Send an Inquiry

To receive a quote for your project, please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Part Number*
Quantity*
Message
Submit Inventory List

Please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Upload My List
Message

Renesas HD6417750F167

Part No.:
HD6417750F167
Manufacturer:
Renesas
Category:
Microcontrollers
Package:
208-BFQFP Exposed Pad
Datasheet:
AetrixHD6417750F167.pdf
Description:
IC MCU 32BIT ROMLESS 208HQFP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:218

Please send an inquiry. Send us your inquiry, and we will respond immediately.

Part Number
Quantity*
Price
Name*
Company
Email*
Comments

Product details

Overview

HD6417750F167 from Renesas Electronics is a 32-bit RISC microprocessor in the SH7750S Group, implementing the SH-4 CPU core with integrated MMU, 16 KB instruction cache, 16 KB operand cache, and peripheral functions including dual serial interfaces (SCI/SCIF), RTC, UBC, BSC, and smart card interface. It operates at 167 MHz with 1.8 V core voltage and targets multimedia system-on-chip applications requiring real-time processing and memory management.

For engineers reviewing the HD6417750F167 datasheet, HD6417750F167 pinout, HD6417750F167 application, or HD6417750F167 equivalent, key selection criteria include its 208-pin QFP package, 167 MHz clock frequency, 1.8 V core supply, SH-4 ISA compatibility, and support for DRAM/SDRAM/PCMCIA bus interfacing - all critical for legacy embedded multimedia and industrial control designs.

Technical Context

The HD6417750F167 implements the SH-4 superscalar RISC architecture with five-stage pipeline, dual-issue capability, and IEEE 754-compliant floating-point unit. It integrates a Memory Management Unit (MMU) supporting virtual memory translation via unified TLB and page-based address mapping.

Its peripheral set includes two asynchronous serial interfaces (SCI and SCIF), real-time clock (RTC), user break controller (UBC), bus state controller (BSC) for external memory timing control, and smart card interface - enabling direct integration into secure, time-aware, and memory-extensible embedded systems without external glue logic.

Key Specifications

Parameter Value and Actual Design Meaning
Core Architecture SH-4 32-bit RISC superscalar CPU with five-stage pipeline and dual-issue execution
Operating Frequency 167 MHz - determines maximum instruction throughput and real-time response latency
Core Supply Voltage 1.8 V - defines power delivery design, decoupling requirements, and thermal budget
Cache Configuration 16 KB instruction cache + 16 KB operand cache - reduces external memory access latency and bandwidth demand
Memory Management Integrated MMU with unified TLB - enables full virtual memory support for OS-based applications like Linux or VxWorks
Package Type 208-pin plastic QFP (0.5 mm pitch) - supports standard surface-mount assembly and thermal dissipation up to 1.8 W
Operating Temperature –20 °C to +75 °C - specifies ambient range for commercial/industrial deployment without extended qualification

Pinout & Package

HD6417750F167 is housed in a 208-pin plastic quad flat pack (QFP) with 0.5 mm lead pitch, measuring 28 mm × 28 mm. The package supports standard reflow soldering and provides mechanical stability for high-pin-count microprocessor applications.

Pin/Terminal Circuit Role Design Meaning
VDD, VSS Core power and ground Dedicated 1.8 V core supply pins with adjacent ground pairs - require local low-ESR decoupling for stable CPU operation
VDDQ, VSSQ I/O power and ground 3.3 V I/O supply domain - isolates signal integrity from core switching noise and enables mixed-voltage interfacing
CLKIN, EXTAL, XTAL External clock input/resonator connections Supports crystal or external clock source for PLL generation - determines system clock accuracy and jitter sensitivity
RESET, RES# Asynchronous reset input Active-low synchronous reset - initiates hardware initialization sequence and clears internal registers and caches
A0–A23, D0–D31 Address and data bus lines Multiplexed 24-bit address / 32-bit data bus - requires external latch or bus controller for demultiplexing in non-mux mode
CS0#–CS7#, RD#, WR#, OE#, WE# Chip select and bus control signals Configurable memory and peripheral select timing - enables direct connection to SRAM, Flash, SDRAM, and PCMCIA without address decoding logic

Key Features

Feature Design Value
SH-4 CPU Core Superscalar execution with dual integer pipelines and FPU - delivers >200 MIPS at 167 MHz for real-time multimedia processing
Integrated MMU Hardware-accelerated virtual-to-physical address translation - enables full-featured OS porting and memory protection in multi-tasking environments
Dual Serial Interfaces SCI (UART-compatible) + SCIF (FIFO-enhanced UART) - supports simultaneous debug console, modem, and peripheral communication
Real-Time Clock (RTC) Independent 32.768 kHz timekeeping with calendar function - maintains accurate time across power cycles without host CPU intervention
Bus State Controller (BSC) Programmable wait-state generator for SRAM/Flash/SDRAM - eliminates need for external timing logic and simplifies memory subsystem design
Smart Card Interface Dedicated ISO/IEC 7816-3 compliant interface - enables secure authentication and payment functionality in kiosk and terminal applications

Applications

Digital Set-Top Box Industrial HMI Terminal

Use Scenario: Decoding MPEG-2 video streams while managing conditional access, EPG, and network connectivity in broadcast reception systems.

IC Role / Device Role / Timing Role: Main application processor executing middleware and media decode tasks with deterministic interrupt latency for AV synchronization.

Use Value: Integrated MMU and caches reduce external memory bandwidth pressure, enabling smooth 720p playback using cost-effective SDRAM.

Use Scenario: Operator interface in factory automation systems requiring touchscreen control, PLC communication, and local data logging.

IC Role / Device Role / Timing Role: Central controller running real-time OS with deterministic response to I/O events and serial fieldbus protocols.

Use Value: Dual SCI/SCIF interfaces allow concurrent Modbus RTU and debug channel usage; RTC ensures accurate timestamping of process events.

Secure Payment Terminal Legacy Automotive Infotainment

Use Scenario: EMV-compliant point-of-sale device handling encrypted card transactions, PIN entry, and receipt printing.

IC Role / Device Role / Timing Role: Secure application processor managing cryptographic operations, smart card interface, and peripheral drivers.

Use Value: On-die smart card interface meets ISO/IEC 7816-3 electrical and protocol requirements - eliminates external interface IC and reduces BOM count.

Use Scenario: In-vehicle navigation and audio system in pre-2010 automotive platforms requiring DVD playback and CAN gateway functionality.

IC Role / Device Role / Timing Role: Multimedia SoC coordinating video decode, audio DAC control, and vehicle bus bridging via external CAN controller.

Use Value: 167 MHz SH-4 performance sustains DVD video decode while leaving headroom for GUI rendering and system management tasks.

Equivalent & Alternatives

The following parts are listed as comparable options for similar 32-bit RISC microprocessor applications.

Alternative Part Technical Difference Application Difference Selection Advice
HD6417750SF200 Higher 200 MHz clock speed, same 1.8 V core, identical 208-pin QFP package Enables higher throughput in compute-bound applications; requires tighter timing closure on external bus Select when additional MIPS margin is needed without changing PCB layout or power delivery
HD6417750SVF133 Lower 133 MHz operation, 1.5 V core voltage, same 208-pin QFP footprint Better power efficiency for thermally constrained or battery-assisted systems; reduced EMI emissions Select for cost-sensitive or low-power deployments where 167 MHz headroom is unnecessary

Compared with HD6417750F167, HD6417750SF200 offers +33 MHz performance within identical thermal and mechanical constraints, while HD6417750SVF133 trades 34 MHz for 0.3 V lower core voltage and ~25% dynamic power reduction - enabling differentiated trade-offs between performance, power, and thermal design.

Availability

HD6417750F167 is available at Aetrix Electronics and suitable for digital set-top boxes, industrial HMIs, secure payment terminals, and legacy automotive infotainment systems requiring stable component supply and long-term obsolescence management.

Supply support for HD6417750F167 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Renesas Electronics Corporation is a Japanese semiconductor manufacturer specializing in microcontrollers, analog, power, and SoC solutions for industrial, automotive, and infrastructure markets.

The SH7750 Series was designed as a high-performance 32-bit RISC microprocessor platform for multimedia-rich embedded systems, targeting applications demanding real-time processing, memory management, and peripheral integration without external co-processors.

FAQ

What is the core architecture of the HD6417750F167?

The HD6417750F167 implements the SH-4 32-bit RISC superscalar CPU core with a five-stage pipeline, dual-issue execution capability, and an integrated IEEE 754-compliant floating-point unit. This architecture delivers over 200 MIPS at its rated 167 MHz frequency and forms the foundation of the SH7750S Group's performance profile. The HD6417750F167 uses this core to enable real-time multimedia processing in resource-constrained embedded systems.

Does the HD6417750F167 include an MMU, and what does it support?

Yes, the HD6417750F167 integrates a full Memory Management Unit (MMU) with unified TLB support for virtual-to-physical address translation. It enables page-based memory protection, context switching, and OS-level features required by Linux, VxWorks, or other protected-mode operating systems. The HD6417750F167's MMU is essential for applications needing multitasking, memory isolation, or large virtual address spaces beyond physical RAM limits.

What package type and pin count does the HD6417750F167 use?

The HD6417750F167 is packaged in a 208-pin plastic quad flat pack (QFP) with 0.5 mm lead pitch and 28 mm × 28 mm body size. This package is compatible with standard surface-mount assembly processes and provides sufficient I/O density for memory buses, peripherals, and debug interfaces. The HD6417750F167 shares this footprint with other SH7750S variants like HD6417750SF200 and HD6417750SVF133, enabling drop-in frequency scaling.

What are the supported external memory interfaces for the HD6417750F167?

The HD6417750F167 supports ROM, SRAM, DRAM, synchronous DRAM (SDRAM), and PCMCIA via its programmable Bus State Controller (BSC). It handles 64-bit SDRAM with four-bank configuration and supports 32-bit data bus widths. The HD6417750F167's BSC eliminates external wait-state logic by allowing software-configurable timing parameters for each chip select, simplifying memory subsystem design across diverse storage technologies.

Is the HD6417750F167 suitable for automotive applications?

The HD6417750F167 is specified for commercial and industrial temperature ranges (–20 °C to +75 °C) and classified by Renesas as a "Standard" quality grade product, intended for applications such as office equipment, communications gear, and industrial robots - not transportation or safety-critical automotive systems. While used historically in pre-2010 infotainment units, the HD6417750F167 does not meet AEC-Q100 or extended temperature qualifications required for modern automotive deployment.

HD6417750F167 Specifications

Product attributes
Attribute value
Manufacturer:
Renesas
Package/Case:
208-BFQFP Exposed Pad
Series:
SuperH® SH7750
Packaging:
Bulk
Product Status:
Obsolete
Programmable:
Not Verified
Core Processor:
SH-4
Core Size:
32-Bit Single-Core
Speed:
167MHz
Connectivity:
EBI/EMI, FIFO, SCI, SmartCard
Peripherals:
DMA, POR, WDT
Number of I/O:
28
Program Memory Size:
-
Program Memory Type:
ROMless
EEPROM Size:
-
RAM Size:
24K x 8
Voltage - Supply (Vcc/Vdd):
1.6V ~ 2V
Data Converters:
-
Oscillator Type:
External
Operating Temperature:
-20°C ~ 75°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

HD6417750F167 FAQ

1.How can I place an order for HD6417750F167 through Aetrix?

Please submit a Request for Quotation (RFQ) for HD6417750F167 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for HD6417750F167 reliable?

The price and inventory of HD6417750F167 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for HD6417750F167 is usually 5 days.

3.What payment methods are accepted for HD6417750F167?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for HD6417750F167 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for HD6417750F167?

HD6417750F167 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your HD6417750F167 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for HD6417750F167?

For technical support, including HD6417750F167 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your HD6417750F167 requirements.

6.How does Aetrix verify that HD6417750F167 is sourced from the original manufacturer or authorized distributors?

All HD6417750F167 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that HD6417750F167 meets industry standards.

7.What is the process for return or replacement of HD6417750F167?

All HD6417750F167 units undergo pre-shipment inspection (PSI). If there is an issue with HD6417750F167, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The HD6417750F167 part is unused and in its original packaging.

Return procedure for HD6417750F167:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

HD6417750F167 Tags

  • HD6417750F167
  • HD6417750F167 PDF
  • HD6417750F167 Datasheet
  • HD6417750F167 Specifications
  • HD6417750F167 Images
  • Renesas
  • Renesas HD6417750F167
  • Buy HD6417750F167
  • HD6417750F167 Price
  • HD6417750F167 Distributor
  • HD6417750F167 Supplier
  • HD6417750F167 Wholesale
Related Products
ATTINY4-TSHR
ATTINY4-TSHR

Microchip Technology

ATTINY10-TSHR
ATTINY10-TSHR

Microchip Technology

ATTINY10-TS8R
ATTINY10-TS8R

Microchip Technology

ATTINY202-SSNR
ATTINY202-SSNR

Microchip Technology

ATTINY202-SSFR
ATTINY202-SSFR

Microchip Technology

ATTINY402-SSNR
ATTINY402-SSNR

Microchip Technology

PIC16F15213T-I/MF
PIC16F15213T-I/MF

Microchip Technology

PIC16F15213-E/MF
PIC16F15213-E/MF

Microchip Technology

PIC10F200T-I/OT
PIC10F200T-I/OT

Microchip Technology

ATTINY412-SSNR
ATTINY412-SSNR

Microchip Technology

PIC10F202T-I/OT
PIC10F202T-I/OT

Microchip Technology

ATTINY404-SSNR
ATTINY404-SSNR

Microchip Technology

Tech Hub

Search

Search

PRODUCT

PRODUCT

PHONE

PHONE

USER

USER