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NXP Semiconductors GTL2010PW/G,118

Part No.:
GTL2010PW/G,118
Manufacturer:
NXP Semiconductors
Category:
Translators, Level Shifters
Package:
Datasheet:
AetrixGTL2010PW/G,118.pdf
Description:
IC VOLT TRANSLATOR 24-TSSOP
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Inventory:2,612

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Product details

Overview

GTL2010PW/G,118 from NXP Semiconductors is a 10-bit bidirectional low-voltage translator IC enabling seamless voltage level translation between 1.0 V and 5.0 V buses without direction control. It features 10 matched NMOS pass transistors with common gate (GREF), 6.5 Ω typical ON-state resistance, sub-6 ns propagation delay, and supports I²C-bus interface translation in processor-to-peripheral interconnects.

For engineers reviewing the GTL2010PW/G,118 datasheet, GTL2010PW/G,118 pinout, GTL2010PW/G,118 application, or GTL2010PW/G,118 equivalent, this device delivers verified bidirectional translation for mixed-voltage SoC interfaces-especially where hot insertion, 5 V-tolerant inputs, and ESD-hardened signal routing are required in space-constrained embedded designs.

Technical Context

The GTL2010PW/G,118 implements Gunning Transceiver Logic–Transceiver Voltage Clamp (GTL-TVC) architecture using symmetrical NMOS pass transistors. Its reference transistor (SREF/DREF/GREF) sets clamping voltage, enabling bidirectional translation by dynamically limiting Sn port voltage to SREF while allowing Dn to be pulled to VCC via external resistors.

No internal power supply is required-the device operates passively via external pull-ups and reference biasing. Translation direction is determined solely by relative voltage levels on Sn and Dn ports, eliminating need for control logic or direction pins. All 10 channels exhibit matched Ron and propagation delay across temperature (−40 °C to +85 °C).

Key Specifications

Parameter Value and Actual Design Meaning
Channel count10 independent bidirectional translation channels (S1–S10 / D1–D10)
ON-state resistance (Ron)6.5 Ω typical at VGREF = 4.5 V, IO = 64 mA - ensures minimal voltage drop and signal integrity during active translation
Propagation delay0.5–5.5 ns (tPLH/tPHL) - enables high-speed operation up to >100 MHz in I²C and GTL+ bus applications
Voltage translation range1.0 V ↔ 5.0 V bidirectionally - supports direct interface between 1.0/1.2/1.5/1.8/2.5/3.3/5.0 V logic families
ESD protection2000 V HBM, 200 V MM, 1000 V CDM - protects downstream 1.0–1.8 V processor I/O from system-level ESD events
Input tolerance5 V tolerant on all Sn/Dn pins - allows safe connection to higher-voltage peripherals without external clamping
Operating temperature−40 °C to +85 °C - qualified for industrial and automotive under-hood control module environments

Pinout & Package

TSSOP24 package (SOT355-1): plastic thin shrink small outline, 24-pin, 4.4 mm body width, lead pitch 0.65 mm. Exposed pad not present; standard PCB thermal relief sufficient.

Pin Circuit Role Design Meaning
GND (Pin 1)Ground referenceCommon return path for all internal transistors; must connect to system ground plane for stable clamp reference
SREF (Pin 2)Reference source terminalConnects to core voltage (e.g., 1.2 V or 1.8 V CPU rail); sets maximum output voltage on Sn side
S1–S10 (Pins 3–12)Low-voltage side source terminalsInterface directly with 1.0–1.8 V processor I/O; no external pull-ups required on this side
D1–D10 (Pins 13–22)High-voltage side drain terminalsConnect to 3.3 V/5.0 V peripherals; require external pull-up resistors (e.g., 2.2 kΩ) to VCC
DREF (Pin 23)Reference drain terminalConnected to higher-voltage VCC (3.3–5.5 V) via 200 kΩ pull-up; establishes gate bias for all transistors
GREF (Pin 24)Reference gate terminalInternally tied to DREF; sets conduction threshold - must be ≥1.5 V above SREF for reliable operation

Key Features

Feature Design Value
No direction pin requiredEnables true bidirectional signal flow on same pins - eliminates PCB routing complexity and firmware overhead in I²C/SMBus links
Matched transistor characteristicsAll 10 channels share identical Ron, delay, and leakage - ensures consistent timing and voltage margins across multi-bit buses like address/data lines
Hot-insertion supportZero power supply requirement and latch-up immunity allow safe live insertion into powered backplanes or modular systems
Flow-through pinoutPins arranged S1/D1…S10/D10 sequentially - simplifies differential-length-controlled trace routing and reduces crosstalk in dense layouts
ESD-hardened I/OExceeds JESD22-A114 (2000 V HBM) - protects sensitive low-voltage cores during board handling and system integration

Applications

Processor-to-Peripheral I²C Translation Multi-Voltage Backplane Interfacing

Use Scenario: Connecting a 1.2 V ARM Cortex-M7 microcontroller's I²C port to 3.3 V sensors and EEPROMs on the same bus.

IC Role / Device Role / Timing Role: Bidirectional voltage clamp translating SDA/SCL signals while preserving open-drain behavior and timing compliance.

Use Value: Eliminates need for dual-supply level shifters or software-controlled direction toggling - maintains full I²C spec compliance at 400 kHz.

Use Scenario: Interfacing a 1.8 V FPGA I/O bank with legacy 5.0 V industrial I/O modules over shared control bus.

IC Role / Device Role / Timing Role: Passive translator enabling simultaneous communication across voltage domains without arbitration logic.

Use Value: Reduces BOM count vs. discrete MOSFET solutions; matches propagation delay across all 10 lines to prevent skew-induced setup/hold violations.

GTL+/LVTTL Bus Bridging Low-Voltage Processor Core Protection

Use Scenario: Adapting GTL+ (1.2 V) chipset address bus to LVTTL (3.3 V) memory controller in telecom baseband subsystems.

IC Role / Device Role / Timing Role: High-speed unidirectional down-translator with precise clamping to avoid overvoltage stress on GTL+ receivers.

Use Value: Achieves <5 ns delay matching GTL+ timing budgets; Ron <7 Ω prevents excessive VOL rise under 15 mA load.

Use Scenario: Shielding 1.0 V AI accelerator core pins from 5.0 V debug interface signals during bring-up and field service.

IC Role / Device Role / Timing Role: Fail-safe voltage limiter that clamps transient spikes to SREF level before reaching core I/O ESD structures.

Use Value: Provides 2000 V HBM robustness while limiting fault current to <128 mA per channel - prevents permanent core damage.

Equivalent & Alternatives

The following parts are listed as comparable options for similar bidirectional voltage translation applications.

Alternative Part Technical Difference Application Difference Selection Advice
NLVM2010MUTAG10-channel, 1.2–5.5 V range; requires external VCC; 8 Ω Ron at 3.3 VNeeds dedicated 1.8–5.5 V supply; less suitable for ultra-low-power always-on I²C segmentsSelect when system already provides regulated auxiliary supply and higher Ron is acceptable
SN74AVC16T245DGGR16-bit, direction-controlled, 1.2–3.6 V; active CMOS design; 3.5 Ω RonRequires direction pin and dual supplies; superior drive strength but adds control logic overheadPrefer for high-drive, uni/bidirectional parallel buses where pin count and direction control are available

Compared with NLVM2010MUTAG and SN74AVC16T245DGGR, the GTL2010PW/G,118 uniquely delivers zero-power passive operation, guaranteed 6.5 Ω Ron at 1.2 V core rails, and flow-through layout compatibility-making it optimal for cost-sensitive, space-constrained, and ultra-low-quiescent-current I²C and GTL+ bridging.

Availability

GTL2010PW/G,118 is available at Aetrix Electronics and suitable for industrial automation controllers, automotive infotainment head units, and server management subsystems requiring stable component supply across extended temperature ranges and long production lifecycles.

Supply support for GTL2010PW/G,118 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor leader specializing in secure connectivity solutions for automotive, industrial, and IoT applications, with deep expertise in interface and power management ICs.

The GTL2010PW/G,118 belongs to NXP's GTL-TVC translator family, engineered specifically for high-reliability, low-latency voltage domain bridging in mixed-signal SoC interconnects where direction control overhead and power consumption must be minimized.

FAQ

Does GTL2010PW/G,118 require an external power supply to operate?

No, GTL2010PW/G,118 is a passive translator with no internal power rail. It operates solely via external pull-up resistors on the Dn side and biasing of GREF/DREF to VCC. This eliminates quiescent current draw and latch-up risk, making GTL2010PW/G,118 ideal for always-on I²C monitoring circuits and hot-pluggable modules where supply sequencing is impractical.

What is the minimum voltage difference required between GREF and SREF for reliable operation of GTL2010PW/G,118?

GTL2010PW/G,118 requires GREF to be at least 1.5 V higher than SREF for optimal translator performance, as specified in Section 7.1 of the datasheet. For example, if SREF is set to 1.2 V (for 1.2 V processor core), GREF must be ≥2.7 V-typically achieved by tying GREF/DREF to a 3.3 V or 5.0 V system rail through a 200 kΩ resistor.

Can GTL2010PW/G,118 translate between 1.0 V and 5.0 V in both directions simultaneously?

Yes, GTL2010PW/G,118 supports true simultaneous bidirectional translation between 1.0 V and 5.0 V domains. When SREF = 1.0 V and DREF/GREF = 5.0 V, Sn ports are clamped to ≤1.0 V while Dn ports swing fully to 5.0 V, enabling concurrent read/write traffic-verified in Figure 4 (bidirectional I²C application) of the GTL2010PW/G,118 datasheet.

How does GTL2010PW/G,118 handle ESD events on its I/O pins?

GTL2010PW/G,118 provides on-die ESD protection exceeding 2000 V HBM (JESD22-A114), 200 V MM (JESD22-A115), and 1000 V CDM (JESD22-C101). Its NMOS clamp structure shunts transient current to GND or VCC rails without triggering latch-up, protecting downstream 1.0–1.8 V logic while maintaining signal integrity-critical for field-serviceable equipment interfaces.

Is GTL2010PW/G,118 pin-compatible with other devices in the GTL20xx family?

GTL2010PW/G,118 shares identical TSSOP24 pinout and functional mapping with GTL2010PW (base variant); however, it is not pin-compatible with GTL2000 (22-bit) or GTL2002 (dual 10-bit) due to differing channel counts and pin assignments. Always verify against the specific ordering option's pin configuration diagram-Figure 2 in the GTL2010PW/G,118 datasheet confirms TSSOP24 layout.

GTL2010PW/G,118 Specifications

Product attributes
Attribute value
Manufacturer:
NXP Semiconductors
Series:
*
Package/Case:
Packaging:
Cut Tape (CT)
Product Status:
Obsolete
Translator Type:
-
Channel Type:
-
Number of Circuits:
-
Channels per Circuit:
-
Voltage - VCCA:
-
Voltage - VCCB:
-
Input Signal:
-
Output Signal:
-
Output Type:
-
Data Rate:
-
Operating Temperature:
-
Grade:
-
Qualification:
-
Features:
-
Mounting Type:
-
Supplier Device Package:
-

GTL2010PW/G,118 FAQ

1.How can I place an order for GTL2010PW/G,118 through Aetrix?

Please submit a Request for Quotation (RFQ) for GTL2010PW/G,118 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for GTL2010PW/G,118 reliable?

The price and inventory of GTL2010PW/G,118 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for GTL2010PW/G,118 is usually 5 days.

3.What payment methods are accepted for GTL2010PW/G,118?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for GTL2010PW/G,118 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for GTL2010PW/G,118?

GTL2010PW/G,118 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your GTL2010PW/G,118 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for GTL2010PW/G,118?

For technical support, including GTL2010PW/G,118 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your GTL2010PW/G,118 requirements.

6.How does Aetrix verify that GTL2010PW/G,118 is sourced from the original manufacturer or authorized distributors?

All GTL2010PW/G,118 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that GTL2010PW/G,118 meets industry standards.

7.What is the process for return or replacement of GTL2010PW/G,118?

All GTL2010PW/G,118 units undergo pre-shipment inspection (PSI). If there is an issue with GTL2010PW/G,118, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The GTL2010PW/G,118 part is unused and in its original packaging.

Return procedure for GTL2010PW/G,118:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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