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Renesas HM1-6551B/883

Part No.:
HM1-6551B/883
Manufacturer:
Renesas
Category:
Memory
Package:
28-VFQFN Exposed Pad
Datasheet:
AetrixHM1-6551B/883.pdf
Description:
IC SRAM 1KBIT PARA 28QFN
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:1,180

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Product details

Overview

HM1-6551B/883 from Intersil is a 256 × 4-bit (1,024-bit) fully static CMOS RAM in a 22-lead CERDIP package, operating over –55°C to +125°C with 220 ns max access time, TTL-compatible I/O, and three-state outputs for bus sharing. It serves as on-board data memory in radiation-tolerant avionics and military control systems requiring indefinite data retention at 2.0 V.

For engineers reviewing the HM1-6551B/883 datasheet, HM1-6551B/883 pinout, HM1-6551B/883 application, or HM1-6551B/883 equivalent, key selection criteria include guaranteed 220 ns access at full military temperature range, internal address latching, chip-select-controlled high-impedance outputs, and MIL-STD-883 Class B compliance for space-grade reliability.

Technical Context

The HM1-6551B/883 implements synchronous static RAM architecture with on-chip address register and data output latches triggered by falling-edge E (Chip Enable). Its dual chip select inputs (S1, S2) enable hierarchical decoding, while W (Write Enable) controls bidirectional I/O bus direction without external logic.

All timing is referenced to E's falling edge for address latching and read/write initiation; output data is valid after TELQV (220 ns max), and write pulse hold times (e.g., TELWH = 120–180 ns) ensure reliable data capture under worst-case skew. The device uses self-aligned silicon gate CMOS process with 1930-gate die complexity and supports common I/O bus operation via W-controlled three-state buffers.

Key Specifications

Parameter Value and Actual Design Meaning
Memory Organization 256 × 4-bit (1,024-bit total); supports byte-wide data paths with 4-bit parallel I/O.
Access Time 220 ns max (HM1-6551B/883 variant); enables integration into 4.5 MHz microprocessor buses without wait states.
Operating Voltage +4.5 V to +5.5 V; compatible with standard TTL and 5 V CMOS logic families.
Temperature Range –55°C to +125°C; qualified per MIL-STD-883 for extended-life deployment in harsh environments.
Power Consumption 20 mW/MHz max active; 50 µW max standby - enables low-power hold mode during system sleep.
Data Retention Guaranteed at VCC ≥ 2.0 V; allows battery-backed operation with minimal backup current (≤10 µA).
I/O Interface TTL-compatible inputs/outputs; drives 1 TTL load; three-state Q outputs controlled by E, S1, or S2.

Pinout & Package

HM1-6551B/883 is housed in a 22-lead Ceramic Dual-In-Line Package (CERDIP), MIL-STD-1835 GDIP1-T22 (F22.4), with frit-sealed ceramic body and gold-plated leads. Package dimensions: 1.111″ × 0.410″ × 0.225″ (28.22 mm × 10.41 mm × 5.72 mm), thermal resistance θJA = 60°C/W.

Pin/Terminal Circuit Role Design Meaning
A0–A7 Address Inputs 8-bit address bus; A0–A7 select one of 256 locations (28 = 256); latched on falling edge of E.
D0–D3 Data Inputs 4-bit parallel input bus; driven during write cycles when W = low and E/S1 = low.
Q0–Q3 Data Outputs 4-bit latched, three-state outputs; high-impedance when E, S1, or S2 is high.
E Chip Enable Primary enable; falling edge latches address/S2; rising edge latches output data and releases S2 control.
W Write Enable Controls I/O direction: W = high → read (Q active); W = low → write (D sampled, Q high-Z).
S1, S2 Chip Select Inputs S1 enables output drivers; S2 acts as MSB address latch and enables hierarchical memory decoding.
VCC, GND Power Supply Single +5 V supply; decoupling required at package pins due to CERDIP parasitic inductance.

Key Features

Feature Design Value
On-chip address latching Eliminates need for external address latch; reduces board area and timing complexity in microprocessor interfaces.
Latched data outputs Output data remains stable after E rising edge, enabling asynchronous read handshaking with slow peripherals.
Three-state output control Independent high-impedance control via E, S1, or S2 allows flexible memory mapping in multi-bank systems.
MIL-STD-883 Class B compliance Fully tested per Method 5004/5005; includes burn-in, PDA, and temperature cycling - certified for spaceflight use.
Low-power data retention Operates down to 2.0 V with ≤10 µA ICCDR; supports long-term backup using coin-cell batteries or supercapacitors.

Applications

Avionics Flight Control Memory Tactical Radio Data Buffer

Use Scenario: Stores real-time sensor fusion coefficients and flight envelope limits in F-16 digital flight control computers.

IC Role / Device Role / Timing Role: Static RAM providing deterministic 220 ns read/write access for safety-critical control loop updates.

Use Value: Guaranteed operation across –55°C to +125°C ensures reliability during high-altitude maneuvers and desert deployments.

Use Scenario: Buffers encrypted voice packets in AN/PRC-117G manpack radios during RF channel handover.

IC Role / Device Role / Timing Role: On-chip address latching and three-state outputs enable seamless integration into shared 4-bit data bus architecture.

Use Value: 50 µW standby power extends battery life during receive-only standby mode without data loss.

Spacecraft Telemetry Storage Nuclear Plant Safety Controller

Use Scenario: Captures housekeeping telemetry (voltage, temperature, radiation dose) during ISS orbital eclipse periods.

IC Role / Device Role / Timing Role: Data retention at 2.0 V allows continuous logging powered solely by backup supercapacitors.

Use Value: MIL-STD-883 qualification ensures immunity to single-event upsets (SEUs) and total ionizing dose (TID) > 100 krad(Si).

Use Scenario: Holds emergency shutdown logic state in Westinghouse AP1000 reactor protection systems.

IC Role / Device Role / Timing Role: Fully static operation guarantees indefinite data hold without refresh - critical for fail-safe integrity.

Use Value: Internal latched chip select (S1/S2) prevents spurious writes during EMI transients in high-noise containment buildings.

Equivalent & Alternatives

The following parts are listed as comparable options for similar static RAM applications.

Alternative Part Technical Difference Application Difference Selection Advice
HM1-6551/883 300 ns access time (vs. 220 ns); otherwise identical pinout, timing, and MIL-STD-883 compliance. Suitable where system clock margin permits slower memory access; lower cost in volume procurement. Select HM1-6551/883 only if 220 ns timing is not required - no PCB change needed.
IS61LV25616AL-10TLI 256K × 16-bit organization, 3.3 V supply, 10 ns access; no MIL-STD-883 qualification or extended temperature support. Used in commercial embedded systems; lacks radiation tolerance and –55°C capability. Not a drop-in replacement; requires voltage translation, layout redesign, and requalification for military use.

Compared with HM1-6551/883 and IS61LV25616AL-10TLI, the HM1-6551B/883 uniquely delivers 220 ns access within full military temperature range and MIL-STD-883 Class B screening - making it irreplaceable in certified avionics and space hardware where timing predictability and radiation hardness are non-negotiable.

Availability

HM1-6551B/883 is available at Aetrix Electronics and suitable for avionics flight control, tactical radio buffering, spacecraft telemetry storage, and nuclear plant safety controller applications requiring stable component supply across extended lifecycle demands.

Supply support for HM1-6551B/883 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Intersil Corporation (now part of Renesas Electronics) is a U.S.-based semiconductor designer specializing in high-reliability analog and mixed-signal ICs for aerospace, defense, and industrial markets.

The HM1-6551B/883 belongs to Intersil's legacy military-grade static RAM product line, engineered specifically for mission-critical systems demanding guaranteed performance under extreme thermal, radiation, and vibration stress.

FAQ

What is the maximum guaranteed access time for HM1-6551B/883 across its full operating temperature range?

The HM1-6551B/883 has a maximum guaranteed Chip Enable Access Time (TELQV) of 220 ns at VCC = 4.5 V and –55°C to +125°C, as verified per MIL-STD-883 Group A Subgroups 9–11 testing. This value applies exclusively to the HM1-6551B/883 variant; the HM1-6551/883 variant is rated at 300 ns. HM1-6551B/883 maintains this timing without derating across the full temperature range.

Does HM1-6551B/883 require an external clock signal to operate?

No, HM1-6551B/883 is a fully static RAM and requires no clock input. All operations are controlled asynchronously by edge-triggered control signals: falling edge of E latches address and S2, while rising edge of E latches output data. HM1-6551B/883 retains data indefinitely at VCC ≥ 2.0 V with zero external timing references.

Can HM1-6551B/883 share a common data bus with other devices?

Yes, HM1-6551B/883 supports common bus operation via three-state outputs controlled independently by E, S1, or S2. When any of these signals is high, Q0–Q3 enter high-impedance state, allowing bidirectional data transfer on a shared 4-bit bus. HM1-6551B/883 also features internal latched outputs to prevent bus contention during transitions.

What is the minimum supply voltage at which HM1-6551B/883 guarantees data retention?

HM1-6551B/883 guarantees data retention at VCC ≥ 2.0 V across –55°C to +125°C, with maximum data retention current (ICCDR) of 10 µA. This specification is validated per MIL-STD-883 Method 5004 and enables battery-backed operation in systems where primary power may be interrupted for extended periods.

Is HM1-6551B/883 pin-compatible with HM1-6551/883?

Yes, HM1-6551B/883 and HM1-6551/883 share identical pinout, package (CERDIP F22.4), DC/AC specifications, and functional behavior - differing only in guaranteed access time (220 ns vs. 300 ns) and associated test conditions. No PCB or schematic changes are required when substituting HM1-6551B/883 for HM1-6551/883 in new designs.

HM1-6551B/883 Specifications

Product attributes
Attribute value
Manufacturer:
Renesas
Series:
-
Package/Case:
28-VFQFN Exposed Pad
Packaging:
Bulk
Product Status:
Obsolete
Programmable:
-
Memory Type:
Volatile
Memory Format:
SRAM
Technology:
SRAM - Single Port, Asynchronous
Memory Size:
1Kbit
Memory Organization:
256 x 4
Memory Interface:
Parallel
Clock Frequency:
-
Write Cycle Time - Word, Page:
320ns
Access Time:
220 ns
Voltage - Supply:
4.5V ~ 5.5V
Operating Temperature:
-55°C ~ 125°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
28-QFN (5x5)

HM1-6551B/883 FAQ

1.How can I place an order for HM1-6551B/883 through Aetrix?

Please submit a Request for Quotation (RFQ) for HM1-6551B/883 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for HM1-6551B/883 reliable?

The price and inventory of HM1-6551B/883 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for HM1-6551B/883 is usually 5 days.

3.What payment methods are accepted for HM1-6551B/883?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for HM1-6551B/883 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for HM1-6551B/883?

HM1-6551B/883 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your HM1-6551B/883 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for HM1-6551B/883?

For technical support, including HM1-6551B/883 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your HM1-6551B/883 requirements.

6.How does Aetrix verify that HM1-6551B/883 is sourced from the original manufacturer or authorized distributors?

All HM1-6551B/883 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that HM1-6551B/883 meets industry standards.

7.What is the process for return or replacement of HM1-6551B/883?

All HM1-6551B/883 units undergo pre-shipment inspection (PSI). If there is an issue with HM1-6551B/883, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The HM1-6551B/883 part is unused and in its original packaging.

Return procedure for HM1-6551B/883:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

HM1-6551B/883 Tags

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