Renesas HD6417750BP200M
- Part No.:
- HD6417750BP200M
- Manufacturer:
- Renesas
- Category:
- Microcontrollers
- Package:
- 256-BBGA
- Datasheet:
-
HD6417750BP200M.pdf
- Description:
- IC MCU 32BIT ROMLESS 256BGA
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
HD6417750BP200M from Renesas Electronics is a 32-bit RISC microprocessor in the SuperH™ SH7750 Series, implementing the SH-4 CPU core. It operates at 200 MHz with 1.95 V internal supply voltage, integrates MMU, 16 KB instruction cache and 16 KB data cache, and targets high-performance multimedia system control. It is used in digital broadcast receivers and automotive infotainment head units requiring real-time OS support and peripheral integration.
For engineers reviewing the HD6417750BP200M datasheet, HD6417750BP200M pinout, HD6417750BP200M application, or HD6417750BP200M equivalent, key selection criteria include its 256-pin BGA package, 200 MHz clock frequency, SH-4 ISA compliance, integrated memory management unit (MMU), and support for synchronous DRAM and PCMCIA bus interfaces.
Technical Context
The HD6417750BP200M implements the full SH-4 CPU architecture with dual-issue superscalar execution, five-stage pipeline, and IEEE 754-compliant floating-point unit. It features a unified 32 KB L1 cache (split into 16 KB I-cache + 16 KB D-cache), on-chip memory management unit supporting virtual memory and TLB-based address translation, and integrated peripherals including two serial communication interfaces (SCI/SCIF), RTC, UBC, and smart card interface.
Its bus controller supports 64-bit synchronous DRAM (4-bank), standard ROM/SRAM/DRAM, and PCMCIA, with configurable wait-state generation and burst transfer capability. The device uses separate power domains: VDD = 1.95 V for core logic and VDDQ = 3.0–3.6 V for I/O, enabling mixed-voltage system interfacing while maintaining signal integrity.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | SH-4 32-bit RISC superscalar processor with dual-issue, 5-stage pipeline, and FPU |
| Max Operating Frequency | 200 MHz - enables real-time video decode and multitasking under RTOS |
| Internal Supply Voltage | 1.95 V - defines core logic voltage domain and power optimization point |
| I/O Supply Voltage | 3.0–3.6 V - supports 3.3 V system bus interfacing without level shifters |
| Cache Memory | 16 KB instruction cache + 16 KB data cache - reduces external memory bandwidth demand |
| Memory Management | MMU with 64-entry TLB - enables full virtual memory support for Linux and VxWorks |
| Operating Temperature | –20 °C to +75 °C - qualified for commercial/industrial ambient environments |
| Package | 256-pin BGA (17 mm × 17 mm, 1.0 mm pitch) - standard footprint for high-density PCB layout |
Pinout & Package
HD6417750BP200M is housed in a 256-pin ball grid array (BGA) package with 17 mm × 17 mm body size and 1.0 mm ball pitch. The package conforms to JEDEC MO-205AC and supports reflow soldering per IPC/JEDEC J-STD-020D.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD | Core power supply | 1.95 V input for CPU, cache, and internal logic - must be filtered with low-ESR ceramic capacitors |
| VDDQ | I/O power supply | 3.0–3.6 V input for all I/O buffers - decoupled separately from VDD to prevent noise coupling |
| CLKIN | Main clock input | Accepts crystal or external clock source - drives PLL1 for core and bus clock generation |
| RESET | Active-low reset input | Synchronous deassertion required after power stabilization - initiates hardware reset sequence and register initialization |
| ADDR[31:0] | Address bus | 32-bit multiplexed address output - used with ALE for external memory and peripheral addressing |
| DATA[63:0] | Data bus | 64-bit bidirectional data path - supports burst transfers to SDRAM and PCMCIA devices |
| CS0#–CS5# | Chip select outputs | Six independent chip selects - configure memory-mapped regions for ROM, SRAM, flash, or peripherals |
| INT[7:0] | Interrupt inputs | Eight-level priority vectored interrupt lines - connect to peripheral interrupt sources or cascaded controllers |
Key Features
| Feature | Design Value |
|---|---|
| SH-4 CPU Architecture | Enables binary compatibility with SH-4 software ecosystem and toolchains (e.g., GCC, HEW) |
| Integrated MMU | Supports full virtual memory abstraction - required for Linux kernel porting and process isolation |
| Dual Serial Interfaces | SCI + SCIF provide asynchronous UART and high-speed synchronous serial (up to 10 Mbps) for modem or display link |
| Real-Time Clock (RTC) | Independent 32.768 kHz timekeeping circuit - maintains wall-clock time during standby with minimal power draw |
| Bus State Controller (BSC) | Configurable wait-state generator and burst arbitration - simplifies interface to diverse memory types without glue logic |
| User Break Controller (UBC) | Hardware debug support with up to 4 breakpoints - enables non-intrusive code inspection and real-time trace |
Applications
| Digital Broadcast Receiver | Automotive Infotainment Head Unit |
|---|---|
Use Scenario: Decoding MPEG-2/4 transport streams and rendering UI overlays in set-top boxes and terrestrial TV tuners. IC Role / Device Role / Timing Role: Main application processor executing middleware, demux, decoder, and graphics compositing tasks. Use Value: SH-4 instruction set and 200 MHz clock enable real-time video decode at 1080i resolution with <50 ms latency. | Use Scenario: Running navigation stack, audio processing, Bluetooth HFP, and touchscreen UI in vehicle dashboards. IC Role / Device Role / Timing Role: Central system controller managing CAN/LIN gateways, display timing, and multi-zone audio routing. Use Value: Integrated MMU and 64-bit SDRAM interface support concurrent OS services, map rendering, and voice recognition with deterministic response. |
| Industrial Human-Machine Interface (HMI) | Networked Media Player |
Use Scenario: Controlling PLC I/O, visualizing machine status, and logging production data on factory-floor panels. IC Role / Device Role / Timing Role: Real-time embedded controller interfacing with Ethernet, serial fieldbus, and VGA/LVDS displays. Use Value: Dual SCI ports and 200 MHz performance allow simultaneous Modbus RTU polling and GUI refresh at 60 Hz. | Use Scenario: Streaming HD video over IP, transcoding metadata, and rendering web-based UIs in networked signage players. IC Role / Device Role / Timing Role: Application processor handling HTTP/RTSP stack, video decode acceleration, and local storage I/O. Use Value: 64-bit data bus and SDRAM controller sustain 800 MB/s peak memory bandwidth for smooth 1080p playback. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar 32-bit RISC microprocessor applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| HD6417750SBP200 | Same SH-4 core, identical 200 MHz speed and 256-pin BGA package; differs only in ordering suffix (V vs M) - functionally identical | No functional difference; both rated for –20°C to +75°C operation and share identical AC/DC specs | Select HD6417750SBP200 if sourcing from distributors listing that variant; no design change required |
| HD6417750RBA240HV | Higher 240 MHz speed, 1.5 V core voltage, extended –40°C to +85°C temperature range, and HV-grade qualification | Targeted at automotive and industrial applications requiring wider thermal margin and higher throughput | Choose HD6417750RBA240HV only when 240 MHz performance or extended temperature is mandatory; not drop-in compatible due to voltage and timing differences |
Compared with HD6417750BP200M, HD6417750SBP200 offers identical functionality and pinout, while HD6417750RBA240HV delivers higher clock rate and extended temperature but requires revised power delivery and timing validation - making the former a direct alternative and the latter a performance-upgrade path.
Availability
HD6417750BP200M is available at Aetrix Electronics and suitable for digital broadcast receivers, automotive infotainment systems, industrial HMIs, and networked media players requiring stable component supply across long-lifecycle production programs.
Supply support for HD6417750BP200M includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Renesas Electronics Corporation is a Japanese semiconductor manufacturer specializing in microcontrollers, analog, power, and SoC solutions for automotive, industrial, and infrastructure markets.
The SH7750 Series was designed as a high-performance 32-bit RISC microprocessor platform for multimedia-rich embedded systems, emphasizing real-time processing, memory management, and peripheral integration in consumer and industrial applications.
FAQ
What is the core architecture of the HD6417750BP200M?
The HD6417750BP200M implements the SH-4 32-bit RISC CPU core with dual-issue superscalar execution, five-stage pipeline, and integrated IEEE 754-compliant floating-point unit. It supports the full SH-4 instruction set architecture and is binary-compatible with other SH-4 family members. This architecture enables high MIPS/Watt efficiency and real-time deterministic behavior critical for multimedia and control applications where the HD6417750BP200M is deployed.
Does the HD6417750BP200M include an MMU?
Yes, the HD6417750BP200M integrates a full memory management unit (MMU) with 64-entry TLB, supporting virtual memory, address translation, and protection mechanisms required by operating systems such as Linux and VxWorks. The MMU enables process isolation, demand-paged memory, and secure memory mapping - essential capabilities for complex software stacks running on the HD6417750BP200M in multimedia and industrial applications.
What package type and pin count does the HD6417750BP200M use?
The HD6417750BP200M uses a 256-pin ball grid array (BGA) package with 17 mm × 17 mm body size and 1.0 mm ball pitch. This package matches the mechanical and thermal specifications of other SH7750S-series variants like HD6417750SBP200 and is compatible with standard reflow soldering processes defined in IPC/JEDEC J-STD-020D. The pinout is documented in Section 1.4.1 of the SH7750 Hardware Manual for the HD6417750BP200M.
What is the maximum operating frequency of the HD6417750BP200M?
The HD6417750BP200M is rated for a maximum operating frequency of 200 MHz at 1.95 V core supply voltage and 3.0–3.6 V I/O supply. This frequency is validated across the specified operating temperature range of –20°C to +75°C and supports sustained instruction throughput for real-time video decode, multitasking OS execution, and peripheral control - key requirements addressed by the HD6417750BP200M in its target applications.
Is the HD6417750BP200M pin-compatible with other SH7750-series devices?
The HD6417750BP200M shares the same 256-pin BGA package and pinout as HD6417750SBP200 and HD6417750SBA200V, making it mechanically and electrically pin-compatible within the SH7750S subgroup. However, it is not pin-compatible with SH7750R-series devices (e.g., HD6417750RBP240), which use different voltage domains, timing parameters, and some signal assignments. Design reuse is confirmed only for SH7750S-family variants including the HD6417750BP200M.
HD6417750BP200M Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Package/Case:
- 256-BBGA
- Series:
- SuperH® SH7750
- Packaging:
- Bulk
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Core Processor:
- SH-4
- Core Size:
- 32-Bit Single-Core
- Speed:
- 200MHz
- Connectivity:
- EBI/EMI, FIFO, SCI, SmartCard
- Peripherals:
- DMA, POR, WDT
- Number of I/O:
- 28
- Program Memory Size:
- -
- Program Memory Type:
- ROMless
- EEPROM Size:
- -
- RAM Size:
- 24K x 8
- Voltage - Supply (Vcc/Vdd):
- 1.35V ~ 1.6V
- Data Converters:
- -
- Oscillator Type:
- External
- Operating Temperature:
- -20°C ~ 75°C
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
HD6417750BP200M FAQ
1.How can I place an order for HD6417750BP200M through Aetrix?
Please submit a Request for Quotation (RFQ) for HD6417750BP200M on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for HD6417750BP200M reliable?
The price and inventory of HD6417750BP200M are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for HD6417750BP200M is usually 5 days.
3.What payment methods are accepted for HD6417750BP200M?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for HD6417750BP200M transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for HD6417750BP200M?
HD6417750BP200M orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your HD6417750BP200M order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for HD6417750BP200M?
For technical support, including HD6417750BP200M datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your HD6417750BP200M requirements.
6.How does Aetrix verify that HD6417750BP200M is sourced from the original manufacturer or authorized distributors?
All HD6417750BP200M products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that HD6417750BP200M meets industry standards.
7.What is the process for return or replacement of HD6417750BP200M?
All HD6417750BP200M units undergo pre-shipment inspection (PSI). If there is an issue with HD6417750BP200M, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The HD6417750BP200M part is unused and in its original packaging.
Return procedure for HD6417750BP200M:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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