Renesas HD64F3687GFPV
- Part No.:
- HD64F3687GFPV
- Manufacturer:
- Renesas
- Category:
- Microcontrollers
- Package:
- 64-LQFP
- Datasheet:
-
HD64F3687GFPV.pdf
- Description:
- IC MCU 16BIT 56KB FLASH 64LQFP
- Quantity:
- Payment:

- Shipping:

Inventory:394
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
HD64F3687GFPV from Renesas Electronics is a 16-bit single-chip microcomputer in the H8/300H Tiny Series, featuring an H8/300H CPU core with H8/300 instruction set compatibility, 128 KB on-chip ROM, 8 KB RAM, and integrated peripherals including 3-channel SCI, 2-channel timer/counters, and 8-channel 10-bit ADC. It operates at up to 20 MHz and targets embedded control in industrial equipment and consumer appliances.
For engineers reviewing the HD64F3687GFPV datasheet, HD64F3687GFPV pinout, HD64F3687GFPV application, or HD64F3687GFPV equivalent, key selection considerations include its 100-pin LQFP package, 3.3 V operation, ROM-based program storage, on-chip debug support via E7/E8 emulator, and qualification for Standard-grade applications per Renesas quality classification.
Technical Context
The HD64F3687GFPV implements the H8/300H CPU architecture with 24-bit address space, supporting both big-endian and little-endian data access modes. Its memory map includes dedicated areas for on-chip ROM (0x000000–0x1FFFF), RAM (0xFFE000–0xFFFFFF), and peripheral registers (0xF00000–0xF00FFF).
Power management is handled through four low-power modes-Sleep, Standby, Subsleep, and Subactive-with configurable module-level standby control via MSTCR1/MSTCR2 registers. Clock generation supports crystal (1–20 MHz), ceramic resonator, or external clock input, plus a separate 32.768 kHz subclock for real-time functions.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | H8/300H 16-bit RISC core, instruction-compatible with H8/300, enabling legacy code reuse. |
| ROM Size | 128 KB on-chip mask ROM, fixed program storage eliminating external memory interface requirements. |
| RAM Size | 8 KB on-chip RAM, sufficient for stack, variables, and small buffers in real-time control tasks. |
| Max Operating Frequency | 20 MHz system clock, delivering ~13.3 MIPS performance for deterministic motor or sensor control loops. |
| ADC Resolution | 10-bit successive-approximation ADC with 8 input channels, supporting analog monitoring of temperature, voltage, or position sensors. |
| I/O Pins | 80 general-purpose CMOS I/O pins, configurable as inputs, outputs, or peripheral function multiplexed signals. |
| Supply Voltage | 3.3 V ±0.3 V operation, compatible with modern low-voltage logic families and reducing power consumption vs. 5 V MCUs. |
Pinout & Package
HD64F3687GFPV is housed in a 100-pin LQFP (14 mm × 14 mm, 0.5 mm pitch) package with exposed thermal pad. Pin assignments follow Renesas' standardized H8/3687 Group layout, supporting full peripheral access and debug interface routing.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCC, VSS | Power supply and ground | Dual 3.3 V supply domains (I/O and core) with dedicated decoupling pins for noise suppression. |
| XTAL, EXTAL | Main clock input/output | Connects to 1–20 MHz crystal or resonator; internal oscillator circuit eliminates need for external capacitors in basic configurations. |
| CLKOUT | System clock output | Provides buffered 20 MHz clock signal for synchronizing external logic or test equipment. |
| RESET | Active-low reset input | Asynchronous reset pin requiring external pull-up; initiates hardware reset sequence clearing registers and halting CPU execution. |
| P00–P07 | Port 0 I/O | 8-bit bidirectional port with individual direction control; default function as general-purpose I/O, optionally multiplexed to timer or SCI signals. |
| P20–P27 | Port 2 I/O | Includes P21/RXD and P22/TXD for SCI channel 1, enabling UART communication without external level shifters. |
| P80–P87 | Port 8 I/O | Supports ADC input channels AD0–AD7; configured as analog inputs when ADC is enabled, otherwise digital I/O. |
| NMI | Non-maskable interrupt | Dedicated edge-triggered interrupt used exclusively by E7/E8 emulator; not available for user application use during debugging. |
Key Features
| Feature | Design Value |
|---|---|
| On-chip ROM with mask programming | Enables cost-effective high-volume production with factory-programmed firmware, eliminating field programming infrastructure. |
| Integrated 10-bit 8-channel ADC | Reduces BOM count and PCB area by integrating precision analog front-end for sensor interfacing without external converters. |
| Three independent serial interfaces (SCI) | Supports simultaneous host communication (SCI0), peripheral daisy-chaining (SCI1), and bootloader UART (SCI3), simplifying multi-protocol system design. |
| Four low-power operating modes | Extends battery life in portable equipment by reducing current draw to <10 µA in Standby mode while retaining RAM and register contents. |
| E7/E8 on-chip emulator support | Enables real-time debugging, breakpoint setting, and register inspection without requiring external JTAG adapters or intrusive probes. |
Applications
| Industrial Motor Control | Home Appliance Interface |
|---|---|
Use Scenario: Closed-loop speed and torque regulation in brushless DC fans and pump drivers using PWM outputs and ADC feedback. IC Role / Device Role / Timing Role: Primary controller executing PID algorithms, generating 3-phase PWM waveforms, and sampling current/voltage sensors at 10 kHz. Use Value: On-chip 20 MHz timing resolution and deterministic interrupt latency ensure precise phase alignment and jitter-free commutation. | Use Scenario: User interface and subsystem coordination in washing machines, including display driver, keypad scan, and water valve actuation. IC Role / Device Role / Timing Role: Central system manager handling real-time task scheduling, fault detection, and serial communication with display and sensor modules. Use Value: Integrated 80 GPIO pins eliminate external I/O expanders, while 128 KB ROM stores full UI state machine and safety logic. |
| Office Equipment Power Management | Test & Measurement Front-End |
Use Scenario: Standby power supervision and wake-on-event response in multifunction printers and copiers. IC Role / Device Role / Timing Role: Low-power supervisor monitoring line voltage, button presses, and network activity to transition between Active and Subsleep modes. Use Value: Subsleep mode draws <50 µA while maintaining RTC and interrupt wake capability, meeting Energy Star standby requirements. | Use Scenario: Signal conditioning and digitization in handheld multimeters and portable oscilloscope probes. IC Role / Device Role / Timing Role: Analog acquisition controller acquiring voltage/current samples via 10-bit ADC and formatting data for Bluetooth transmission. Use Value: Built-in 10-bit ADC with programmable sample-and-hold reduces external component count and improves measurement repeatability. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar 16-bit microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| HD64F3687GFP | Same die and functionality, but in 100-pin PQFP package (0.65 mm pitch) instead of LQFP (0.5 mm pitch); no thermal pad. | Less suitable for thermally constrained designs or automated optical inspection due to larger pitch and no exposed pad. | Select HD64F3687GFPV for improved thermal dissipation and fine-pitch SMT assembly compatibility. |
| HD64F3684GFPV | Lower memory configuration: 64 KB ROM, 4 KB RAM; identical pinout, clock, and peripheral set. | Targeted at cost-sensitive applications with simpler firmware and smaller data buffers, such as basic remote controls or LED drivers. | Choose HD64F3684GFPV where firmware size and RAM usage are under 64 KB/4 KB and BOM cost reduction is critical. |
Compared with HD64F3687GFP and HD64F3684GFPV, the HD64F3687GFPV offers superior thermal performance via its LQFP thermal pad and higher memory headroom for complex control algorithms-making it optimal for industrial-grade embedded systems requiring long-term reliability and field-upgradable firmware.
Availability
HD64F3687GFPV is available at Aetrix Electronics and suitable for industrial motor control, home appliance interface, and office equipment power management requiring stable component supply across extended production lifecycles.
Supply support for HD64F3687GFPV includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Renesas Electronics Corporation is a Japanese semiconductor manufacturer specializing in microcontrollers, analog, and power devices for industrial, automotive, and consumer markets.
The H8/3687 Group was designed for cost-sensitive, high-reliability embedded control applications where ROM-based firmware, low-power operation, and integrated analog peripherals reduce system complexity and bill-of-materials cost.
FAQ
What is the maximum operating frequency of the HD64F3687GFPV?
The HD64F3687GFPV supports a maximum system clock frequency of 20 MHz, achieved using an external crystal, ceramic resonator, or clock source connected to the XTAL/EXTAL pins. This frequency enables approximately 13.3 million instructions per second (MIPS) execution throughput, sufficient for real-time control tasks such as motor commutation and sensor data acquisition. The HD64F3687GFPV maintains timing integrity across its full operating temperature range of −20°C to +75°C.
Does the HD64F3687GFPV include on-chip debug support?
Yes, the HD64F3687GFPV provides native on-chip debug support for the Renesas E7 and E8 emulators. Debug features include hardware breakpoints, real-time register inspection, and memory read/write access during active execution. Note that NMI, P85, P86, and P87 pins are reserved for emulator use and cannot be assigned to user functions when debugging is enabled. The HD64F3687GFPV does not support SWD or JTAG interfaces.
What type of memory is used for program storage in the HD64F3687GFPV?
The HD64F3687GFPV uses 128 KB of on-chip mask-programmed ROM for program storage. This non-volatile memory is programmed during wafer fabrication and cannot be reprogrammed in the field. It ensures firmware immutability, security against accidental overwrite, and consistent boot behavior across production units. The HD64F3687GFPV does not include flash or EEPROM for user code storage.
How many analog-to-digital converter (ADC) channels does the HD64F3687GFPV support?
The HD64F3687GFPV integrates a single 10-bit successive-approximation ADC with eight input channels (AD0–AD7), mapped to Port 8 pins P80–P87. Conversion time is 10.5 µs per sample at maximum clock rate, supporting sampling rates up to 95 kSPS. The ADC includes built-in sample-and-hold and software-selectable reference voltage options (AVCC or internal bandgap).
Is the HD64F3687GFPV qualified for automotive applications?
No, the HD64F3687GFPV is classified as a Standard-grade Renesas product, intended for applications such as office equipment, consumer appliances, and industrial robots-not for automotive, medical life-support, or aerospace use. It meets RoHS compliance and operates over −20°C to +75°C, but lacks AEC-Q100 qualification, extended temperature range, or failure-in-time (FIT) data required for automotive deployment. For automotive use, consider Renesas' RH850 or RL78 families instead of the HD64F3687GFPV.
HD64F3687GFPV Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Package/Case:
- 64-LQFP
- Series:
- H8® H8/300H Tiny
- Packaging:
- Tray
- Product Status:
- Last Time Buy
- Programmable:
- Not Verified
- Core Processor:
- H8/300H
- Core Size:
- 16-Bit
- Speed:
- 20MHz
- Connectivity:
- I2C, SCI
- Peripherals:
- LVD, POR, PWM, WDT
- Number of I/O:
- 45
- Program Memory Size:
- 56KB (56K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 4K x 8
- Voltage - Supply (Vcc/Vdd):
- 3V ~ 5.5V
- Data Converters:
- A/D 8x10b
- Oscillator Type:
- Internal
- Operating Temperature:
- -20°C ~ 75°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
HD64F3687GFPV FAQ
1.How can I place an order for HD64F3687GFPV through Aetrix?
Please submit a Request for Quotation (RFQ) for HD64F3687GFPV on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for HD64F3687GFPV reliable?
The price and inventory of HD64F3687GFPV are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for HD64F3687GFPV is usually 5 days.
3.What payment methods are accepted for HD64F3687GFPV?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for HD64F3687GFPV transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for HD64F3687GFPV?
HD64F3687GFPV orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your HD64F3687GFPV order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for HD64F3687GFPV?
For technical support, including HD64F3687GFPV datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your HD64F3687GFPV requirements.
6.How does Aetrix verify that HD64F3687GFPV is sourced from the original manufacturer or authorized distributors?
All HD64F3687GFPV products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that HD64F3687GFPV meets industry standards.
7.What is the process for return or replacement of HD64F3687GFPV?
All HD64F3687GFPV units undergo pre-shipment inspection (PSI). If there is an issue with HD64F3687GFPV, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The HD64F3687GFPV part is unused and in its original packaging.
Return procedure for HD64F3687GFPV:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
HD64F3687GFPV Tags

-
ATTINY4-TSHR
Microchip Technology

-
ATTINY10-TSHR
Microchip Technology

-
ATTINY10-TS8R
Microchip Technology

-
ATTINY202-SSNR
Microchip Technology

-
ATTINY202-SSFR
Microchip Technology

-
ATTINY402-SSNR
Microchip Technology

-
PIC16F15213T-I/MF
Microchip Technology

-
PIC16F15213-E/MF
Microchip Technology

-
PIC10F200T-I/OT
Microchip Technology

-
ATTINY412-SSNR
Microchip Technology

-
PIC10F202T-I/OT
Microchip Technology

-
ATTINY404-SSNR
Microchip Technology
Tech Hub
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…

