0LP3-7 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Diodes Incorporated
- Series:
- -
- Package/Case:
- 0201 (0603 Metric)
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Voltage - Zener (Nom) (Vz):
- 6 V
- Tolerance:
- ±5%
- Power - Max:
- 250 mW
- Impedance (Max) (Zzt):
- -
- Current - Reverse Leakage @ Vr:
- 1 µA @ 2.8 V
- Voltage - Forward (Vf) (Max) @ If:
- -
- Operating Temperature:
- -55°C ~ 150°C
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- X3-DFN0603-2
GDZ6V0LP3-7 FAQ
1.How can I place an order for GDZ6V0LP3-7 through Aetrix?
Please submit a Request for Quotation (RFQ) for GDZ6V0LP3-7 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for GDZ6V0LP3-7 reliable?
The price and inventory of GDZ6V0LP3-7 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for GDZ6V0LP3-7 is usually 5 days.
3.What payment methods are accepted for GDZ6V0LP3-7?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for GDZ6V0LP3-7 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for GDZ6V0LP3-7?
GDZ6V0LP3-7 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your GDZ6V0LP3-7 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for GDZ6V0LP3-7?
For technical support, including GDZ6V0LP3-7 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your GDZ6V0LP3-7 requirements.
6.How does Aetrix verify that GDZ6V0LP3-7 is sourced from the original manufacturer or authorized distributors?
All GDZ6V0LP3-7 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that GDZ6V0LP3-7 meets industry standards.
7.What is the process for return or replacement of GDZ6V0LP3-7?
All GDZ6V0LP3-7 units undergo pre-shipment inspection (PSI). If there is an issue with GDZ6V0LP3-7, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The GDZ6V0LP3-7 part is unused and in its original packaging.
Return procedure for GDZ6V0LP3-7:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
GDZ6V0LP3-7 Tags

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Diodes Incorporated

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