Renesas HD6417750SBP200V

Overview

HD6417750SBP200V from Renesas Electronics is a 32-bit RISC microprocessor based on the SuperH™ SH-4 CPU core, operating at 200 MHz with 1.95 V internal supply voltage and housed in a 256-pin BGA package. It integrates an MMU, 16 KB instruction cache, 16 KB operand cache, real-time clock, dual serial interfaces (SCI/SCIF), and bus controller supporting DRAM, SDRAM, and PCMCIA. It targets high-performance embedded multimedia systems requiring deterministic real-time processing.

For engineers reviewing the HD6417750SBP200V datasheet, HD6417750SBP200V pinout, HD6417750SBP200V application, or HD6417750SBP200V equivalent, key selection criteria include its 200 MHz SH-4 execution capability, 256-pin BGA thermal/mechanical profile, MMU-enabled OS support (e.g., Linux, VxWorks), and compatibility with synchronous DRAM and 64-bit data bus architectures.

Technical Context

The HD6417750SBP200V implements the full SH-4 instruction set architecture with superscalar dual-issue pipeline, five-stage integer execution, and separate 16 KB instruction and operand caches. Its memory management unit supports virtual-to-physical address translation via unified TLB with ASID-based context switching for multitasking OS environments.

Peripheral integration includes a programmable bus state controller (BSC) for flexible memory mapping, two asynchronous serial interfaces (SCI and SCIF), real-time clock (RTC), user break controller (UBC), and smart card interface - all accessible via dedicated register-mapped I/O spaces without CPU intervention overhead.

Key Specifications

Pinout & Package

HD6417750SBP200V uses a 256-pin fine-pitch ball grid array (BGA) package with 17 mm × 17 mm body size and 1.0 mm ball pitch. The package complies with JEDEC MO-207 and supports reflow soldering per IPC/JEDEC J-STD-020.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar 32-bit RISC microprocessor applications.

Compared with HD6417750SBP200V, HD6417750SBA200V offers identical functional capability but demands board-level mechanical adaptation, while HD6417750RBP240 delivers higher throughput at the cost of voltage domain incompatibility and software porting effort.

Availability

HD6417750SBP200V is available at Aetrix Electronics and suitable for set-top box development, digital media player production, and industrial HMI deployment requiring stable component supply across extended product lifecycles.

Supply support for HD6417750SBP200V includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Renesas Electronics Corporation is a Japanese semiconductor manufacturer specializing in microcontrollers, analog, power, and SoC solutions for industrial, automotive, and enterprise applications.

The SH7750 Series was designed as a high-performance 32-bit RISC microprocessor platform targeting multimedia-rich embedded systems requiring OS support, real-time responsiveness, and integrated peripheral flexibility.

FAQ

What is the maximum operating frequency of the HD6417750SBP200V?

The HD6417750SBP200V operates at a guaranteed maximum frequency of 200 MHz under specified conditions: VDD = 1.95 V, VDDQ = 3.3 V, and ambient temperature between –20 °C and +75 °C. This frequency is validated per Renesas Hardware Manual Rev. 7.02, Table 1.1 and Section 22.2 DC Characteristics. The HD6417750SBP200V achieves 360 MIPS peak performance at this clock rate using its dual-issue SH-4 core.

Does the HD6417750SBP200V include an integrated memory management unit (MMU)?

Yes, the HD6417750SBP200V includes a full-featured MMU supporting virtual memory management, ASID-based context switching, and unified TLB with both instruction and data translation capabilities. This MMU is essential for running protected-mode operating systems such as Linux or VxWorks, and is documented in Sections 3 and 3.1 of the Renesas SH7750 Group Hardware Manual. The HD6417750SBP200V's MMU implementation enables secure multitasking and memory isolation in complex embedded applications.

What package type and pin count does the HD6417750SBP200V use?

The HD6417750SBP200V uses a 256-pin fine-pitch ball grid array (BGA) package measuring 17 mm × 17 mm with 1.0 mm ball pitch. This package is distinct from the ONPAC-BGA variant used by HD6417750SBA200V and is defined in Appendix B, Figure B.1 of the Renesas Hardware Manual. The HD6417750SBP200V's pinout supports 64-bit data bus width, 32-bit address bus, eight chip selects, and dedicated power/ground distribution optimized for high-speed signal integrity.

Which serial communication interfaces are integrated into the HD6417750SBP200V?

The HD6417750SBP200V integrates two independent serial communication interfaces: one Serial Communication Interface (SCI) and one Serial Communication Interface with FIFO (SCIF). The SCI provides standard UART functionality with programmable baud rate generation, while the SCIF adds 16-byte transmit/receive FIFOs and enhanced DMA support for high-throughput data transfer. Both interfaces are register-mapped and fully documented in Sections 13 and 14 of the Renesas Hardware Manual. These interfaces enable reliable host-peripheral communication in HD6417750SBP200V-based systems without external UART ICs.

Is the HD6417750SBP200V suitable for automotive applications?

No, the HD6417750SBP200V is rated for industrial temperature range (–20 °C to +75 °C) and classified as a "Standard" quality grade device per Renesas documentation, intended for computers, office equipment, and multimedia systems-not transportation or safety-critical applications. Automotive use would require "High Quality" grade parts such as those qualified to AEC-Q100, which the HD6417750SBP200V is not. Renesas explicitly restricts HD6417750SBP200V usage to non-safety-critical domains as stated in the Notice section of the Hardware Manual.