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Renesas HD64F3670FY
- Part No.:
- HD64F3670FY
- Manufacturer:
- Renesas
- Category:
- Microcontrollers
- Package:
- 48-LQFP
- Datasheet:
-
HD64F3670FY.pdf
- Description:
- IC MCU 16BIT 8KB FLASH 48LQFP
- Quantity:
- Payment:
- Shipping:
Inventory:1,268
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Product details
Overview
HD64F3670FY from Renesas Electronics is a 16-bit single-chip microcomputer in the H8/300H Tiny Series, featuring an H8/300H CPU core with H8/300 instruction set compatibility, 32 KB on-chip ROM, 2 KB RAM, and integrated peripherals including UART, timer/counters, and I/O ports. It operates at up to 20 MHz and targets embedded control in industrial equipment and consumer appliances.
For engineers reviewing the HD64F3670FY datasheet, HD64F3670FY pinout, HD64F3670FY application, or HD64F3670FY equivalent, key selection considerations include its 64-pin QFP package, flash-programmable ROM, low-power sleep/standby modes, and support for on-board programming via boot mode.
Technical Context
The HD64F3670FY implements the H8/300H CPU architecture with 16-bit data bus and 24-bit address space, enabling direct access to up to 16 MB memory. It integrates system control modules (clock generator, power-down controllers), on-chip peripheral modules (UART, 16-bit timers, watchdog), and flash memory controller supporting in-system programming.
Its clock system supports crystal resonator (1–20 MHz), ceramic resonator, or external clock input, with prescaler S for generating internal system clocks. Power management includes Sleep, Standby, and Subsleep modes controlled by SYSCR1/SYSCR2 registers and module-level standby via MSTCR1.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | H8/300H 16-bit RISC core, instruction-compatible with H8/300 for legacy code reuse |
| ROM Capacity | 32 KB on-chip flash ROM, programmable in-system via boot mode or user program mode |
| RAM Size | 2 KB on-chip SRAM, accessible without wait states at full 20 MHz operation |
| Max Operating Frequency | 20 MHz system clock, supported by internal prescalers and external resonator/clock input |
| I/O Pins | 52 general-purpose CMOS I/O pins with configurable pull-up, interrupt-capable inputs |
| Peripherals | UART (SCI), three 16-bit timers (one with input capture/output compare), watchdog timer, and clock pulse generators |
| Power Modes | Sleep, Standby, and Subsleep modes with register-retention and wake-up via external interrupt or timer |
Pinout & Package
HD64F3670FY is housed in a 64-pin plastic QFP (Quad Flat Package) with 0.5 mm pitch, JEDEC MS-026 compliant, suitable for surface-mount assembly and industrial temperature operation (−20°C to +75°C).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCC, VSS | Power supply and ground | Dual VCC (5 V) and VSS pins per side ensure stable core and I/O voltage distribution |
| XTAL, EXTAL | Clock input/output | Connects to external crystal or ceramic resonator; XTAL drives internal oscillator circuit |
| RESET | Active-low reset input | Asynchronous reset signal; must be held low ≥1024 cycles after power stabilization |
| IRQ0–IRQ7 | External interrupt inputs | Edge-selectable (rising/falling) interrupt sources mapped to priority levels 1–7 |
| TXD0, RXD0 | UART serial interface | Full-duplex asynchronous communication channel (SCI0), compatible with RS-232 level shifters |
| PORT A–G | Bi-directional I/O ports | 52 total CMOS I/O lines; port direction controlled per pin via data direction registers (DDR) |
Key Features
| Feature | Design Value |
|---|---|
| On-chip Flash Memory | 32 KB reprogrammable ROM with hardware/software erase protection and block-erase capability |
| Low-Power Operation | Subsleep mode draws ≤10 µA; wake-up latency <10 µs from all power-down states |
| On-Board Programming | Supports flash programming via UART in boot mode without external programmer hardware |
| Interrupt Architecture | 8-level priority interrupt controller with edge-selectable external IRQs and vectorized exception handling |
| Peripheral Integration | Single-chip solution eliminates need for external UART, timers, and clock generation components |
Applications
| Industrial Motor Control | Home Appliance Controller |
|---|---|
Use Scenario: Closed-loop speed regulation of BLDC motors in HVAC blowers and washing machine drum drives. IC Role / Device Role / Timing Role: Main system controller executing PID algorithms, managing PWM outputs, and monitoring hall-effect sensors via GPIO and timers. Use Value: On-chip 16-bit timers with input capture enable precise rotor position sampling; 32 KB flash accommodates field-oriented control firmware with safety checks. |
Use Scenario: User interface, sensor monitoring, and actuator sequencing in microwave ovens and rice cookers. IC Role / Device Role / Timing Role: Central MCU coordinating keypad scan, display driver, thermal cutoff logic, and relay timing via software-timed outputs. Use Value: 52 GPIO pins support direct matrix keypad and LED segment driving; low-power sleep mode extends battery life in backup clock circuits. |
| Point-of-Sale Terminal | Building Automation Sensor Node |
Use Scenario: Transaction coordination, display update, and peripheral handshaking in compact retail terminals. IC Role / Device Role / Timing Role: Embedded host processor interfacing with LCD, thermal printer, and barcode scanner via UART and parallel I/O. Use Value: UART (SCI0) provides reliable 9600–115200 bps serial communication; 2 KB RAM suffices for real-time transaction buffering and stack depth. |
Use Scenario: Environmental data acquisition and wireless transmission in smart lighting or HVAC zone controllers. IC Role / Device Role / Timing Role: Sensor aggregator reading temperature/humidity ADC inputs (via external converter), formatting packets, and triggering RF transceiver via GPIO. Use Value: Subsleep mode enables multi-year battery operation; interrupt-driven wake-up on sensor threshold crossing minimizes active time. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar 16-bit microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| HD64F3672F | Same H8/3672 group; 64 KB ROM, identical pinout and peripheral set, higher memory capacity | Preferred where firmware exceeds 32 KB or future-proofing for feature expansion is required | Select HD64F3672F if application requires >32 KB code space while retaining identical hardware design |
| HD64F3664F | Lower-density variant: 16 KB ROM, 1 KB RAM, same CPU core and peripheral IP but reduced memory and I/O count (48 pins) | Suitable for cost-sensitive, function-limited controls where full 52 I/O and 32 KB ROM are unnecessary | Choose HD64F3664F when BOM cost reduction is critical and memory/I/O headroom is not needed |
Compared with HD64F3670FY, HD64F3672F offers double ROM capacity without layout change, while HD64F3664F reduces pin count and memory to lower unit cost-enabling tiered product variants from a common platform.
Availability
HD64F3670FY is available at Aetrix Electronics and suitable for industrial motor control, home appliance controller, and point-of-sale terminal applications requiring stable component supply and long-term lifecycle support.
Supply support for HD64F3670FY includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Renesas Electronics Corporation is a global semiconductor leader specializing in microcontrollers, analog, power, and SoC solutions for industrial, automotive, and IoT markets.
The HD64F3670FY belongs to the H8/300H Tiny Series, designed for cost-effective, low-power embedded control in resource-constrained applications where code density, peripheral integration, and flash programmability are essential.
FAQ
What is the maximum operating frequency of the HD64F3670FY?
The HD64F3670FY supports a maximum system clock frequency of 20 MHz, achievable using an external crystal resonator (1–20 MHz range), ceramic resonator, or external clock source. Internal prescalers derive peripheral clocks from this master clock, and all on-chip resources-including 32 KB flash and 2 KB RAM-are fully functional without wait states at this speed.
Does the HD64F3670FY support in-system programming (ISP)?
Yes, the HD64F3670FY supports in-system programming via its built-in UART (SCI0) in boot mode. No external programmer is required: the device enters boot mode on power-up when the MODE0 pin is held high, allowing flash memory to be programmed, erased, or verified using a standard PC serial connection and Renesas-provided tools.
What power-saving modes does the HD64F3670FY offer?
The HD64F3670FY provides three low-power modes: Sleep (CPU halted, peripherals active), Standby (CPU and most peripherals halted, RAM retained), and Subsleep (deep sleep with ≤10 µA current, wake-up via IRQ or timer). Mode selection is controlled by SYSCR1/SYSCR2 registers, and wake-up latency is under 10 µs from any mode.
Is the HD64F3670FY pin-compatible with other H8/367x devices?
Yes, the HD64F3670FY shares the same 64-pin QFP package and pin assignment with HD64F3672F and HD64F3664F within the H8/3672 Group. This allows direct PCB footprint reuse across memory variants-enabling scalable design with minimal layout changes when upgrading or downgrading ROM/RAM capacity.
What development tools are officially supported for the HD64F3670FY?
Renesas officially supports the E7 and E8 in-circuit emulators for HD64F3670FY development, along with the High-Performance Embedded Workshop IDE, H8/300H C/C++ compiler (REJ10B0058), and simulator/debugger tools. Application notes such as REJ05B0464 provide guidance on compiler optimization and flash programming workflows specific to the H8/3672 Group.
HD64F3670FY Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Package/Case:
- 48-LQFP
- Series:
- H8® H8/300H Tiny
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Core Processor:
- H8/300H
- Core Size:
- 16-Bit
- Speed:
- 16MHz
- Connectivity:
- SCI
- Peripherals:
- PWM, WDT
- Number of I/O:
- 26
- Program Memory Size:
- 8KB (8K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 2K x 8
- Voltage - Supply (Vcc/Vdd):
- 3V ~ 5.5V
- Data Converters:
- A/D 4x10b
- Oscillator Type:
- External
- Operating Temperature:
- -20°C ~ 75°C
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
HD64F3670FY FAQ
1.How can I place an order for HD64F3670FY through Aetrix?
Please submit a Request for Quotation (RFQ) for HD64F3670FY on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for HD64F3670FY reliable?
The price and inventory of HD64F3670FY are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for HD64F3670FY is usually 5 days.
3.What payment methods are accepted for HD64F3670FY?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for HD64F3670FY transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for HD64F3670FY?
HD64F3670FY orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your HD64F3670FY order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for HD64F3670FY?
For technical support, including HD64F3670FY datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your HD64F3670FY requirements.
6.How does Aetrix verify that HD64F3670FY is sourced from the original manufacturer or authorized distributors?
All HD64F3670FY products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that HD64F3670FY meets industry standards.
7.What is the process for return or replacement of HD64F3670FY?
All HD64F3670FY units undergo pre-shipment inspection (PSI). If there is an issue with HD64F3670FY, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The HD64F3670FY part is unused and in its original packaging.
Return procedure for HD64F3670FY:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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