NXP Semiconductors GTL2008PW,112

Overview

GTL2008PW,112 from NXP Semiconductors is a 12-bit GTL-to-LVTTL translator with dual enable control (EN1/EN2), designed for signal translation between dual Xeon processors, Platform Health Management, South Bridge, and power supply circuits. It operates at 3.0–3.6 V, supports GTL/GTL+/GTL− levels, and places all LVTTL/GTL outputs in high-impedance state when enables are LOW-except 11BO, which is forced LOW. It enables robust error reporting coordination in server motherboard power-up sequencing.

For engineers reviewing the GTL2008PW,112 datasheet, GTL2008PW,112 pinout, GTL2008PW,112 application, or GTL2008PW,112 equivalent, key selection criteria include its dual-power-good-controlled high-impedance output behavior, 0.66–1.1 V VREF range supporting future GTL voltage scaling, open-drain LVTTL I/O with 30 Ω series termination, and TSSOP28 package compatibility with Xeon platform health monitoring interfaces.

Technical Context

The GTL2008PW,112 implements bidirectional GTL/LVTTL translation with asymmetric enable logic: EN1 controls 1AO/2AO/5A and disconnects 1BI/2BI/5BI; EN2 controls 3AO/4AO/6A and disconnects 3BI/4BI/6BI. Its 11BO output features a dedicated low-glitch design that drives LOW after VCC power-up while EN2 remains LOW, preventing false fault assertions before system stabilization.

It integrates delay circuitry on 7BO1/7BO2 to suppress transient glitches caused by timing skew between PROCHOT-related inputs (5BI/6BI) and their corresponding LVTTL drivers (5A/6A), with up to 100 ns lag tolerance. All GTL inputs accept 0–VTT (≤1.2 V) signals referenced to VREF (0.64–1.1 V), while LVTTL I/O complies with 3.3 V logic thresholds and is not 5 V tolerant.

Key Specifications

Pinout & Package

TSSOP28 package (SOT361-1), plastic thin shrink small outline, 28 leads, body width 4.4 mm, lead pitch 0.65 mm.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar GTL-to-LVTTL translation applications.

Compared with GTL2007PW,112, GTL2008PW,112 adds sequenced enable control and power-up-safe 11BO - essential for reliable dual-Xeon thermal management. Versus SN74GTL16616DGGR, it delivers purpose-built dual-enable architecture and integrated glitch suppression, reducing BOM count and layout risk in server health monitoring subsystems.

Availability

GTL2008PW,112 is available at Aetrix Electronics and suitable for server motherboard design, dual-CPU thermal management systems, and platform health monitoring interfaces requiring stable component supply and long-term industrial lifecycle support.

Supply support for GTL2008PW,112 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor leader focused on secure connectivity solutions for automotive, industrial, and communications infrastructure markets.

The GTL2008PW,112 belongs to NXP's GTL translator family, engineered specifically for high-reliability server platforms requiring precise timing, power-good coordination, and robust signal integrity between Xeon processors and platform controllers.

FAQ

What is the primary function of the GTL2008PW,112 in dual-Xeon server platforms?

The GTL2008PW,112 serves as a 12-bit GTL-to-LVTTL translator with dual enable control (EN1/EN2), enabling coordinated signal exchange between dual Xeon processors, Platform Health Management, South Bridge, and power supply circuits. Its core function is to ensure glitch-free, power-up-safe translation of critical signals like THRMTRIP_L, PROCHOT_L, and NMI_L - particularly through its dedicated 11BO output that forces LOW until EN2 asserts, preventing false fault reporting during boot.

How does the GTL2008PW,112 handle power-up sequencing to avoid false error conditions?

The GTL2008PW,112 uses EN1 and EN2 to hold all LVTTL and GTL outputs in high-impedance until VCC reaches nominal voltage, inputs stabilize, and VREF achieves its proper level. Crucially, the 11BO output is actively driven LOW after VCC ramp and remains LOW until EN2 goes HIGH - this prevents spurious NMI assertion before platform initialization completes. This behavior is explicitly defined in the functional description and Figure 1 logic diagram.

What are the voltage requirements for VREF and VTT when using the GTL2008PW,112?

The GTL2008PW,112 supports VREF from 0.64 V to 1.1 V and VTT from 1.1 V to 1.2 V, per Table 11. It is characterized for VREF = 0.73 V / VTT = 1.1 V and VREF = 0.76 V / VTT = 1.2 V, but allows minimum VREF = 0.66 V to accommodate future GTL scaling (e.g., 0.63 × VTT). This extended VREF range ensures compatibility with evolving Xeon voltage specifications without redesign.

Does the GTL2008PW,112 support 5 V tolerant LVTTL I/O?

No, the GTL2008PW,112 LVTTL I/O is not 5 V tolerant. Per Section 2 "Features and benefits", it explicitly states "LVTTL I/O not 5 V tolerant". The recommended operating conditions specify VI(max) = 3.6 V for the A port (LVTTL), and absolute maximum ratings cap input voltage at +4.6 V - insufficient for sustained 5 V operation. External level shifters are required for interfacing with 5 V systems.

What package type is used for the GTL2008PW,112 and what are its key mechanical dimensions?

The GTL2008PW,112 is packaged in TSSOP28 (SOT361-1): a plastic thin shrink small outline package with 28 leads, body width of 4.4 mm, and lead pitch of 0.65 mm. Per Figure 16, its maximum height (A max) is 1.1 mm, and it conforms to JEDEC MO-153 standards. This compact, surface-mount package supports high-density server PCB layouts while maintaining thermal and electrical performance.