Renesas HD6417750RBP200V

Overview

HD6417750RBP200V from Renesas Electronics is a 32-bit RISC microprocessor in the SH7750R Group, implementing the SuperH™ SH-4 CPU core. It operates at 200 MHz with 1.5 V internal supply voltage, integrates an MMU, 16 KB instruction cache, 16 KB operand cache, and peripheral modules including dual SCIF, RTC, UBC, BSC, and smart card interface. It targets high-performance embedded multimedia systems requiring real-time OS support and memory protection.

For engineers reviewing the HD6417750RBP200V datasheet, HD6417750RBP200V pinout, HD6417750RBP200V application, or HD6417750RBP200V equivalent, key selection criteria include its 256-pin BGA package, -20°C to +75°C operating temperature range, 1.5 V core voltage, SH-4 ISA compatibility, and integrated memory management for Linux-capable designs.

Technical Context

The HD6417750RBP200V implements the full SH-4 architecture with dual-issue superscalar execution, five-stage pipeline, and IEEE 754-compliant FPU. Its memory subsystem includes unified TLB with 64 entries, hardware-managed caches, and MMU supporting both single/multiple virtual memory modes with ASID-based context switching.

Peripheral integration follows SH-4 system-on-chip principles: the bus state controller (BSC) supports synchronous DRAM, PCMCIA, and 64-bit data bus configurations; dual serial interfaces (SCIF) provide UART/IRDA-capable asynchronous communication; and the user break controller (UBC) enables non-intrusive real-time debugging without software overhead.

Key Specifications

Pinout & Package

HD6417750RBP200V uses a 256-pin fine-pitch ball grid array (BGA) package with 17 mm × 17 mm body size and 1.0 mm ball pitch. The package complies with JEDEC MO-205AC and supports standard reflow profiles for lead-free assembly.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar 32-bit RISC microprocessor applications.

Compared with HD6417750RBP200V, the HD6417750RBA240HV offers higher frequency and extended temperature at identical package size, while HD6417750RBG200 provides same electrical specs in a larger, thermally enhanced BGA - neither is pin-compatible, requiring layout adaptation for migration.

Availability

HD6417750RBP200V is available at Aetrix Electronics and suitable for set-top box baseband processing, digital media player control units, industrial HMI controllers, and networked audio streaming terminals requiring stable component supply throughout product lifecycles.

Supply support for HD6417750RBP200V includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Renesas Electronics Corporation is a Japanese semiconductor manufacturer specializing in microcontrollers, analog, power, and SoC solutions for automotive, industrial, and enterprise applications.

The SH7750R Group was designed as a high-performance embedded processor family targeting multimedia-rich consumer electronics and industrial human-machine interfaces requiring full-featured OS support and deterministic real-time response.

FAQ

What is the maximum operating frequency of the HD6417750RBP200V?

The HD6417750RBP200V is rated for a maximum operating frequency of 200 MHz at 1.5 V internal supply voltage. This frequency is guaranteed across the full -20°C to +75°C operating temperature range with VDDQ maintained between 3.0 V and 3.6 V. The device achieves 360 MIPS peak performance using the SH-4 dual-issue superscalar architecture, and timing compliance is verified per Table 22.25 in the Hardware Manual Rev. 7.02.

Does the HD6417750RBP200V include an integrated memory management unit (MMU)?

Yes, the HD6417750RBP200V integrates a full-featured MMU supporting both single and multiple virtual memory modes. It features a 64-entry unified TLB with ASID support, enabling secure process isolation and full Linux kernel porting. The MMU handles address translation, protection violation detection, and initial page write exceptions as documented in Section 3 of the Hardware Manual, making HD6417750RBP200V suitable for POSIX-compliant OS deployments.

What package type and pin count does the HD6417750RBP200V use?

The HD6417750RBP200V uses a 256-pin fine-pitch BGA package measuring 17 mm × 17 mm with 1.0 mm ball pitch (JEDEC MO-205AC compliant). Pin functions are defined in Section 1.4.1 of the Hardware Manual, including dedicated VDD/VSS pairs for core power, VDDQ/VSSQ for I/O, dual SCIF signal groups, and 64-bit data bus lines. This package shares footprint compatibility with HD6417750SBP200 but differs from HD6417750RBA240HV's enhanced thermal variant.

Which serial communication interfaces are integrated into the HD6417750RBP200V?

The HD6417750RBP200V integrates two independent Serial Communication Interface (SCIF) modules - SCIF0 and SCIF1 - each supporting UART-mode asynchronous communication with programmable baud rates, 16-byte FIFOs, and hardware flow control. These interfaces are fully functional at 200 MHz operation and support IRDA physical layer signaling per Section 22.3.4 timing tables. They enable concurrent debugging (via SCIF0) and peripheral communication (via SCIF1) without resource contention.

Is the HD6417750RBP200V suitable for automotive applications?

No, the HD6417750RBP200V is classified as a "Standard" quality grade device per Renesas documentation and is intended for computers, office equipment, audiovisual gear, and industrial robots - not transportation systems. Its -20°C to +75°C operating range and qualification profile do not meet AEC-Q100 requirements. For automotive use, Renesas specifies "High Quality" parts like HD6417751RBA240HV (rated -40°C to +85°C), which undergo additional reliability screening and are explicitly approved for automotive infotainment systems.