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Renesas HD64F3687DV
- Part No.:
- HD64F3687DV
- Manufacturer:
- Renesas
- Category:
- Microcontrollers
- Package:
- 64-LQFP
- Datasheet:
-
HD64F3687DV.pdf
- Description:
- IC MCU 16BIT 56KB FLASH 64LQFP
- Quantity:
- Payment:
- Shipping:
Inventory:3,373
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Product details
Overview
HD64F3687DV from Renesas Electronics is a 16-bit single-chip microcomputer in the H8/300H Tiny Series, featuring an H8/300H CPU core with H8/300 instruction set compatibility, 64 KB on-chip ROM, 4 KB RAM, and integrated peripherals including UART (SCI), timer modules, and I/O ports. It operates at up to 20 MHz and targets embedded control in industrial equipment and consumer appliances.
For engineers reviewing the HD64F3687DV datasheet, HD64F3687DV pinout, HD64F3687DV application, or HD64F3687DV equivalent, key selection criteria include its 64-pin LQFP package, 5 V operation, on-chip ROM execution capability, and support for low-power sleep/standby modes in resource-constrained systems.
Technical Context
The HD64F3687DV implements the H8/300H CPU architecture with 24-bit address space, supporting both big-endian and little-endian data access via software configuration. Its memory map includes dedicated areas for on-chip ROM (0x000000–0x00FFFF), RAM (0x010000–0x010FFF), and peripheral registers (0x011000–0x011FFF).
It integrates two 16-bit timer modules (TMR0/TMR1), one 8-bit timer (TMR2), a serial communication interface (SCI) with asynchronous mode, and a 16-channel 10-bit ADC - all accessible via memory-mapped I/O registers and controllable through dedicated control/status bits in SYSCR1, MSTCR1, and peripheral-specific registers.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | H8/300H 16-bit RISC core, instruction-compatible with H8/300, enabling legacy code reuse and toolchain continuity. |
| Max Operating Frequency | 20 MHz at 5 V supply - defines real-time response limits for control loops and interrupt latency in deterministic applications. |
| On-Chip Memory | 64 KB ROM (mask-programmed) + 4 KB RAM - eliminates external memory bus, reducing BOM cost and PCB footprint. |
| ADC Resolution | 10-bit successive-approximation ADC with 16 input channels - supports precision analog sensing without external converters. |
| Power Modes | Active, Sleep, Standby, Subsleep, Subactive - enables dynamic power scaling down to µA-level current in battery-backed systems. |
| I/O Pins | 52 programmable CMOS I/O pins with pull-up options - provides direct interface to switches, LEDs, sensors, and actuators. |
| Serial Interface | One full-duplex SCI channel supporting asynchronous communication at up to 1 Mbps - suitable for host diagnostics or sensor network bridging. |
Pinout & Package
HD64F3687DV is housed in a 64-pin LQFP (10 mm × 10 mm, 0.5 mm pitch) package with exposed thermal pad. Pin functions are defined per the H8/3687 Group Hardware Manual Rev.5.00 (2005), with dedicated power (VCC, VSS), reset (RES), clock (XIN/XOUT), and multifunction I/O (P0–P9) groups.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCC (Pins 1, 33, 64) | Primary power supply | 5 V ±10% supply input; three pins reduce IR drop and improve noise immunity in high-speed operation. |
| VSS (Pins 2, 34, 63) | Ground reference | Dedicated ground returns for digital core and I/O sections; decoupling required within 10 mm of each VCC/VSS pair. |
| RES (Pin 3) | Active-low reset input | Asynchronous reset assertion halts CPU, clears registers, and forces boot vector fetch from 0x000000. |
| XIN/XOUT (Pins 4, 5) | Crystal oscillator terminals | Supports 1–20 MHz crystal or ceramic resonator; internal feedback resistor enables single-component clock source. |
| P00–P07 (Pins 6–13) | Port 0 bidirectional I/O | Configurable as general-purpose I/O or alternate functions (e.g., TMR0 inputs, SCI TXD); pull-up enabled via POCR0 register. |
| P80–P87 (Pins 41–48) | Port 8 bidirectional I/O | Includes NMI (P80), INT0–INT3 (P81–P84), and ADC input channels (P85–P87); supports edge-triggered interrupts. |
Key Features
| Feature | Design Value |
|---|---|
| Mask-ROM program storage | Enables cost-optimized, high-volume production with fixed firmware; no external EPROM or flash required. |
| On-chip debug support | Compatible with E7/E8 in-circuit emulators via dedicated pins (P85–P87, NMI), allowing real-time trace and breakpoint debugging. |
| Multi-level power management | Five distinct power-down modes (Sleep, Standby, etc.) controlled by SYSCR1/MSTCR1, reducing active current to <1 mA and standby to <10 µA. |
| Peripheral clock gating | MSTCR1/MSTCR2 registers disable clocks to unused modules (e.g., SCI, TMR), eliminating dynamic power consumption in idle states. |
| Interrupt prioritization | Two-level priority scheme (IENR1/IENR2) with 32 interrupt sources, enabling deterministic response to time-critical events like ADC conversion completion. |
Applications
| Industrial Motor Control | Home Appliance UI |
|---|---|
Use Scenario: Closed-loop speed regulation of BLDC fans using PWM output and hall-sensor feedback. IC Role / Device Role / Timing Role: Real-time motor commutation controller executing PID algorithm at 10 kHz loop rate with precise 20 MHz timer resolution. Use Value: On-chip 10-bit ADC and dual 16-bit timers eliminate external signal conditioning and timing ICs, reducing system component count by 30%. | Use Scenario: Keypad scanning, LED display driving, and temperature monitoring in microwave ovens. IC Role / Device Role / Timing Role: System coordinator managing user input, display updates, and safety interlocks with sub-second response latency. Use Value: 52 GPIOs and integrated pull-ups enable direct connection to membrane keypads and 7-segment displays, avoiding discrete logic buffers. |
| Building Automation Sensor Node | POS Terminal Peripheral Controller |
Use Scenario: Battery-powered occupancy/light-level sensor aggregating data for wireless transmission. IC Role / Device Role / Timing Role: Low-power data acquisition node entering Subsleep mode between 10-second ADC sampling intervals. Use Value: Subsleep current <5 µA extends CR2032 battery life beyond 2 years, validated per H8/3687 Group electrical characteristics table. | Use Scenario: Barcode scanner interface module translating USB HID commands to parallel printer signals. IC Role / Device Role / Timing Role: Protocol bridge handling USB enumeration, command parsing, and parallel port timing synchronization. Use Value: Mask-ROM firmware ensures deterministic USB-to-parallel translation latency <100 µs, meeting POS transaction timing requirements. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar 16-bit microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| HD64F3687G | Same die, 64-pin PQFP package (14 mm × 20 mm, 0.8 mm pitch); higher thermal resistance than LQFP. | Suitable for legacy board designs with larger footprint tolerance; less optimal for compact industrial modules. | Select HD64F3687G only when existing PCB layout cannot accommodate 10 mm × 10 mm LQFP. |
| HD64F3694F | Enhanced variant with 128 KB ROM, 8 KB RAM, and additional SCI channel; pinout differs in P7/P8 pin assignments. | Required for applications needing larger firmware image or dual serial interfaces; not drop-in replaceable. | Choose HD64F3694F when firmware size exceeds 64 KB or dual asynchronous UARTs are mandatory. |
Compared with HD64F3687DV, HD64F3687G offers identical functionality in a larger PQFP package requiring PCB redesign, while HD64F3694F adds memory and peripherals but mandates layout changes due to non-identical pin mapping - making HD64F3687DV optimal for cost-sensitive, space-constrained 64 KB firmware deployments.
Availability
HD64F3687DV is available at Aetrix Electronics and suitable for industrial motor control, home appliance UI, building automation sensor nodes, and POS terminal peripheral controllers requiring stable component supply across extended product lifecycles.
Supply support for HD64F3687DV includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Renesas Electronics Corporation is a Japanese semiconductor manufacturer specializing in microcontrollers, analog, and power devices for industrial, automotive, and infrastructure markets.
The H8/3687 Group, including HD64F3687DV, was designed for cost-effective, low-power embedded control in consumer and industrial equipment where mask-ROM firmware stability and minimal external components are critical.
FAQ
What is the maximum operating frequency of the HD64F3687DV?
The HD64F3687DV operates at a maximum frequency of 20 MHz when supplied with 5 V ±10%. This rating is specified in the Electrical Characteristics section of the H8/3687 Group Hardware Manual Rev.5.00 and assumes proper decoupling and ambient temperature ≤70°C. Exceeding this frequency may result in undefined CPU behavior or register corruption.
Does the HD64F3687DV support in-circuit debugging?
Yes, the HD64F3687DV supports in-circuit debugging via Renesas E7 and E8 emulators. Pins P85, P86, and P87 serve as emulator interface lines, and the NMI pin is reserved for emulator use. Debug features include hardware breakpoints, real-time trace, and register inspection - all documented in Section 1.4 (Pin Functions) and Appendix D of the HD64F3687DV hardware manual.
What power supply voltage does the HD64F3687DV require?
The HD64F3687DV requires a nominal 5 V supply with tolerance of ±10% (4.5 V to 5.5 V), as confirmed in the Absolute Maximum Ratings and DC Characteristics tables of the H8/3687 Group datasheet. Operation outside this range risks latch-up, data corruption, or permanent damage. Three VCC pins (1, 33, 64) must be individually decoupled with 0.1 µF ceramic capacitors placed within 5 mm.
How much on-chip memory does the HD64F3687DV include?
The HD64F3687DV integrates 64 KB of mask-programmed ROM and 4 KB of RAM. The ROM stores executable firmware and constants, while the RAM provides stack, heap, and variable storage. Memory mapping is fixed: ROM occupies 0x000000–0x00FFFF, RAM occupies 0x010000–0x010FFF, and peripheral registers reside at 0x011000–0x011FFF - all verified in Section 2.1 of the HD64F3687DV Hardware Manual.
Is the HD64F3687DV RoHS compliant?
Yes, the HD64F3687DV meets EU RoHS Directive requirements, as stated in Renesas' environmental compliance documentation. Lead-free soldering profiles and halogen-free packaging are certified per JIS C 0950 and IEC 61249-2-21 standards. Full material declarations and test reports are available upon request from Renesas Electronics' environmental affairs department.
HD64F3687DV Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Package/Case:
- 64-LQFP
- Series:
- H8® H8/300H Tiny
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Core Processor:
- H8/300H
- Core Size:
- 16-Bit
- Speed:
- 20MHz
- Connectivity:
- I2C, SCI
- Peripherals:
- PWM, WDT
- Number of I/O:
- 45
- Program Memory Size:
- 56KB (56K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 4K x 8
- Voltage - Supply (Vcc/Vdd):
- 3V ~ 5.5V
- Data Converters:
- A/D 8x10b
- Oscillator Type:
- Internal
- Operating Temperature:
- -20°C ~ 75°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
HD64F3687DV FAQ
1.How can I place an order for HD64F3687DV through Aetrix?
Please submit a Request for Quotation (RFQ) for HD64F3687DV on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for HD64F3687DV reliable?
The price and inventory of HD64F3687DV are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for HD64F3687DV is usually 5 days.
3.What payment methods are accepted for HD64F3687DV?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for HD64F3687DV transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for HD64F3687DV?
HD64F3687DV orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your HD64F3687DV order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for HD64F3687DV?
For technical support, including HD64F3687DV datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your HD64F3687DV requirements.
6.How does Aetrix verify that HD64F3687DV is sourced from the original manufacturer or authorized distributors?
All HD64F3687DV products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that HD64F3687DV meets industry standards.
7.What is the process for return or replacement of HD64F3687DV?
All HD64F3687DV units undergo pre-shipment inspection (PSI). If there is an issue with HD64F3687DV, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The HD64F3687DV part is unused and in its original packaging.
Return procedure for HD64F3687DV:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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