NXP Semiconductors GTL2010BS,118

Overview

GTL2010BS,118 from NXP Semiconductors is a 10-bit bidirectional low-voltage translator IC enabling seamless voltage level translation between 1.0 V and 5.0 V buses without direction control. It features 10 matched NMOS pass transistors, 6.5 Ω typical ON-state resistance (Ron), sub-6 ns propagation delay, and operates across −40 °C to +85 °C. It is used in I²C-bus voltage translation between 1.2 V/1.8 V processors and 3.3 V/5.0 V peripherals.

For engineers reviewing the GTL2010BS,118 datasheet, GTL2010BS,118 pinout, GTL2010BS,118 application, or GTL2010BS,118 equivalent, this device delivers verified bidirectional clamping for GTL/GTL+/LVTTL/TTL interoperability, hot-insertion support, 5 V-tolerant inputs, ESD protection exceeding 2000 V HBM, and flow-through HVQFN24 routing - critical for high-density embedded interface design.

Technical Context

The GTL2010BS,118 implements Gunning Transceiver Logic – Transceiver Voltage Clamp (GTL-TVC) architecture using symmetrical NMOS pass transistors with shared gate (GREF) and reference transistor (SREF/DREF). Its operation relies on setting SREF to the target low-side voltage (e.g., 1.2 V–1.8 V) while biasing GREF ≥1.5 V above SREF via DREF tied to high-side VCC (3.3 V/5.0 V).

Each Sn/Dn channel provides bidirectional conduction: when either side is LOW, the path turns ON with low Ron; when the high-voltage side is HIGH, the low-voltage side is clamped to SREF. No external power supply is required, and latch-up cannot occur - making it ideal for voltage domain bridging in open-drain systems like I²C.

Key Specifications

Pinout & Package

HVQFN24 package: plastic thermal-enhanced very thin quad flat package, 4 × 4 × 0.85 mm body, 24-terminal no-lead construction with exposed thermal pad (soldered to PCB ground for thermal/electrical performance).

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar bidirectional voltage translation applications.

Compared with SN74AVC16T245DGGR and TXB0108PWR, the GTL2010BS,118 uniquely supports true directionless operation with 5 V-tolerant inputs and zero static power - making it the only choice for space-constrained, hot-pluggable I²C bridges where supply rail count and ESD robustness are critical.

Availability

GTL2010BS,118 is available at Aetrix Electronics and suitable for industrial control interfaces, automotive body electronics, server management buses, and embedded I²C subsystems requiring stable component supply across extended temperature ranges and long production lifecycles.

Supply support for GTL2010BS,118 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor leader focused on secure connectivity solutions for automotive, industrial, and IoT applications, with deep expertise in interface, power, and security ICs.

The GTL2010BS,118 belongs to NXP's GTL-TVC translator family, engineered specifically for robust, zero-power bidirectional voltage bridging in mixed-voltage digital systems - targeting high-reliability embedded interfaces where direction control and supply dependencies must be eliminated.

FAQ

What is the primary function of the GTL2010BS,118?

The GTL2010BS,118 is a 10-bit bidirectional voltage translator that enables seamless signal translation between 1.0 V and 5.0 V logic domains without requiring a direction control pin. It uses matched NMOS pass transistors with a shared reference structure (SREF/DREF/GREF) to clamp or pass signals based on relative voltage levels - making it ideal for I²C, GTL, and LVTTL interoperability. The GTL2010BS,118 draws zero supply current and supports hot insertion.

Does the GTL2010BS,118 require an external power supply?

No, the GTL2010BS,118 operates without any external VCC connection - it derives bias from the signal rails themselves via the DREF–GREF–SREF configuration. This eliminates quiescent current draw, prevents latch-up, and enables safe hot insertion into powered systems. The GTL2010BS,118 only requires proper grounding (GND pin and exposed thermal pad) and correct reference voltage setup (SREF at low-side core voltage, DREF pulled to high-side VCC).

How does the GTL2010BS,118 handle I²C-bus bidirectional translation?

The GTL2010BS,118 natively supports open-drain I²C operation: when either Sn or Dn is pulled LOW, the channel conducts with low Ron (~6.5 Ω); when the high-voltage side is HIGH, the low-voltage side is clamped to SREF. No direction pin or timing coordination is needed - unlike direction-controlled translators. The GTL2010BS,118 maintains I²C timing integrity with sub-6 ns propagation delay and matches rise/fall characteristics across all 10 channels.

What is the role of the exposed thermal pad on the GTL2010BS,118 HVQFN24 package?

The exposed thermal pad on the GTL2010BS,118 HVQFN24 package is electrically connected to die ground and must be soldered to a PCB thermal pad with vias for effective heat conduction. It is not optional - failure to connect it compromises electrical stability, thermal performance, and ESD robustness. The pad ensures low-inductance ground return and dissipates heat during sustained clamp-current operation (up to ±128 mA per channel).

Can the GTL2010BS,118 replace discrete MOSFET-based level shifters?

Yes - the GTL2010BS,118 replaces up to 10 discrete NMOS FETs plus associated biasing components. Its monolithic matched transistor array guarantees consistent Ron (<5% variation), propagation delay (<100 ps skew), and ESD performance (2000 V HBM), eliminating layout sensitivity and calibration effort. Unlike discrete solutions, the GTL2010BS,118 requires no gate resistors, pull-ups on both sides, or voltage dividers - reducing BOM count, board area, and validation time.