Renesas HD64F3687GHV
- Part No.:
- HD64F3687GHV
- Manufacturer:
- Renesas
- Category:
- Microcontrollers
- Package:
- 64-BQFP
- Datasheet:
-
HD64F3687GHV.pdf
- Description:
- IC MCU 16BIT 56KB FLASH 64QFP
- Quantity:
- Payment:

- Shipping:

Inventory:4,748
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
HD64F3687GHV from Renesas Electronics is a 16-bit single-chip microcomputer in the H8/300H Tiny Series, featuring an H8/300H CPU core with H8/300 instruction set compatibility, 64 KB on-chip ROM, 4 KB RAM, and integrated peripherals including UART, timer/counters, and I/O ports. It operates at up to 20 MHz and targets embedded control applications in industrial equipment and consumer electronics.
For engineers reviewing the HD64F3687GHV datasheet, HD64F3687GHV pinout, HD64F3687GHV application, or HD64F3687GHV equivalent, key selection criteria include its 100-pin PQFP package, 5 V operation, ROM-based program storage, low-power sleep/standby modes, and peripheral integration for cost-sensitive real-time control systems.
Technical Context
The HD64F3687GHV implements the H8/300H CPU architecture with 24-bit addressing, supporting both byte- and word-aligned memory access. Its system clock generator accepts crystal (1–20 MHz), ceramic resonator, or external clock input, and includes independent subclock circuitry for 32.768 kHz RTC support.
Power management includes four low-power modes-Sleep, Standby, Subsleep, and Subactive-with configurable module-level standby via MSTCR1/MSTCR2 registers. Interrupt handling supports 63 sources with prioritized vectoring, edge-selectable external interrupts, and wakeup capability from all power-down states.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | H8/300H 16-bit RISC core, instruction-compatible with H8/300, enabling legacy code reuse. |
| ROM Capacity | 64 KB on-chip mask ROM, fixed program storage eliminating external memory footprint. |
| RAM Size | 4 KB on-chip RAM, sufficient for stack, variables, and small real-time data buffers. |
| Max Clock Frequency | 20 MHz system clock, delivering ~10 MIPS performance for deterministic control loops. |
| Supply Voltage | 4.5 V to 5.5 V operation, compatible with standard 5 V logic and industrial power rails. |
| I/O Pins | 80 general-purpose CMOS I/O pins with programmable pull-up resistors and interrupt-capable inputs. |
| Peripherals | 3-channel UART, 3x 16-bit timers (including PWM-capable), watchdog timer, and 10-bit ADC (on select variants). |
Pinout & Package
HD64F3687GHV is housed in a 100-pin plastic quad flat pack (PQFP) with 0.5 mm lead pitch, designed for surface-mount assembly and thermal dissipation in compact industrial modules.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCC, VSS | Power supply and ground | Dual VCC/VSS pairs ensure stable core and I/O rail decoupling; NC pins must remain unconnected. |
| XTAL1/XTAL2 | Crystal oscillator input/output | Supports fundamental-mode quartz crystals (1–20 MHz) for precise system timing. |
| RESET | Active-low reset input | Asynchronous reset assertion clears CPU state and initializes peripherals on power-up or fault recovery. |
| INT0–INT7 | External interrupt inputs | Edge-selectable (rising/falling) inputs mapped to priority levels for responsive event handling. |
| P00–P97 | Programmable I/O ports | 80 bidirectional CMOS ports with latch, direction, and pull-up control registers per port group. |
Key Features
| Feature | Design Value |
|---|---|
| H8/300H CPU Compatibility | Enables migration from H8/300 designs without instruction set rework or toolchain changes. |
| Integrated ROM + RAM | Eliminates need for external program memory, reducing BOM count and PCB area in cost-sensitive controllers. |
| Four Power-Down Modes | Subactive mode maintains RTC and serial communication while cutting CPU power, extending battery life in portable devices. |
| On-Chip Debug Support | Hardware debug interface compatible with E7/E8 emulators enables non-intrusive breakpoint and trace without dedicated debug pins. |
| Peripheral Module Standby | Independent enable/disable of UART, timers, and ADC via MSTCR registers reduces dynamic power during idle intervals. |
Applications
| Industrial Motor Control | Home Appliance MCU |
|---|---|
Use Scenario: Closed-loop speed and position control of BLDC motors in HVAC blowers and washing machine drum drives. IC Role / Device Role / Timing Role: Primary controller executing PID algorithms, managing PWM outputs, and monitoring current/voltage feedback via ADC and GPIO. Use Value: On-chip 20 MHz timing and 3x 16-bit timers with capture/compare enable precise 3-phase commutation without external timing ICs. | Use Scenario: System management in microwave ovens, including keypad scanning, display driving, safety interlock monitoring, and cooking cycle sequencing. IC Role / Device Role / Timing Role: Central MCU coordinating user interface, relay control, thermal cutoff response, and audible feedback generation. Use Value: 80 GPIOs support direct matrix keypad and LED segment drive; 64 KB ROM stores full cooking logic and safety firmware. |
| Point-of-Sale Terminal | Building Automation Sensor Node |
Use Scenario: Embedded controller in retail POS terminals handling barcode scanner interface, receipt printer control, and cash drawer actuation. IC Role / Device Role / Timing Role: Interface aggregator and command dispatcher connecting USB/RS-232 peripherals to host PC via UART bridging. Use Value: Three UART channels allow simultaneous connection to scanner, printer, and host-no external level shifters required for 5 V logic. | Use Scenario: Wireless sensor node in HVAC subsystems monitoring temperature, humidity, and occupancy, transmitting data via RS-485 or wired Ethernet PHY interface. IC Role / Device Role / Timing Role: Local decision engine performing threshold-based alerts, scheduled reporting, and bus arbitration before upstream transmission. Use Value: Low-power Subsleep mode draws <10 µA while maintaining RTC wake-up, enabling multi-year battery operation in wall-mounted sensors. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar 16-bit microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| HD64F3687G | Same die, identical pinout and electrical specs; differs only in marking (no 'HV' suffix) and minor packaging variant. | No functional difference; suitable for same PCB layouts and firmware binaries. | Select HD64F3687G if HV-grade qualification is not required and standard industrial temperature range suffices. |
| HD64F3684G | Lower memory configuration: 32 KB ROM, 2 KB RAM; otherwise identical peripheral set and pinout. | Targeted at simpler control tasks with smaller firmware footprints and reduced RAM usage. | Choose HD64F3684G when application code size stays under 32 KB and memory headroom is acceptable. |
Compared with HD64F3687GHV, HD64F3687G offers identical functionality without HV-grade screening, while HD64F3684G provides a memory-scaled alternative for less complex firmware-both retain full software and hardware compatibility within the H8/3687 family.
Availability
HD64F3687GHV is available at Aetrix Electronics and suitable for industrial motor control, home appliance MCU, point-of-sale terminal, and building automation sensor node applications requiring stable component supply and long-term production continuity.
Supply support for HD64F3687GHV includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Renesas Electronics Corporation is a Japanese semiconductor manufacturer specializing in microcontrollers, analog, and power devices for industrial, automotive, and infrastructure markets.
The H8/3687 Group was designed for cost-effective, high-reliability embedded control in resource-constrained applications where 5 V operation, ROM-based firmware, and low-power modes are essential.
FAQ
What is the operating temperature range for HD64F3687GHV?
The HD64F3687GHV is rated for industrial temperature operation from −40°C to +85°C. This range supports deployment in factory automation panels, outdoor kiosks, and HVAC equipment without additional thermal mitigation. The 'HV' suffix indicates enhanced screening for high-reliability applications within this grade, consistent with Renesas' Standard quality classification per their documentation.
Does HD64F3687GHV include on-chip debug capability?
Yes, HD64F3687GHV supports on-chip debugging via the on-chip emulator interface compatible with Renesas E7 and E8 debug tools. It uses dedicated pins (NMI, P85–P87) in debug mode, with address break and watchpoint features enabled through ABRKCR and related registers-no external JTAG adapter is needed for basic firmware development and validation of HD64F3687GHV.
Is HD64F3687GHV pin-compatible with other H8/3687 family members?
Yes, HD64F3687GHV shares the same 100-pin PQFP package and pin assignment with HD64F3687G, HD64F3684G, and HD64N3687G. All share identical power, clock, reset, and I/O pin locations, enabling drop-in replacement across memory variants-provided firmware and PCB layout accommodate the specific ROM/RAM configuration of each part.
What clock sources does HD64F3687GHV support?
HD64F3687GHV supports three clock source configurations: fundamental-mode quartz crystal (1–20 MHz) between XTAL1/XTAL2, ceramic resonator with built-in capacitors, or external CMOS-level clock signal applied to XTAL1. A separate 32.768 kHz subclock circuit supports RTC functions independently of main system timing.
Can HD64F3687GHV operate from a 3.3 V supply?
No, HD64F3687GHV requires a 4.5 V to 5.5 V supply and is not rated for 3.3 V operation. Its I/O structure, internal voltage regulators, and flash programming thresholds are designed exclusively for 5 V logic families. Using 3.3 V will result in undefined behavior, failed resets, or inability to execute instructions reliably on HD64F3687GHV.
HD64F3687GHV Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Package/Case:
- 64-BQFP
- Series:
- H8® H8/300H Tiny
- Packaging:
- Tray
- Product Status:
- Last Time Buy
- Programmable:
- Not Verified
- Core Processor:
- H8/300H
- Core Size:
- 16-Bit
- Speed:
- 20MHz
- Connectivity:
- I2C, SCI
- Peripherals:
- LVD, POR, PWM, WDT
- Number of I/O:
- 45
- Program Memory Size:
- 56KB (56K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 4K x 8
- Voltage - Supply (Vcc/Vdd):
- 3V ~ 5.5V
- Data Converters:
- A/D 8x10b
- Oscillator Type:
- Internal
- Operating Temperature:
- -20°C ~ 75°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
HD64F3687GHV FAQ
1.How can I place an order for HD64F3687GHV through Aetrix?
Please submit a Request for Quotation (RFQ) for HD64F3687GHV on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for HD64F3687GHV reliable?
The price and inventory of HD64F3687GHV are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for HD64F3687GHV is usually 5 days.
3.What payment methods are accepted for HD64F3687GHV?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for HD64F3687GHV transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for HD64F3687GHV?
HD64F3687GHV orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your HD64F3687GHV order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for HD64F3687GHV?
For technical support, including HD64F3687GHV datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your HD64F3687GHV requirements.
6.How does Aetrix verify that HD64F3687GHV is sourced from the original manufacturer or authorized distributors?
All HD64F3687GHV products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that HD64F3687GHV meets industry standards.
7.What is the process for return or replacement of HD64F3687GHV?
All HD64F3687GHV units undergo pre-shipment inspection (PSI). If there is an issue with HD64F3687GHV, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The HD64F3687GHV part is unused and in its original packaging.
Return procedure for HD64F3687GHV:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
HD64F3687GHV Tags

-
ATTINY4-TSHR
Microchip Technology

-
ATTINY10-TSHR
Microchip Technology

-
ATTINY10-TS8R
Microchip Technology

-
ATTINY202-SSNR
Microchip Technology

-
ATTINY202-SSFR
Microchip Technology

-
ATTINY402-SSNR
Microchip Technology

-
PIC16F15213T-I/MF
Microchip Technology

-
PIC16F15213-E/MF
Microchip Technology

-
PIC10F200T-I/OT
Microchip Technology

-
ATTINY412-SSNR
Microchip Technology

-
PIC10F202T-I/OT
Microchip Technology

-
ATTINY404-SSNR
Microchip Technology
Tech Hub
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…

