Renesas HD6417750BP200MV

Overview

HD6417750BP200MV from Renesas Electronics is a 32-bit RISC microprocessor in the SH7750 Series, implementing the SuperH™ SH-4 CPU core. It operates at 200 MHz with 1.95 V internal supply voltage, integrates on-chip MMU, 16 KB instruction cache, 16 KB operand cache, and supports 64-bit SDRAM bus interface. It targets high-performance multimedia embedded systems requiring real-time OS support and memory protection.

For engineers reviewing the HD6417750BP200MV datasheet, HD6417750BP200MV pinout, HD6417750BP200MV application, or HD6417750BP200MV equivalent, key selection criteria include its 256-pin BGA package, -20°C to +75°C operating temperature range, SH-4 ISA compliance, integrated bus state controller (BSC), and compatibility with synchronous DRAM and PCMCIA interfaces.

Technical Context

The HD6417750BP200MV implements the full SH-4 CPU architecture with dual-issue superscalar execution, five-stage pipeline, and IEEE 754-compliant FPU. It includes a unified 32-entry TLB supporting both instruction and data translation, with hardware-managed page table walking and ASID-based virtual memory isolation.

Its memory subsystem features separate 16 KB I-cache and 16 KB D-cache with write-back policy, integrated MMU for demand-paged virtual memory, and a 64-bit external bus interface supporting burst transfers, pipelined reads/writes, and programmable wait-state control for ROM/SRAM/SDRAM/PCMCIA.

Key Specifications

Pinout & Package

HD6417750BP200MV is housed in a 256-pin fine-pitch ball grid array (BGA) package with 1.0 mm pitch, 17 mm × 17 mm body size, and standard JEDEC MO-207AC footprint. The package supports thermal dissipation via exposed thermal pad on underside.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar 32-bit RISC microprocessor applications.

Compared with HD6417750BP200MV, HD6417750SBP200 offers identical functionality at lower qualification cost, while HD6417750RBA240HV delivers higher clock rate and extended temperature range at the expense of larger package and different pinout - neither is pin-compatible, requiring PCB redesign.

Availability

HD6417750BP200MV is available at Aetrix Electronics and suitable for digital set-top boxes, automotive infotainment head units, and industrial HMI terminals requiring stable component supply across long production lifecycles.

Supply support for HD6417750BP200MV includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Renesas Electronics Corporation is a Japanese semiconductor manufacturer specializing in microcontrollers, analog, power, and SoC solutions for automotive, industrial, and enterprise applications.

The SH7750 Series was designed as a high-performance 32-bit RISC microprocessor platform for multimedia-rich embedded systems, emphasizing real-time OS support, memory protection, and integrated peripheral connectivity.

FAQ

What is the core architecture of the HD6417750BP200MV?

The HD6417750BP200MV implements the SuperH™ SH-4 32-bit RISC CPU core with dual-issue superscalar execution, five-stage pipeline, and integrated IEEE 754-compliant floating-point unit. It supports the full SH-4 instruction set architecture and is binary-compatible with software developed for other SH-4-based devices. This architecture enables high instruction-per-cycle throughput essential for multimedia and real-time embedded applications running on the HD6417750BP200MV.

Does the HD6417750BP200MV include an on-chip memory management unit (MMU)?

Yes, the HD6417750BP200MV integrates a full hardware MMU with a 32-entry unified TLB, supporting demand-paged virtual memory, ASID-based process isolation, and hardware page-table walking. This MMU enables direct porting of Linux, uClinux, and other virtual-memory-aware real-time operating systems without external memory management components - a key capability distinguishing the HD6417750BP200MV from microcontroller-class devices.

What package type and pin count does the HD6417750BP200MV use?

The HD6417750BP200MV uses a 256-pin fine-pitch ball grid array (BGA) package with 1.0 mm pitch and 17 mm × 17 mm body size, conforming to JEDEC MO-207AC mechanical specifications. This package includes dedicated power/ground ball arrays arranged in quadrants and a thermal pad on the underside for heat dissipation. The pinout is shared with other SH7750S variants like HD6417750SBP200 but differs from SH7750R's 292-pin BGA layout.

What is the maximum operating frequency and supply voltage for the HD6417750BP200MV?

The HD6417750BP200MV operates at a maximum frequency of 200 MHz with a nominal internal core supply voltage of 1.95 V. Its I/O supply (VDDQ) ranges from 3.0 V to 3.6 V, and it is specified for operation from –20°C to +75°C ambient temperature. These parameters define the electrical operating envelope within which the HD6417750BP200MV guarantees correct timing, cache coherency, and MMU functionality per Renesas' Hardware Manual Rev. 7.02.

Which external memory types does the HD6417750BP200MV support directly?

The HD6417750BP200MV supports ROM, SRAM, DRAM, synchronous DRAM (including 64-bit 4-bank SDRAM), and PCMCIA via its integrated bus state controller (BSC). Its 64-bit external data bus and programmable timing registers allow direct interfacing to high-bandwidth SDRAM for frame buffers and application code storage - eliminating the need for external bus interface logic when designing systems around the HD6417750BP200MV.