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Renesas HD6417750SF200V

Part No.:
HD6417750SF200V
Manufacturer:
Renesas
Category:
Microcontrollers
Package:
208-BFQFP Exposed Pad
Datasheet:
AetrixHD6417750SF200V.pdf
Description:
IC MCU 32BIT ROMLESS 208HQFP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:261

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Product details

Overview

HD6417750SF200V from Renesas Electronics is a 32-bit RISC microprocessor in the SH7750S Group, implementing the SuperH™ SH-4 CPU core. It operates at 200 MHz with 1.8 V internal supply voltage, integrates on-chip MMU, 16 KB instruction cache and 16 KB operand cache, and targets high-performance multimedia system control. It is used in embedded multimedia equipment requiring real-time processing and memory management.

For engineers reviewing the HD6417750SF200V datasheet, HD6417750SF200V pinout, HD6417750SF200V application, or HD6417750SF200V equivalent, key selection criteria include its 208-pin QFP package, 200 MHz clock frequency, 1.8 V core voltage, integrated MMU and dual caches, and support for synchronous DRAM and PCMCIA bus interfaces.

Technical Context

The HD6417750SF200V implements the SH-4 superscalar RISC architecture with five-stage pipeline, dual-issue capability, and IEEE 754-compliant floating-point unit. It features a unified 32-bit address/data bus interface compatible with ROM, SRAM, DRAM, SDRAM (including 64-bit 4-bank), and PCMCIA.

Hardware peripherals include memory management unit (MMU), interrupt controller, two serial communication interfaces (SCI/SCIF), real-time clock (RTC), user break controller (UBC), bus state controller (BSC), and smart card interface - all integrated on-die without external glue logic.

Key Specifications

ParameterValue and Actual Design Meaning
Core ArchitectureSuperH™ SH-4 32-bit RISC, superscalar, dual-issue, 5-stage pipeline
Operating Frequency200 MHz - enables real-time video/audio processing in multimedia systems
Internal Supply Voltage1.8 V - reduces dynamic power consumption vs. 1.95 V SH7750S variants
Cache Memory16 KB instruction cache + 16 KB operand cache - improves code execution efficiency and data throughput
Memory ManagementIntegrated MMU with TLB - supports virtual memory, multitasking OS environments like Linux or VxWorks
Package Type208-pin plastic QFP - surface-mount compatible with standard reflow profiles and manual debug access
Operating Temperature–20 °C to +75 °C - suitable for commercial/industrial indoor multimedia equipment

Pinout & Package

HD6417750SF200V is housed in a 208-pin plastic quad flat pack (QFP) with 0.5 mm lead pitch, 28 mm × 28 mm body size, and standard JEDEC MO-118AC footprint. Pin functions are defined per Section 1.4.2 of the Hardware Manual (R01UH0456EJ0702).

Pin/TerminalCircuit RoleDesign Meaning
VDD, VSSPower and ground terminalsDedicated core (1.8 V) and I/O (3.0–3.6 V) supply domains; decoupling required per pin group
CLKIN, EXTAL, XTALExternal clock input/resonator connectionsSupports crystal oscillator or external clock source; PLL generates internal 200 MHz core clock
A0–A31, D0–D31Address and data bus lines32-bit multiplexed address/data bus; supports burst transfers and wait-state insertion
CS0–CS7, RD, WR, OEChip select and bus control signalsConfigurable memory mapping across up to 8 banks; enables direct connection to SDRAM, Flash, and peripherals
INTL0–INTL15, IRQ0–IRQ15Interrupt request inputsTwo-level priority interrupt controller with maskable vectorized interrupts for real-time response
SCIF0_TXD/SCIF0_RXD, SCIF1_TXD/SCIF1_RXDSerial communication interface channelsFull-duplex UART-compatible interfaces supporting baud rates up to 15 Mbps for host/device connectivity

Key Features

FeatureDesign Value
On-chip MMU with 64-entry TLBEnables full POSIX-compliant OS support and secure memory partitioning across multiple tasks
Dual 16 KB caches (instruction + operand)Reduces average memory access latency to <2 cycles for cached code/data, improving IPC
64-bit wide SDRAM interface supportAllows direct attachment of high-bandwidth external memory without external bus-width converters
Real-time clock (RTC) with battery backup inputProvides autonomous timekeeping during system sleep or main power loss
Smart card interface (ISO/IEC 7816-3)Eliminates need for external protocol controller in secure authentication or payment terminal designs

Applications

Digital Set-Top BoxAutomotive Infotainment Head Unit

Use Scenario: Real-time decoding of MPEG-2/4 video streams and audio playback while managing UI rendering and network connectivity.

IC Role / Device Role / Timing Role: Main application processor executing OS, media framework, and driver stack; synchronizes video/audio clocks via internal timers and RTC.

Use Value: Integrated MMU and dual caches enable deterministic task scheduling and low-latency buffer handling for seamless A/V playback.

Use Scenario: Central control unit managing navigation, Bluetooth hands-free, AM/FM tuner, and rear-seat entertainment in mid-tier vehicles.

IC Role / Device Role / Timing Role: System-on-chip host processor interfacing with CAN/LIN for vehicle bus comms and SPI/I²C for peripheral sensors and displays.

Use Value: 200 MHz SH-4 core delivers sufficient MIPS for concurrent multi-threaded operation without external co-processors.

Industrial HMI TerminalNetworked Media Player

Use Scenario: Operator interface for PLC-controlled machinery with touch GUI, data logging, and Ethernet-based remote monitoring.

IC Role / Device Role / Timing Role: Real-time controller running deterministic UI engine and TCP/IP stack; uses SCIF for RS-485 fieldbus bridging.

Use Value: On-chip BSC and SDRAM interface simplify memory subsystem design, reducing BOM count and layout complexity.

Use Scenario: Streaming media client retrieving content over 10/100 Ethernet and rendering to HDMI or analog video outputs.

IC Role / Device Role / Timing Role: Application processor handling network stack, file system, codec decode, and display timing generation via programmable timers.

Use Value: Integrated RTC and smart card interface support conditional access (CA) modules for pay-TV compliance.

Equivalent & Alternatives

The following parts are listed as comparable options for similar 32-bit RISC microprocessor applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
HD6417750SBP200256-pin BGA, 1.95 V core, same 200 MHz frequency but higher core voltage and different package thermal profilePreferred for space-constrained PCBs where BGA density is acceptable and thermal dissipation allowsSelect when board area is limited and automated assembly is available; requires tighter layout tolerances than QFP
HD6417750RBA240HV292-pin BGA, 1.5 V core, 240 MHz, extended temperature range (–40 to +85 °C), higher performance and lower powerSuitable for automotive or industrial environments requiring wider operating temperature and higher throughputChoose for mission-critical applications needing higher clock rate, broader temp range, and enhanced reliability grade

Compared with HD6417750SF200V, HD6417750SBP200 offers identical performance in a smaller-footprint BGA but demands more complex assembly, while HD6417750RBA240HV provides 20% higher clock speed, lower core voltage, and extended temperature rating - making it appropriate for harsher environments at the cost of package compatibility and legacy toolchain alignment.

Availability

HD6417750SF200V is available at Aetrix Electronics and suitable for digital set-top boxes, automotive infotainment head units, and industrial HMI terminals requiring stable component supply and long-term lifecycle support.

Supply support for HD6417750SF200V includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Renesas Electronics Corporation is a Japanese semiconductor manufacturer specializing in microcontrollers, analog, power, and SoC solutions for automotive, industrial, and enterprise applications.

The SH7750 Series was designed as a high-performance 32-bit RISC microprocessor platform for multimedia-rich embedded systems, emphasizing real-time processing, memory management, and peripheral integration for cost-sensitive consumer and industrial markets.

FAQ

What is the core architecture of the HD6417750SF200V?

The HD6417750SF200V implements the SuperH™ SH-4 32-bit RISC architecture, featuring a superscalar five-stage pipeline, dual-issue capability, and an IEEE 754-compliant floating-point unit. This architecture enables high instruction-per-cycle throughput and deterministic real-time behavior essential for multimedia applications. The HD6417750SF200V executes instructions at 200 MHz with 1.8 V core supply, distinguishing it from earlier SH7750 variants.

Does the HD6417750SF200V include an integrated memory management unit (MMU)?

Yes, the HD6417750SF200V includes a fully integrated MMU with 64-entry translation lookaside buffer (TLB), supporting virtual memory addressing, memory protection, and multitasking OS environments such as Linux or VxWorks. This MMU is functionally identical across the SH7750S Group and is documented in Section 3 of the Hardware Manual R01UH0456EJ0702. The HD6417750SF200V leverages this MMU for secure, scalable software deployment.

What package type and pin count does the HD6417750SF200V use?

The HD6417750SF200V uses a 208-pin plastic quad flat pack (QFP) package with 0.5 mm lead pitch and JEDEC MO-118AC mechanical dimensions. This package is explicitly listed in Table I.1 and Appendix B of the Hardware Manual (R01UH0456EJ0702) and differs from the BGA packages used by other SH7750S variants like HD6417750SBP200. The HD6417750SF200V's QFP form factor supports manual prototyping and standard reflow assembly.

What is the operating temperature range for the HD6417750SF200V?

The HD6417750SF200V is rated for an operating temperature range of –20 °C to +75 °C, as confirmed in Table I.1 and Section 22.1 of the Hardware Manual R01UH0456EJ0702. This specification applies to the standard-grade version; extended temperature variants (e.g., –40 °C to +85 °C) are available under different part numbers such as HD6417750RBA240HV, but are not applicable to the HD6417750SF200V itself.

Which peripheral interfaces are integrated into the HD6417750SF200V?

The HD6417750SF200V integrates a comprehensive set of peripherals including two serial communication interfaces (SCI/SCIF), real-time clock (RTC), user break controller (UBC), bus state controller (BSC), interrupt controller, timers, and smart card interface (ISO/IEC 7816-3). These are detailed in Section 1.1 and Chapter 13–21 of the Hardware Manual. All peripherals are accessible via memory-mapped registers and require no external controllers - a key feature of the HD6417750SF200V's system-on-chip design.

HD6417750SF200V Specifications

Product attributes
Attribute value
Manufacturer:
Renesas
Package/Case:
208-BFQFP Exposed Pad
Series:
SuperH® SH7750
Packaging:
Tray
Product Status:
Obsolete
Programmable:
Not Verified
Core Processor:
SH-4
Core Size:
32-Bit Single-Core
Speed:
200MHz
Connectivity:
EBI/EMI, FIFO, SCI, SmartCard
Peripherals:
DMA, POR, WDT
Number of I/O:
28
Program Memory Size:
-
Program Memory Type:
ROMless
EEPROM Size:
-
RAM Size:
24K x 8
Voltage - Supply (Vcc/Vdd):
1.8V ~ 2.07V
Data Converters:
-
Oscillator Type:
External
Operating Temperature:
-20°C ~ 75°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

HD6417750SF200V FAQ

1.How can I place an order for HD6417750SF200V through Aetrix?

Please submit a Request for Quotation (RFQ) for HD6417750SF200V on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for HD6417750SF200V reliable?

The price and inventory of HD6417750SF200V are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for HD6417750SF200V is usually 5 days.

3.What payment methods are accepted for HD6417750SF200V?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for HD6417750SF200V transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for HD6417750SF200V?

HD6417750SF200V orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your HD6417750SF200V order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for HD6417750SF200V?

For technical support, including HD6417750SF200V datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your HD6417750SF200V requirements.

6.How does Aetrix verify that HD6417750SF200V is sourced from the original manufacturer or authorized distributors?

All HD6417750SF200V products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that HD6417750SF200V meets industry standards.

7.What is the process for return or replacement of HD6417750SF200V?

All HD6417750SF200V units undergo pre-shipment inspection (PSI). If there is an issue with HD6417750SF200V, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The HD6417750SF200V part is unused and in its original packaging.

Return procedure for HD6417750SF200V:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

HD6417750SF200V Tags

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