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Renesas HD6417751RBP200V

Part No.:
HD6417751RBP200V
Manufacturer:
Renesas
Category:
Microcontrollers
Package:
256-BBGA
Datasheet:
AetrixHD6417751RBP200V.pdf
Description:
IC MCU 32BIT ROMLESS 256BGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:3,008

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Product details

Overview

HD6417751RBP200V from Renesas Electronics is a 32-bit RISC microprocessor in the SH7751R Group, implementing the SuperH™ SH-4 CPU core. It operates at 200 MHz with 1.5 V core voltage and integrates an MMU, FPU, PCI controller, dual serial interfaces (SCI/SCIF), RTC, and cache memory. It targets embedded multimedia systems requiring real-time processing and peripheral integration.

For engineers reviewing the HD6417751RBP200V datasheet, HD6417751RBP200V pinout, HD6417751RBP200V application, or HD6417751RBP200V equivalent, key selection factors include its 256-pin BGA package, 200 MHz clock speed, 1.5 V core supply, PCI bus interface capability, and industrial temperature range support (–20 to +75°C).

Technical Context

The HD6417751RBP200V implements the SH-4 architecture with a five-stage pipeline, superscalar execution, and integrated floating-point unit compliant with IEEE 754. Its memory management unit supports virtual memory translation via unified TLB and multiple ASID contexts for multitasking OS environments.

It features a 16 KB instruction cache and 16 KB operand cache, both write-back capable, and includes a dedicated PCI controller supporting 32-bit/33 MHz bus mastering and target operations. The device uses separate 1.5 V core (VDD) and 3.3 V I/O (VDDQ) supplies with defined DC and AC timing across its operating temperature range.

Key Specifications

Parameter Value and Actual Design Meaning
CPU Core SuperH™ SH-4 32-bit RISC, superscalar, five-stage pipeline with FPU
Operating Frequency 200 MHz - determines maximum instruction throughput and real-time response latency
Core Supply Voltage 1.5 V ±0.1 V - defines power delivery requirements and thermal design margin
I/O Supply Voltage 3.0–3.6 V (VDDQ) - sets compatible logic family interface levels and termination needs
Package 256-pin BGA (17 mm × 17 mm, 1.0 mm pitch) - dictates PCB layout density and thermal pad routing
Operating Temperature –20°C to +75°C - specifies environmental qualification for industrial-grade deployment
PCI Interface 32-bit/33 MHz compliant master/target - enables direct connection to standard PC peripherals and expansion cards

Pinout & Package

The HD6417751RBP200V is housed in a 256-pin ball grid array (BGA) package with 17 mm × 17 mm body size and 1.0 mm ball pitch. Thermal pad exposed on underside requires solder paste stencil design and ground plane connection per Renesas recommended layout guidelines.

Pin/Terminal Circuit Role Design Meaning
VDD, VDD-PLL1/2 Core power supply 1.5 V input for CPU, FPU, and PLL circuits; requires low-noise local decoupling
VDDQ, VDD-RTC, VDD-CPG I/O and peripheral power supply 3.3 V input for PCI, SCI/SCIF, RTC, and clock generation; separate from core rail
CLKIN Main clock input Accepts external crystal or oscillator signal; feeds PLL1 for internal 200 MHz generation
RESET Asynchronous reset input Active-low signal initiating hardware reset sequence; must be held low ≥10 ms after power stabilization
AD0–AD31 PCI address/data multiplexed bus 32-bit bidirectional time-multiplexed bus; requires external latch and timing control for non-burst transfers
PCIREQ, PCIGNT PCI bus arbitration signals Open-drain outputs for shared bus arbitration; require pull-up resistors to VDDQ

Key Features

Feature Design Value
Integrated MMU with TLB Supports full virtual memory management for Linux and other protected-mode OS deployments
Dual serial interfaces (SCI/SCIF) Enables concurrent asynchronous communication with modems, sensors, or debug hosts without external UARTs
Real-time clock (RTC) with battery backup Provides persistent timekeeping independent of main power; supports alarm and periodic interrupt
Cache-enhanced memory subsystem 16 KB instruction + 16 KB operand caches reduce external memory bandwidth demand and improve deterministic latency
PCI controller with DMA engine Offloads host CPU during high-throughput data transfers; supports scatter-gather and burst mode

Applications

Digital Set-Top Box Industrial HMI Controller

Use Scenario: Real-time decoding of MPEG-2/4 video streams while managing conditional access, EPG, and remote UI rendering.

IC Role / Device Role / Timing Role: Main application processor executing OS, media framework, and driver stack; provides PCI interface for demodulator and tuner cards.

Use Value: Integrated FPU and cache enable smooth video playback at 200 MHz without external co-processors; MMU ensures secure application isolation.

Use Scenario: Operator interface for PLC-based automation systems with touch display, data logging, and Ethernet gateway functions.

IC Role / Device Role / Timing Role: Central controller running real-time OS, handling GUI rendering, serial fieldbus communication (RS-485), and local storage via PCI-connected CompactFlash.

Use Value: Dual SCI/SCIF ports support simultaneous Modbus RTU and ASCII protocols; RTC maintains accurate timestamping for event logs.

Networked Media Player Medical Imaging Display Terminal

Use Scenario: Local playback of streamed DICOM or JPEG2000 medical images over Gigabit Ethernet with local annotation and zoom controls.

IC Role / Device Role / Timing Role: Application processor interfacing with Ethernet MAC (via PCI), frame buffer memory, and touch controller; executes image decompression and UI rendering.

Use Value: 200 MHz SH-4 core delivers sufficient MIPS for real-time JPEG2000 decode; PCI bus allows low-latency access to external video memory.

Use Scenario: Standalone diagnostic display unit receiving X-ray or ultrasound images via DICOM over TCP/IP and rendering them with calibrated grayscale.

IC Role / Device Role / Timing Role: High-integrity display controller managing frame buffer, gamma correction LUT, and safety-critical watchdog supervision.

Use Value: Hardware RTC ensures audit-trail timestamps meet regulatory traceability requirements; isolated VDD/VDDQ rails prevent noise coupling into analog display paths.

Equivalent & Alternatives

The following parts are listed as comparable options for similar 32-bit RISC microprocessor applications.

Alternative Part Technical Difference Application Difference Selection Advice
HD6417751RBP240 240 MHz operation, same 256-pin BGA package, identical peripheral set Higher performance for compute-intensive tasks; requires tighter power delivery and thermal management Select when application demands >20% higher instruction throughput and board layout accommodates increased power dissipation
HD6417751RBG200 292-pin BGA package (23 mm × 23 mm), same 200 MHz/1.5 V specs, additional PCI and I/O pins Supports expanded peripheral connectivity and enhanced PCI signaling integrity via extra ground/power balls Choose when system requires more PCI address space, additional GPIO, or improved EMI performance at cost of larger PCB footprint

Compared with HD6417751RBP200V, the HD6417751RBP240 offers higher clock frequency but identical packaging and thermal envelope, whereas the HD6417751RBG200 provides greater I/O flexibility and noise immunity at the expense of board area and component height - both require revalidation of power delivery, signal integrity, and thermal design.

Availability

HD6417751RBP200V is available at Aetrix Electronics and suitable for digital set-top boxes, industrial HMIs, networked media players, and medical imaging terminals requiring stable component supply across extended production lifecycles.

Supply support for HD6417751RBP200V includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Renesas Electronics Corporation is a global semiconductor leader specializing in microcontrollers, analog, power, and SoC solutions for automotive, industrial, and enterprise applications.

The SH7751R Group, including HD6417751RBP200V, was designed for high-performance embedded multimedia systems requiring integrated PCI, real-time processing, and OS-ready memory management - targeting set-top boxes, industrial controllers, and medical displays.

FAQ

What is the core architecture of the HD6417751RBP200V?

The HD6417751RBP200V implements the SuperH™ SH-4 32-bit RISC CPU core with superscalar execution, five-stage pipeline, and integrated IEEE 754-compliant floating-point unit. It supports both little-endian and big-endian data formats and includes hardware MMU and cache controllers essential for real-time OS environments.

Does the HD6417751RBP200V support PCI bus mastering?

Yes, the HD6417751RBP200V includes a fully compliant PCI controller supporting both master and target modes at 32-bit/33 MHz. It provides programmable BARs, DMA engine, and arbitration logic (PCIREQ/PCIGNT), enabling direct control of PCI peripherals such as network adapters or storage controllers without external bridge chips.

What are the power supply requirements for HD6417751RBP200V?

The HD6417751RBP200V requires two independent supplies: 1.5 V ±0.1 V for the core (VDD, VDD-PLL1/2) and 3.0–3.6 V for I/O and peripherals (VDDQ, VDD-RTC, VDD-CPG). Each rail must be decoupled with low-ESR capacitors near respective power balls, and sequencing must ensure VDD stabilizes before VDDQ to prevent latch-up.

Is the HD6417751RBP200V pin-compatible with other SH7751R variants?

The HD6417751RBP200V shares the same 256-pin BGA footprint and pinout as HD6417751RBP240 and HD6417751F200, enabling drop-in replacement for frequency-scaling or thermal optimization. However, it is not pin-compatible with the 292-pin HD6417751RBG200 due to differing ball count, spacing, and I/O allocation.

What temperature grades are available for HD6417751RBP200V?

The HD6417751RBP200V is specified for industrial temperature operation from –20°C to +75°C. A wider-range variant, HD6417751RBA240HV, supports –40°C to +85°C but uses a different 256-pin QFP package and is not interchangeable with the BGA-packaged HD6417751RBP200V without PCB redesign.

HD6417751RBP200V Specifications

Product attributes
Attribute value
Manufacturer:
Renesas
Package/Case:
256-BBGA
Series:
SuperH® SH7750
Packaging:
Tray
Product Status:
Obsolete
Programmable:
Not Verified
Core Processor:
SH-4
Core Size:
32-Bit Single-Core
Speed:
200MHz
Connectivity:
EBI/EMI, FIFO, SCI, SmartCard
Peripherals:
DMA, POR, WDT
Number of I/O:
39
Program Memory Size:
-
Program Memory Type:
ROMless
EEPROM Size:
-
RAM Size:
48K x 8
Voltage - Supply (Vcc/Vdd):
1.35V ~ 1.6V
Data Converters:
-
Oscillator Type:
External
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

HD6417751RBP200V FAQ

1.How can I place an order for HD6417751RBP200V through Aetrix?

Please submit a Request for Quotation (RFQ) for HD6417751RBP200V on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for HD6417751RBP200V reliable?

The price and inventory of HD6417751RBP200V are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for HD6417751RBP200V is usually 5 days.

3.What payment methods are accepted for HD6417751RBP200V?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for HD6417751RBP200V transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for HD6417751RBP200V?

HD6417751RBP200V orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your HD6417751RBP200V order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for HD6417751RBP200V?

For technical support, including HD6417751RBP200V datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your HD6417751RBP200V requirements.

6.How does Aetrix verify that HD6417751RBP200V is sourced from the original manufacturer or authorized distributors?

All HD6417751RBP200V products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that HD6417751RBP200V meets industry standards.

7.What is the process for return or replacement of HD6417751RBP200V?

All HD6417751RBP200V units undergo pre-shipment inspection (PSI). If there is an issue with HD6417751RBP200V, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The HD6417751RBP200V part is unused and in its original packaging.

Return procedure for HD6417751RBP200V:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

HD6417751RBP200V Tags

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