Renesas HD64F3670FPV
- Part No.:
- HD64F3670FPV
- Manufacturer:
- Renesas
- Category:
- Microcontrollers
- Package:
- 64-LQFP
- Datasheet:
-
HD64F3670FPV.pdf
- Description:
- IC MCU 16BIT 8KB FLASH 64LQFP
- Quantity:
- Payment:

- Shipping:

Inventory:1,068
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Product details
Overview
HD64F3670FPV from Renesas Electronics is a 16-bit single-chip microcontroller in the H8/300H Tiny Series, featuring an H8/300H CPU core with instruction compatibility to the H8/300, 32 KB on-chip ROM, 2 KB RAM, and integrated peripherals including timers, serial interfaces (SCI), and I/O ports. It operates at up to 20 MHz and targets embedded control in industrial equipment and consumer appliances.
For engineers reviewing the HD64F3670FPV datasheet, HD64F3670FPV pinout, HD64F3670FPV application, or HD64F3670FPV equivalent, key selection criteria include its 64-pin LQFP package, 3.3 V/5 V dual-voltage operation support, on-chip flash programming capability, and low-power sleep/standby modes for energy-constrained systems.
Technical Context
The HD64F3670FPV implements the H8/300H CPU architecture with 16-bit data bus and 24-bit address space, supporting both big-endian memory layout and 16/32-bit register operations. Its system clock generator accepts crystal, ceramic resonator, or external clock inputs, with programmable prescalers enabling flexible timing configuration across operating modes.
Peripheral integration includes two 16-bit timer/counters (with input capture/output compare), one 8-bit timer, a serial communication interface (SCI) compatible with UART protocols, and 48 general-purpose I/O pins configurable as inputs, outputs, or alternate-function signals. Power management is handled via SYSCR1/SYSCR2 registers controlling Sleep, Standby, and Subsleep modes.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | H8/300H 16-bit RISC core, instruction-compatible with H8/300; enables legacy code reuse and toolchain continuity. |
| ROM Size | 32 KB on-chip mask ROM; provides non-volatile program storage without external memory interface. |
| RAM Size | 2 KB on-chip RAM; sufficient for real-time stack, variables, and small buffers in compact control applications. |
| Max Operating Frequency | 20 MHz; defines maximum instruction throughput and peripheral timing margins for deterministic response. |
| I/O Pins | 48 programmable I/O pins; supports direct sensor interfacing, actuator control, and discrete signal handling. |
| Supply Voltage | 3.3 V ±0.3 V or 5.0 V ±10%; allows deployment in mixed-voltage systems without level-shifting circuitry. |
| Package | 64-pin LQFP (14 mm × 14 mm, 0.8 mm pitch); standard surface-mount footprint compatible with automated assembly. |
Pinout & Package
HD64F3670FPV is housed in a 64-pin Low-Profile Quad Flat Package (LQFP) with exposed thermal pad, rated for industrial temperature range (–40°C to +85°C). Pin numbering follows standard counter-clockwise convention starting from the index corner.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCC | Primary power supply | Connects to 3.3 V or 5 V main supply rail; decoupling capacitor required per Renesas layout guidelines. |
| GND | Digital ground reference | Provides return path for core logic and I/O circuits; must be connected to low-impedance ground plane. |
| RESET | Active-low reset input | Asynchronous reset signal; must be held low ≥1024 cycles after power stabilization to ensure reliable initialization. |
| CLK | External clock input | Accepts external clock source (up to 20 MHz); used when crystal oscillator is not employed. |
| XTAL | Clock oscillator input | Connects to crystal or ceramic resonator (1–20 MHz); forms Pierce oscillator with internal inverter and load capacitors. |
| PORTx (e.g., P0–P7) | Bi-directional I/O port | Configurable as general-purpose digital I/O or alternate functions (e.g., SCI TX/RX, timer I/O); direction controlled by port mode registers. |
| NMI | Non-maskable interrupt input | Edge-triggered interrupt for critical events; reserved for on-chip emulator (E7/E8) during debug; not available in production use. |
Key Features
| Feature | Design Value |
|---|---|
| On-chip Flash Programming Support | Enables in-system programming via boot mode or user program mode using dedicated FLMCR and EBR registers. |
| Multiple Power-Down Modes | Sleep, Standby, and Subsleep modes reduce current consumption to <10 µA (Standby), extending battery life in portable devices. |
| Integrated Serial Interface (SCI) | Full-duplex UART-compatible channel with programmable baud rate, parity, and stop bits for host/device communication. |
| Timer Resources | Two 16-bit timers with input capture/output compare and one 8-bit timer support precise timing, PWM generation, and event counting. |
| Hardware Reset Circuit | Internal power-on reset (POR) and low-voltage detection (LVD) ensure safe startup and brown-out recovery without external components. |
Applications
| Industrial Motor Control | Home Appliance Control Panel |
|---|---|
Use Scenario: Embedded controller for washing machine drum motor sequencing, water valve actuation, and user interface feedback. IC Role / Device Role / Timing Role: Central MCU executing state-machine logic, driving triac/relay outputs, sampling front-panel buttons and LED indicators. Use Value: 48 I/O pins enable direct connection to sensors, switches, and drivers; 20 MHz operation ensures sub-millisecond response to safety-critical events. |
Use Scenario: Main control unit in microwave oven managing cooking time, power level, keypad scan, and display driver signals. IC Role / Device Role / Timing Role: System-on-chip processor handling real-time cooking algorithm, fault monitoring (door open, overheat), and human-machine interaction. Use Value: On-chip 32 KB ROM stores full firmware; integrated SCI simplifies communication with display module; low-power modes reduce standby consumption. |
| Office Equipment Power Management | Factory Automation I/O Module |
Use Scenario: Standby controller in multifunction printer managing wake-on-LAN, sleep transition, and power sequencing of laser engine and paper feed subsystems. IC Role / Device Role / Timing Role: Dedicated power supervisor coordinating voltage rails, monitoring AC detect, and asserting reset to main SoC upon wake event. Use Value: Subsleep mode draws <50 µA; POR/LVD prevents erratic behavior during line fluctuations; 64-pin LQFP allows compact PCB layout near power stage. |
Use Scenario: Distributed digital I/O node in PLC rack receiving field sensor inputs (limit switches, photoelectric sensors) and driving solenoid valves. IC Role / Device Role / Timing Role: Isolated I/O processor translating 24 V DC field signals to 3.3 V logic levels and buffering commands from master controller via RS-485. Use Value: 48 GPIO pins support 32 inputs + 8 outputs with configurable pull-ups; SCI supports robust RS-485 half-duplex communication at 115.2 kbps. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar 16-bit microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| HD64F3672FPV | Same H8/3672 group; 64 KB ROM, identical pinout and peripheral set; higher memory capacity. | Preferred where firmware size exceeds 32 KB or future expansion requires additional code space. | Select HD64F3672FPV if application firmware grows beyond 32 KB or requires guaranteed headroom for updates. |
| R5F100LEAFB | RL78/G13 16-bit MCU; 128 KB flash, 12 KB RAM, lower active current (120 µA/MHz); different architecture and toolchain. | Targets newer designs prioritizing ultra-low power and larger memory; requires migration from H8 toolchain to CS+ or e2 studio. | Choose R5F100LEAFB for new designs requiring extended battery life or >32 KB firmware, accepting toolchain transition effort. |
Compared with HD64F3670FPV, HD64F3672FPV offers double ROM without layout changes, while R5F100LEAFB delivers superior power efficiency and memory scalability at the cost of architectural discontinuity and software rework.
Availability
HD64F3670FPV is available at Aetrix Electronics and suitable for industrial motor control, home appliance control panels, and factory automation I/O modules requiring stable component supply and long-term lifecycle support.
Supply support for HD64F3670FPV includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Renesas Electronics Corporation is a global semiconductor leader specializing in microcontrollers, analog, power, and SoC solutions for industrial, automotive, and infrastructure markets.
The HD64F3670FPV belongs to the H8/300H Tiny Series - a family of cost-optimized 16-bit MCUs designed for resource-constrained embedded control applications requiring reliability, low power, and mature development ecosystems.
FAQ
What is the maximum operating frequency of the HD64F3670FPV?
The HD64F3670FPV supports a maximum operating frequency of 20 MHz when powered at 5.0 V or 3.3 V. This frequency is achieved using an external crystal (up to 20 MHz), ceramic resonator, or clock input. The internal clock generator includes prescalers that allow division of the base clock for peripheral timing, ensuring deterministic timing across all modules within the HD64F3670FPV's operational envelope.
Does the HD64F3670FPV support in-system programming of its on-chip memory?
Yes, the HD64F3670FPV supports in-system programming via its built-in flash memory controller. Using boot mode or user program mode, firmware updates can be performed through the SCI interface or parallel programming pins. Key registers - FLMCR1, FLMCR2, EBR1, and FENR - manage erase, program, and verify operations, enabling field upgrades without removing the HD64F3670FPV from the target board.
What power-saving modes are available on the HD64F3670FPV?
The HD64F3670FPV implements three hardware-controlled low-power modes: Sleep (CPU halted, peripherals active), Standby (<10 µA typical), and Subsleep (intermediate current draw with fast wake-up). Mode entry is controlled via SYSCR1 and SYSCR2 registers. Wake-up sources include external interrupts, timer match events, and SCI receive activity - all configurable to meet strict energy budgets in battery-powered HD64F3670FPV applications.
Is the HD64F3670FPV pin-compatible with other members of the H8/367x family?
Yes, the HD64F3670FPV shares the same 64-pin LQFP package and pin assignment with HD64F3672FPV and HD64F3674FPV. Signal mapping for power, reset, clock, I/O ports, and peripheral functions (SCI, timers) is identical across these variants. This allows drop-in replacement where increased ROM (64 KB) or additional features (e.g., more timers) are needed - provided firmware and voltage requirements remain aligned for the HD64F3670FPV design context.
What development tools are officially supported for the HD64F3670FPV?
Renesas officially supports the HD64F3670FPV with the High-Performance Embedded Workshop (HEW) IDE, E8 in-circuit emulator, and the H8/300H Series C/C++ Compiler (document number REJ10B0058). Debugging is enabled via the NMI pin and dedicated on-chip debug circuitry. Application notes such as REJ05B0464 provide guidance on compiler optimization and flash programming workflows specific to the HD64F3670FPV and related H8/367x devices.
HD64F3670FPV Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Package/Case:
- 64-LQFP
- Series:
- H8® H8/300H Tiny
- Packaging:
- Tray
- Product Status:
- Last Time Buy
- Programmable:
- Not Verified
- Core Processor:
- H8/300H
- Core Size:
- 16-Bit
- Speed:
- 16MHz
- Connectivity:
- SCI
- Peripherals:
- PWM, WDT
- Number of I/O:
- 26
- Program Memory Size:
- 8KB (8K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 2K x 8
- Voltage - Supply (Vcc/Vdd):
- 3V ~ 5.5V
- Data Converters:
- A/D 4x10b
- Oscillator Type:
- External
- Operating Temperature:
- -20°C ~ 75°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
HD64F3670FPV FAQ
1.How can I place an order for HD64F3670FPV through Aetrix?
Please submit a Request for Quotation (RFQ) for HD64F3670FPV on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for HD64F3670FPV reliable?
The price and inventory of HD64F3670FPV are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for HD64F3670FPV is usually 5 days.
3.What payment methods are accepted for HD64F3670FPV?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for HD64F3670FPV transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for HD64F3670FPV?
HD64F3670FPV orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your HD64F3670FPV order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for HD64F3670FPV?
For technical support, including HD64F3670FPV datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your HD64F3670FPV requirements.
6.How does Aetrix verify that HD64F3670FPV is sourced from the original manufacturer or authorized distributors?
All HD64F3670FPV products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that HD64F3670FPV meets industry standards.
7.What is the process for return or replacement of HD64F3670FPV?
All HD64F3670FPV units undergo pre-shipment inspection (PSI). If there is an issue with HD64F3670FPV, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The HD64F3670FPV part is unused and in its original packaging.
Return procedure for HD64F3670FPV:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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