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Home > Products > Integrated Circuits (ICs) > Logic > Translators, Level Shifters

NXP Semiconductors GTL2000DGG,512

Name: GTL2000DGG,512
Brand: NXP Semiconductors
SKU: GTL2000DGG,512
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Part No.:: GTL2000DGG,512

Manufacturer:: NXP Semiconductors

Category:: Translators, Level Shifters

Package:

Datasheet:: GTL2000DGG,512.pdf

Description:: IC TRANSLATOR BIDIR 48TSSOP

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Product details

Overview

GTL2000DGG,512 from NXP Semiconductors (formerly Philips Semiconductors) is a 22-bit bi-directional low-voltage translator IC designed for seamless voltage level translation between 1.0 V and 5.0 V busses. It features no direction pin, 6.5 Ω typical R_ON, 1.5 ns typical propagation delay (Sn↔Dn), and operates across –40 °C to +85 °C. It enables direct interface between GTL/GTL+, LVTTL/TTL, and 5 V CMOS logic domains in high-speed processor I/O bridging applications.

For engineers reviewing the GTL2000DGG,512 datasheet, GTL2000DGG,512 pinout, GTL2000DGG,512 application, or GTL2000DGG,512 equivalent, key selection criteria include its directionless bi-directional operation, reference-transistor-based clamping architecture, flow-through SSOP/TSSOP48 pinout, 5 V-tolerant inputs, and suitability for hot-insertion I²C, GTL+, and mixed-voltage memory subsystems.

Technical Context

The GTL2000DGG,512 implements Gunning Transceiver Logic – Transceiver Voltage Clamp (GTL-TVC) architecture with 22 matched NMOS pass transistors (S1–S22/D1–D22), one reference transistor (SREF/DREF), and shared gate control (GREF). Translation direction is determined dynamically by relative voltage levels on Sn and Dn ports - no external direction signal required.

It operates without a power supply, drawing current only during switching events; standby current is negligible. The device relies on external pull-up resistors on the higher-voltage side (e.g., 3.3 V or 5 V bus) and connects SREF to the lower-voltage core supply (e.g., 1.2 V or 1.5 V), with GREF tied to DREF and pulled to V_CC via ~200 kΩ resistor.

Key Specifications

Parameter	Value and Actual Design Meaning
Function	22-bit bi-directional voltage translator with no direction pin - enables automatic high-to-low and low-to-high translation based on real-time port voltage differential.
R_ON (typ)	6.5 Ω - ensures minimal voltage drop (<350 mV at 15 mA) and preserves signal integrity across wide voltage ranges (1.0 V to 5.0 V).
t_PLH/t_PHL (typ)	1.5 ns - supports >500 Mbps data rates in GTL/GTL+ and I²C bus translation without timing bottlenecks.
Voltage Range	Supports translation between any pair of voltages from 1.0 V to 5.0 V - e.g., 1.2 V CPU I/O ↔ 3.3 V chipset bus or 1.8 V memory controller ↔ 5 V peripheral interface.
ESD Rating	HBM >2000 V, MM >200 V, CDM >1000 V - protects sensitive low-voltage logic (e.g., 1.0 V/1.2 V cores) from system-level ESD events.
Operating Temp	–40 °C to +85 °C - qualified for industrial and embedded computing environments including server DIMM interfaces and telecom line cards.

Pinout & Package

TSSOP48 package: plastic thin shrink small outline, 48 leads, body width 6.1 mm, lead pitch 0.5 mm, RoHS-compliant. Pin 1 marked with dot; pin count confirmed per SOT362-1 drawing.

Pin/Terminal	Circuit Role	Design Meaning
1	GND	Ground reference for all internal transistors - must be connected to system ground plane with low-inductance path.
2	SREF	Source of reference transistor - tied to lower-voltage domain (e.g., 1.2 V CPU core) to set maximum output voltage on Sn side.
3–24	S1–S22	22 source-side I/O ports - connect to low-voltage bus (e.g., 1.0–1.8 V); open-drain compatible; no internal pull-ups.
25–46	D1–D22	22 drain-side I/O ports - connect to higher-voltage bus (e.g., 3.3 V or 5 V); require external pull-up resistors for full logic high.
47	DREF	Drain of reference transistor - tied to GREF and pulled to higher-voltage V_CC (e.g., 3.3 V) via 200 kΩ resistor.
48	GREF	Gate of reference transistor - controls conduction state of all 22 pass transistors; must be ≥1.5 V above SREF for stable operation.

Key Features

Feature	Design Value
No direction pin required	Eliminates need for GPIO-controlled direction signals or complex timing coordination - simplifies PCB routing and firmware design in bidirectional protocols like I²C.
Zero-power standby	Draws no quiescent current when idle - critical for battery-backed systems and always-on I/O bridges where leakage must be minimized.
Flow-through pinout	Pins S1–S22 (3–24) and D1–D22 (25–46) align linearly - enables straight trace routing on dense PCBs, reducing crosstalk and layer count in high-speed memory modules.
5 V tolerant inputs	Accepts 5 V signals on Dn ports while operating with 1.2 V SREF - allows legacy 5 V peripherals to safely interface with modern sub-1.5 V processors without external clamping diodes.
Hot-insertion support	Non-latching architecture and absence of internal power rail prevent bus contention or latch-up during live card insertion - essential for modular telecom and server backplane designs.

Applications

Processor–Chipset I²C Bridging	GTL+/LVTTL Bus Translation
Use Scenario: Connecting a 1.2 V ARM Cortex-A series processor's I²C port to a 3.3 V PMIC or sensor hub. IC Role / Device Role / Timing Role: Bi-directional voltage translator enabling open-drain I²C signaling across voltage domains without direction control or added latency. Use Value: Maintains I²C timing compliance (t_LOW, t_FALL) with <1.5 ns propagation delay and preserves noise margin via 6.5 Ω R_ON and 2000 V HBM ESD protection.	Use Scenario: Interfacing a 1.5 V GTL+ memory controller with 3.3 V DDR SDRAM command/address bus. IC Role / Device Role / Timing Role: GTL-TVC clamp translating GTL+ swing (0.3 V–1.2 V) to LVTTL levels (0 V–3.3 V) using SREF = 1.2 V and DREF/GREF = 3.3 V. Use Value: Matches GTL+ slew rate requirements with <7 pF off-capacitance and avoids signal degradation from discrete FET solutions due to transistor matching.
Low-Voltage CPU Core Interface	Mixed-Voltage DIMM Subsystem
Use Scenario: Protecting 1.0 V CPU I/O pins during communication with 5 V legacy peripherals in industrial PLC controllers. IC Role / Device Role / Timing Role: Uni-directional down-translator (Dn→Sn) limiting Sn output to ≤1.0 V while accepting 5 V inputs on Dn ports. Use Value: Prevents overvoltage damage using intrinsic 5 V tolerance and clamped VOL ≤350 mV at 15 mA - no external level-shifting resistors or diodes needed.	Use Scenario: Enabling JEDEC-compliant DDR4 memory modules (1.2 V) to interface with 2.5 V or 3.3 V baseboard management controllers (BMC). IC Role / Device Role / Timing Role: 22-bit parallel translator handling SMBus, SPD, and thermal sensor lines between DIMM and BMC across voltage boundaries. Use Value: Flow-through pinout supports compact DIMM edge connector layout; –40 °C to +85 °C rating ensures reliability in thermally constrained server chassis.

Processor–Chipset I²C Bridging

GTL+/LVTTL Bus Translation

Use Scenario: Connecting a 1.2 V ARM Cortex-A series processor's I²C port to a 3.3 V PMIC or sensor hub.

IC Role / Device Role / Timing Role: Bi-directional voltage translator enabling open-drain I²C signaling across voltage domains without direction control or added latency.

Use Value: Maintains I²C timing compliance (t_LOW, t_FALL) with <1.5 ns propagation delay and preserves noise margin via 6.5 Ω R_ON and 2000 V HBM ESD protection.

Use Scenario: Interfacing a 1.5 V GTL+ memory controller with 3.3 V DDR SDRAM command/address bus.

IC Role / Device Role / Timing Role: GTL-TVC clamp translating GTL+ swing (0.3 V–1.2 V) to LVTTL levels (0 V–3.3 V) using SREF = 1.2 V and DREF/GREF = 3.3 V.

Use Value: Matches GTL+ slew rate requirements with <7 pF off-capacitance and avoids signal degradation from discrete FET solutions due to transistor matching.

Low-Voltage CPU Core Interface

Mixed-Voltage DIMM Subsystem

Use Scenario: Protecting 1.0 V CPU I/O pins during communication with 5 V legacy peripherals in industrial PLC controllers.

IC Role / Device Role / Timing Role: Uni-directional down-translator (Dn→Sn) limiting Sn output to ≤1.0 V while accepting 5 V inputs on Dn ports.

Use Value: Prevents overvoltage damage using intrinsic 5 V tolerance and clamped VOL ≤350 mV at 15 mA - no external level-shifting resistors or diodes needed.

Use Scenario: Enabling JEDEC-compliant DDR4 memory modules (1.2 V) to interface with 2.5 V or 3.3 V baseboard management controllers (BMC).

IC Role / Device Role / Timing Role: 22-bit parallel translator handling SMBus, SPD, and thermal sensor lines between DIMM and BMC across voltage boundaries.

Use Value: Flow-through pinout supports compact DIMM edge connector layout; –40 °C to +85 °C rating ensures reliability in thermally constrained server chassis.

Equivalent & Alternatives

The following parts are listed as comparable options for similar bi-directional voltage translation applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
NXP PCA9306DP	2-bit, I²C-specific, integrated 10 kΩ pull-ups, requires dual supply (V_REF1/V_REF2), max 400 kHz speed	Limited to 2-channel I²C; not suitable for parallel 22-bit buses or GTL+ translation	Select for space-constrained I²C-only designs where integrated pull-ups reduce BOM count; avoid for high-pin-count or high-speed GTL applications.
Texas Instruments TXS0108E	8-bit, auto-direction sensing, 3.6 V max V_CCA, 5.5 V max V_CCB, 60 MHz max data rate, active drive on high side	Higher drive strength but requires direction arbitration logic for true bi-directional use; not optimized for GTL/GTL+ waveform fidelity	Prefer for general-purpose 8-bit parallel translation with stronger output drive; GTL2000DGG,512 remains superior for 22-bit GTL+/I²C with zero-latency passive clamping.

Compared with PCA9306DP and TXS0108E, the GTL2000DGG,512 delivers unmatched channel density (22-bit), true passive bi-directionality without arbitration overhead, and native GTL/GTL+ waveform compatibility - making it the only viable choice for high-pin-count, high-speed, low-voltage processor–chipset interconnects.

Availability

GTL2000DGG,512 is available at Aetrix Electronics and suitable for industrial embedded controllers, server memory subsystems, and telecom baseband processing requiring stable component supply, long-term lifecycle assurance, and RoHS-compliant TSSOP packaging.

Supply support for GTL2000DGG,512 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor leader focused on secure connectivity solutions for automotive, industrial, and IoT applications, with roots in Philips Semiconductors' analog and logic portfolio.

The GTL2000DGG,512 belongs to NXP's legacy logic translation family, engineered specifically for high-speed, low-voltage interoperability in processor-centric systems - addressing the need for robust, pin-efficient voltage bridging as core voltages scaled below 1.5 V.

FAQ

Does the GTL2000DGG,512 require an external power supply to operate?

No, the GTL2000DGG,512 operates without a dedicated V_CC supply. It draws current only during active translation events via external pull-up resistors on the higher-voltage side (e.g., Dn ports). Its zero-quiescent-power design eliminates standby current draw, making GTL2000DGG,512 ideal for always-on I/O bridges and battery-sensitive applications.

What is the maximum recommended current per channel for the GTL2000DGG,512?

The GTL2000DGG,512 supports up to ±128 mA per channel under absolute maximum conditions, but the recommended operating limit is 64 mA. For optimal VOL performance (≤350 mV), the pass current should be limited to 15 mA per channel - achieved using pull-up resistors sized per the datasheet table (e.g., 310 Ω for 5 V, 197 Ω for 3.3 V).

Can the GTL2000DGG,512 translate between 1.0 V and 5.0 V in both directions simultaneously?

Yes - the GTL2000DGG,512 performs true simultaneous bi-directional translation. When SREF is set to 1.0 V and DREF/GREF to 5.0 V, Sn ports are clamped to ≤1.0 V while Dn ports swing to 5.0 V logic levels. The device automatically routes signals based on instantaneous voltage differentials, with no direction pin or timing constraints required for GTL2000DGG,512 operation.

Is the GTL2000DGG,512 pin-compatible with other packages of the GTL2000 family?

Yes - the GTL2000DGG,512 (TSSOP48) shares identical pinout and electrical specifications with the SSOP48 variant (GTL2000DL). Both use SOT362-1 and SOT370-1 footprints respectively, and all 48 pins map identically: GND (1), SREF (2), S1–S22 (3–24), D1–D22 (25–46), DREF (47), GREF (48). This allows direct PCB footprint interchangeability between GTL2000DGG,512 and GTL2000DL.

What is the role of the SREF and GREF pins in configuring the GTL2000DGG,512 for a specific voltage translation?

SREF sets the maximum output voltage on the Sn side (e.g., 1.2 V for a 1.2 V processor), while GREF - tied to DREF and pulled to the higher-voltage V_CC - controls conduction of all 22 pass transistors. Per datasheet guidance, GREF must be at least 1.5 V above SREF (e.g., SREF = 1.2 V → GREF/DREF ≥ 2.7 V) to ensure reliable clamping and low R_ON in GTL2000DGG,512 operation.

GTL2000DGG,512 Specifications

Product attributes: Attribute value

Manufacturer:: NXP Semiconductors

Series:: -

Package/Case:

Packaging:: Tube

Product Status:: Obsolete

Translator Type:: Voltage Level

Channel Type:: Bidirectional

Number of Circuits:: 1

Channels per Circuit:: 22

Voltage - VCCA:: 1 V ~ 5.5 V

Voltage - VCCB:: 1 V ~ 5.5 V

Input Signal:: -

Output Signal:: -

Output Type:: Open Drain

Data Rate:: -

Operating Temperature:: -40°C ~ 85°C (TA)

Grade:: -

Qualification:: -

Features:: Auto-Direction Sensing

Mounting Type:: Surface Mount

Supplier Device Package:: 48-TFSOP (0.240", 6.10mm Width)

GTL2000DGG,512 FAQ

1.How can I place an order for GTL2000DGG,512 through Aetrix?

Please submit a Request for Quotation (RFQ) for GTL2000DGG,512 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for GTL2000DGG,512 reliable?

The price and inventory of GTL2000DGG,512 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for GTL2000DGG,512 is usually 5 days.

3.What payment methods are accepted for GTL2000DGG,512?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for GTL2000DGG,512 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for GTL2000DGG,512?

GTL2000DGG,512 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your GTL2000DGG,512 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for GTL2000DGG,512?

For technical support, including GTL2000DGG,512 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your GTL2000DGG,512 requirements.

6.How does Aetrix verify that GTL2000DGG,512 is sourced from the original manufacturer or authorized distributors?

All GTL2000DGG,512 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that GTL2000DGG,512 meets industry standards.

7.What is the process for return or replacement of GTL2000DGG,512?

All GTL2000DGG,512 units undergo pre-shipment inspection (PSI). If there is an issue with GTL2000DGG,512, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The GTL2000DGG,512 part is unused and in its original packaging.

Return procedure for GTL2000DGG,512:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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