Diodes Incorporated GDZ8V2LP3-7

Overview

GDZ8V2LP3-7 from Diodes Incorporated is an ultra-small leadless surface-mount Zener diode with a nominal zener voltage of 8.2 V (±5% tolerance), 250 mW power dissipation at +25°C, and reverse leakage current ≤0.5 µA at 5.0 V. It uses the X3-DFN0603-2 package (0.6 × 0.3 mm, 0.3 mm profile) and is qualified to AEC-Q101 for automotive-grade reliability. It serves as a precision voltage reference or overvoltage clamp in space-constrained, low-power circuits.

For engineers reviewing the GDZ8V2LP3-7 datasheet, GDZ8V2LP3-7 pinout, GDZ8V2LP3-7 application, or GDZ8V2LP3-7 equivalent, key selection criteria include its tight 8.2 V zener tolerance, ultra-low leakage at low reverse bias, thermal resistance of 500 °C/W on FR-4, AEC-Q101 qualification, and compatibility with high-speed automated placement on miniaturized PCBs.

Technical Context

This device operates as a silicon planar Zener diode optimized for stable reverse-bias regulation. Its breakdown mechanism is predominantly avalanche for voltages ≥6.8 V, resulting in a positive temperature coefficient (~0.05 %/°C at 8.2 V). The DFN0603-2 package enables minimal parasitic inductance and capacitance - typical total capacitance is <2 pF at 1 MHz - supporting fast transient response in ESD protection and reference applications.

Thermal derating follows a linear curve: power dissipation reduces to zero at +150°C ambient, with 100% rated power only at ≤+25°C. The cathode-bar marking and matte tin–plated copper leadframe ensure consistent solderability per MIL-STD-202, Method 208, and compatibility with lead-free reflow profiles.

Key Specifications

Pinout & Package

Package: X3-DFN0603-2 - ultra-miniature, dual-terminal, leadless plastic package with exposed thermal pad not present; molded "Green" compound (UL 94V-0), matte tin-plated copper leadframe, cathode identified by bar marking on top surface.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar Zener diode applications.

Compared with BZX384-B8V2,215 and MMSZ4687T1G, GDZ8V2LP3-7 delivers the smallest footprint, lowest leakage, and automotive qualification - making it optimal for next-gen compact, battery-efficient, and mission-critical edge electronics where size, reliability, and quiescent current are decisive.

Availability

GDZ8V2LP3-7 is available at Aetrix Electronics and suitable for automotive cabin sensors, wearable health monitors, industrial IoT edge nodes, and USB-C power delivery monitoring requiring stable component supply across extended temperature ranges and high-volume production cycles.

Supply support for GDZ8V2LP3-7 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Diodes Incorporated is a global manufacturer of discrete semiconductors and analog ICs, headquartered in Plano, Texas, with design, manufacturing, and sales operations across Asia, Europe, and North America.

The GDZ LP3 series belongs to Diodes' ultra-miniature Zener diode product line, engineered specifically for space-constrained, low-power, and automotive-qualified applications demanding high reliability and environmental compliance.

FAQ

What is the maximum reverse voltage this Zener can sustain before breakdown?

The GDZ8V2LP3-7 has a nominal zener voltage of 8.2 V with a guaranteed breakdown range of 7.76 V to 8.64 V at 5 mA test current. It is not rated for sustained operation above its specified V_Z range in reverse bias - exceeding this may cause irreversible avalanche damage unless current is strictly limited by external series resistance.

Is GDZ8V2LP3-7 suitable for use in high-frequency signal paths?

Yes - its typical total capacitance is less than 2 pF at 1 MHz, and the DFN0603-2 package minimizes parasitic inductance. This makes it effective for RF decoupling and transient suppression up to ~100 MHz, provided layout maintains short traces and avoids ground loops that could degrade high-frequency impedance.

Does this part require special PCB layout considerations for thermal management?

Yes - with R_θJA = 500 °C/W, thermal performance depends heavily on PCB copper area. Diodes Incorporated recommends using the documented X3-DFN0603-2 pad layout (0.23 × 0.61 mm pads, 0.38 mm spacing) on 1-oz FR-4. Adding thermal relief or internal copper planes improves derating, especially above +25°C ambient.

Can GDZ8V2LP3-7 replace older through-hole Zeners like 1N4736A in new designs?

No - while both regulate at ~8.2 V, GDZ8V2LP3-7 is a surface-mount, ultra-miniature, low-leakage, AEC-Q101-qualified device with different thermal, mechanical, and electrical behavior. Direct replacement requires redesigning PCB layout, verifying current-limiting resistor values, and validating performance under temperature cycling and vibration per automotive standards.