Renesas HD64F3687FPIV
- Part No.:
- HD64F3687FPIV
- Manufacturer:
- Renesas
- Category:
- Microcontrollers
- Package:
- 64-LQFP
- Datasheet:
-
HD64F3687FPIV.pdf
- Description:
- IC MCU 16BIT 56KB FLASH 64LQFP
- Quantity:
- Payment:

- Shipping:

Inventory:2,174
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Product details
Overview
HD64F3687FPIV from Renesas Electronics is a 16-bit single-chip microcomputer in the H8/300H Tiny Series, featuring an H8/300H CPU core with H8/300 instruction set compatibility, 64 KB on-chip ROM, 4 KB RAM, and integrated peripherals including UART, timer/counters, and I/O ports. It operates at up to 20 MHz and targets embedded control in industrial equipment and consumer appliances.
For engineers reviewing the HD64F3687FPIV datasheet, HD64F3687FPIV pinout, HD64F3687FPIV application, or HD64F3687FPIV equivalent, key selection considerations include its 80-pin PQFP package, 5 V operation, ROM-based program storage, and support for low-power sleep/standby modes in resource-constrained systems.
Technical Context
The HD64F3687FPIV implements the H8/300H CPU architecture with 24-bit addressing, supporting both byte- and word-aligned memory access. Its on-chip system includes a programmable clock generator with main and subclock sources, prescalers (S and W), and power-down mode controllers (SYSCR1/SYSCR2, MSTCR1/MSTCR2) enabling fine-grained module-level standby.
Peripheral integration includes three serial communication interfaces (SCI), four 16-bit timers (two with input capture/output compare), a watchdog timer, and 64 general-purpose I/O pins distributed across eight ports (P0–P7). All interrupt sources are managed via dual interrupt enable/flag registers (IENR1/IENR2, IRR1/IRR2) with configurable edge detection (IEGR1/IEGR2).
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | H8/300H 16-bit RISC core, instruction-compatible with H8/300, enabling legacy code reuse |
| ROM Size | 64 KB on-chip mask ROM - fixed firmware storage, no external boot dependency |
| RAM Size | 4 KB on-chip RAM - sufficient for stack, variables, and small real-time buffers |
| Max Clock Frequency | 20 MHz - supports deterministic real-time response in motor control and sensor interface |
| Supply Voltage | 4.5 V to 5.5 V - compatible with standard 5 V industrial logic and peripheral buses |
| Package | 80-pin plastic quad flat pack (PQFP) - surface-mount compatible with automated assembly |
| Operating Temperature | −20 °C to +75 °C - rated for commercial/industrial ambient environments |
Pinout & Package
HD64F3687FPIV is housed in an 80-pin PQFP (Plastic Quad Flat Package) with 0.65 mm lead pitch, JEDEC MS-026 compliant, suitable for reflow soldering and high-density PCB layouts.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCC, VSS | Power supply and ground | Dual VCC/VSS pairs per side ensure stable core and I/O rail decoupling |
| RESET | Active-low reset input | Asynchronous reset with internal pull-up; initiates register initialization and vector fetch from 0x000000 |
| CLK, EXTAL, XTAL | Main clock oscillator terminals | Supports crystal (1–20 MHz), ceramic resonator, or external clock source for system timing |
| PORT0–PORT7 | Bi-directional I/O ports | 64 total I/O lines; each port configurable as input/output with internal pull-up options |
| TXD0–TXD2, RXD0–RXD2 | SCI transmit/receive signals | Three full-duplex UART channels for host communication, debugging, or peripheral bridging |
| INT0–INT7 | External interrupt inputs | Eight dedicated edge-triggered interrupt pins with independent enable/edge-select control |
Key Features
| Feature | Design Value |
|---|---|
| On-chip ROM with mask programming | Enables cost-effective high-volume production without external memory or bootloader complexity |
| Four 16-bit timer/counters | Supports PWM generation, pulse measurement, and periodic interrupt scheduling for motor or sensor timing |
| Three serial communication interfaces (SCI) | Allows concurrent RS-232/RS-485 links, debug console, and peripheral command channel |
| Multiple power-down modes (Sleep, Standby, Subsleep) | Reduces active current to µA range while retaining RAM content and wake-on-interrupt capability |
| Interrupt controller with 8 external + 16 internal sources | Enables responsive event-driven firmware without polling overhead or latency bottlenecks |
Applications
| Industrial Motor Control | Home Appliance MCU |
|---|---|
Use Scenario: Closed-loop speed regulation of BLDC fans or pump motors using hall-effect feedback. IC Role / Device Role / Timing Role: Primary system controller executing PID loop, generating PWM via timer outputs, and managing fault-safe shutdown. Use Value: On-chip 20 MHz timing, 64 KB ROM for motor algorithm storage, and 4 KB RAM for real-time variable buffering eliminate external memory and reduce BOM count. | Use Scenario: Washing machine main control unit managing water valves, heater, drum motor, and user interface. IC Role / Device Role / Timing Role: Central MCU coordinating sequential state machine, analog sensor reads (NTC), and relay/LED driver outputs. Use Value: Integrated SCI enables serial diagnostics and factory programming; 80-pin I/O supports direct connection to solenoids, displays, and safety interlocks. |
| POS Terminal Controller | Building Automation Node |
Use Scenario: Embedded controller in retail point-of-sale hardware handling barcode scanner, receipt printer, and cash drawer interface. IC Role / Device Role / Timing Role: Real-time coordinator interfacing with USB-to-serial bridge, thermal printer head, and secure payment module via UART. Use Value: Three SCI channels allow simultaneous connection to scanner (SCI0), printer (SCI1), and payment IC (SCI2) without multiplexing or software UART overhead. | Use Scenario: HVAC zone controller reading temperature/humidity sensors and driving damper actuators and fan relays. IC Role / Device Role / Timing Role: Low-power node executing periodic sensor polling, local decision logic, and Modbus RTU over RS-485. Use Value: Subsleep mode draws <100 µA while maintaining RTC and wake-on-sensor-interrupt, extending battery life in wireless or energy-harvested nodes. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar 16-bit microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| HD64F3687G | Same core and peripheral set, but in 80-pin LQFP package with different thermal pad and moisture sensitivity level | Identical functionality; selected when board layout requires LQFP footprint or enhanced thermal dissipation | Direct functional replacement; verify PCB land pattern and reflow profile compatibility |
| HD64F3684 | Lower memory configuration: 32 KB ROM, 2 KB RAM, same CPU and peripheral IP blocks | Suitable for simpler control tasks with reduced code size and data requirements | Select when application firmware fits within 32 KB and cost optimization is prioritized over future scalability |
Compared with HD64F3687FPIV, HD64F3687G offers identical electrical and functional behavior in an alternate package, while HD64F3684 reduces memory resources to lower cost-both require validation of pin mapping and thermal design but avoid architectural redesign.
Availability
HD64F3687FPIV is available at Aetrix Electronics and suitable for industrial motor control, home appliance MCU, POS terminal controller, and building automation node applications requiring stable component supply and long-term manufacturing continuity.
Supply support for HD64F3687FPIV includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Renesas Electronics Corporation is a Japanese semiconductor manufacturer specializing in microcontrollers, analog, power, and SoC solutions for industrial, automotive, and infrastructure markets.
The H8/3687 Group-including HD64F3687FPIV-is designed for cost-sensitive, high-reliability embedded control applications where deterministic real-time performance, low power, and on-chip integration reduce system complexity.
FAQ
What is the maximum operating frequency of the HD64F3687FPIV?
The HD64F3687FPIV supports a maximum system clock frequency of 20 MHz when using the main clock oscillator with an external crystal or resonator. This frequency is achievable across the full specified supply voltage range (4.5 V to 5.5 V) and operating temperature range (−20 °C to +75 °C). The HD64F3687FPIV's H8/300H CPU core executes most instructions in 1–2 clock cycles, enabling predictable real-time response for time-critical control loops.
Does the HD64F3687FPIV include on-chip flash memory or only ROM?
The HD64F3687FPIV features 64 KB of on-chip mask-programmed ROM-not flash memory. This ROM is programmed during wafer fabrication and cannot be electrically rewritten in-system. Firmware must be finalized before production, making HD64F3687FPIV ideal for high-volume, unchanging applications such as appliance controllers or industrial modules where security and code immutability are priorities.
How many serial communication interfaces does the HD64F3687FPIV support?
The HD64F3687FPIV integrates three independent serial communication interfaces (SCI0, SCI1, SCI2), each supporting full-duplex asynchronous communication with programmable baud rates, parity, and stop bits. These SCIs can operate simultaneously-for example, one for debugging output, one for sensor telemetry, and one for host command reception-without shared resources or software arbitration overhead in the HD64F3687FPIV's hardware design.
What power-saving modes are available on the HD64F3687FPIV?
The HD64F3687FPIV provides four low-power modes: Sleep, Standby, Subsleep, and Subactive. In Subsleep mode, the main clock stops while the subclock (32.768 kHz) remains active, allowing RTC functions and wake-on-interrupt with typical current draw below 100 µA. Sleep mode halts the CPU but retains full RAM and register contents, enabling fast wake-up (<1 µs) for event-driven responsiveness in the HD64F3687FPIV.
Is the HD64F3687FPIV pin-compatible with other members of the H8/3687 Group?
Yes, the HD64F3687FPIV is pin-compatible with other 80-pin variants in the H8/3687 Group, including HD64F3687G and HD64N3687G, sharing identical pin arrangement, signal definitions, and electrical characteristics. This allows drop-in substitution during design iteration or sourcing transitions-provided the target variant's memory configuration (e.g., ROM vs. OTP) and temperature grade match the HD64F3687FPIV's specifications.
HD64F3687FPIV Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Package/Case:
- 64-LQFP
- Series:
- H8® H8/300H Tiny
- Packaging:
- Tray
- Product Status:
- Last Time Buy
- Programmable:
- Not Verified
- Core Processor:
- H8/300H
- Core Size:
- 16-Bit
- Speed:
- 20MHz
- Connectivity:
- I2C, SCI
- Peripherals:
- PWM, WDT
- Number of I/O:
- 45
- Program Memory Size:
- 56KB (56K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 4K x 8
- Voltage - Supply (Vcc/Vdd):
- 3V ~ 5.5V
- Data Converters:
- A/D 8x10b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
HD64F3687FPIV FAQ
1.How can I place an order for HD64F3687FPIV through Aetrix?
Please submit a Request for Quotation (RFQ) for HD64F3687FPIV on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for HD64F3687FPIV reliable?
The price and inventory of HD64F3687FPIV are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for HD64F3687FPIV is usually 5 days.
3.What payment methods are accepted for HD64F3687FPIV?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for HD64F3687FPIV transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for HD64F3687FPIV?
HD64F3687FPIV orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your HD64F3687FPIV order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for HD64F3687FPIV?
For technical support, including HD64F3687FPIV datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your HD64F3687FPIV requirements.
6.How does Aetrix verify that HD64F3687FPIV is sourced from the original manufacturer or authorized distributors?
All HD64F3687FPIV products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that HD64F3687FPIV meets industry standards.
7.What is the process for return or replacement of HD64F3687FPIV?
All HD64F3687FPIV units undergo pre-shipment inspection (PSI). If there is an issue with HD64F3687FPIV, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The HD64F3687FPIV part is unused and in its original packaging.
Return procedure for HD64F3687FPIV:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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