Analog Devices Inc. HMC1015
- Part No.:
- HMC1015
- Manufacturer:
- Analog Devices Inc.
- Category:
- RF Mixers
- Package:
- Die
- Datasheet:
-
HMC1015.pdf
- Description:
- IC MMIC MIXER DBL-BAL DIE
- Quantity:
- Payment:

- Shipping:

Inventory:1,997
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Product details
Overview
HMC1015 from Analog Devices (formerly Hittite Microwave) is a GaAs MMIC triple-balanced fundamental mixer die operating from 26–32 GHz at RF, 16–22 GHz at IF, and 7–11 GHz at LO - delivering 13 dB typical conversion loss, 20 dBm input IP3, and 45 dB LO/RF isolation. It requires no DC bias or external matching, and is used in millimeter-wave up/downconversion for point-to-point radios and military test equipment.
For engineers reviewing the HMC1015 datasheet, HMC1015 pinout, HMC1015 application, or HMC1015 equivalent, key selection criteria include its passive operation, wide IF bandwidth, high 2LO/IF isolation (50 dB), thermal stability across –55°C to +85°C, and compatibility with 50 Ω microstrip interconnects on alumina substrates.
Technical Context
The HMC1015 employs a monolithic triple-balanced topology with integrated balun structures optimized for harmonic suppression and port isolation. Its passive design eliminates DC bias circuitry, while the 1.14 × 1.1 × 0.1 mm GaAs die supports broadband operation without external tuning components.
It functions as both upconverter and downconverter with fixed IF = 17 GHz for isolation specs, and maintains consistent conversion loss and IP3 across temperature (–55°C to +85°C) and LO drive levels (+9 to +15 dBm). The die bottom serves as RF/DC ground, requiring eutectic or conductive epoxy mounting to a grounded plane.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| RF Frequency Range | 26–32 GHz - supports E-band wireless infrastructure and radar front-ends. |
| IF Frequency Range | 16–22 GHz - enables wideband intermediate frequency translation in test instrumentation. |
| LO Frequency Range | 7–11 GHz - allows flexible local oscillator sourcing using common synthesizers. |
| Conversion Loss | 13 dB typical - defines signal attenuation through mixing path; impacts system noise figure budget. |
| Input IP3 | 22 dBm typical - determines linearity headroom for multi-carrier or high-dynamic-range signals. |
| LO/RF Isolation | 45 dB - minimizes LO leakage into antenna or RF chain, reducing spurious emissions. |
| 2LO/IF Isolation | 50 dB - suppresses second-harmonic LO feedthrough at IF output, critical for clean baseband recovery. |
| Operating Temperature | –55°C to +85°C - validated for deployment in outdoor telecom and military environmental conditions. |
Pinout & Package
Package: Bare die, 1.14 × 1.1 × 0.1 mm (0.045 × 0.043 × 0.004 in), gold-metallized bond pads and backside ground. Requires eutectic or conductive epoxy mounting to RF ground plane.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| Pad 1 | RF | AC-coupled 50 Ω RF input/output port; matched for direct microstrip connection without external tuning. |
| Pad 2 | IF | AC-coupled 50 Ω IF port; supports bidirectional use in up/downconversion with 16–22 GHz bandwidth. |
| Pad 3 | LO | AC-coupled 50 Ω local oscillator input; accepts +9 to +15 dBm drive with minimal harmonic generation. |
| Die Bottom | GND | RF/DC ground reference; must be bonded directly to system ground plane for optimal isolation and thermal dissipation. |
Key Features
| Feature | Design Value |
|---|---|
| No DC bias required | Eliminates external power supplies, decoupling networks, and associated layout complexity. |
| Triple-balanced architecture | Provides inherent suppression of LO harmonics, RF/IF feedthrough, and even-order distortion products. |
| High 2LO/IF isolation (50 dB) | Reduces need for post-mixer filtering in sensitive receiver chains, simplifying IF stage design. |
| Wide IF bandwidth (16–22 GHz) | Supports high-data-rate modulation schemes and wide instantaneous bandwidth test applications. |
| Thermal stability (–55°C to +85°C) | Ensures consistent conversion loss and IP3 performance across industrial and military operating environments. |
Applications
| Point-to-Point Radios | Test & Measurement Equipment |
|---|---|
|
Use Scenario: High-capacity E-band backhaul links operating at 28 GHz carrier frequency with 1–2 GHz channel bandwidth. IC Role / Device Role / Timing Role: Fundamental mixer performing downconversion from 28 GHz RF to 18 GHz IF for digitization and demodulation. Use Value: Enables compact, bias-free front-end design with 45 dB LO/RF isolation to prevent transmitter leakage from desensitizing the receiver. |
Use Scenario: Vector network analyzer (VNA) or spectrum analyzer upconverter module covering 26–32 GHz. IC Role / Device Role / Timing Role: Passive upconverter translating baseband or IF signals to millimeter-wave frequencies for device characterization. Use Value: Delivers flat conversion loss and >20 dBm IP3 across full band, supporting accurate large-signal S-parameter measurements. |
| Military Radar Sensors | VSAT Terminals |
|
Use Scenario: Compact active electronically scanned array (AESA) radar transceiver modules requiring low-SWaP millimeter-wave mixing. IC Role / Device Role / Timing Role: Triple-balanced mixer providing simultaneous LO rejection and harmonic suppression in T/R module IF paths. Use Value: Achieves 50 dB 2LO/IF isolation to prevent second-harmonic interference in pulse-Doppler processing chains. |
Use Scenario: Outdoor satellite terminal operating in 27.5–29.5 GHz receive band with 16–22 GHz IF output feeding low-noise downconverters. IC Role / Device Role / Timing Role: RF-to-IF downconverter enabling wideband satellite signal capture without external matching components. Use Value: Simplifies RF front-end by eliminating biasing and tuning networks, improving reliability in unattended remote deployments. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar mixer applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| HMC1113 | Wider RF range (24–34 GHz), higher conversion loss (14.5 dB typ), same 16–22 GHz IF and triple-balanced architecture. | Better suited for extended E-band coverage but trades off ~1.5 dB conversion loss vs. HMC1015. | Select HMC1113 when RF band margin beyond 32 GHz is required; otherwise HMC1015 offers superior loss performance within 26–32 GHz. |
| Qorvo QM11013 | SiGe-based, 24–32 GHz RF, 10–18 GHz IF, requires +5 V bias, 12 dB conversion loss, lower IP3 (18 dBm). | Active mixer with integrated LO buffer; not drop-in due to bias requirement and narrower IF bandwidth. | Choose QM11013 only if system-level integration of LO amplification is prioritized over passive simplicity and IF bandwidth. |
Compared with HMC1015, HMC1113 extends RF coverage at the cost of conversion efficiency, while QM11013 introduces bias dependency and reduced linearity - making HMC1015 the optimal choice for passive, high-isolation, wide-IF millimeter-wave conversion where layout simplicity and thermal robustness are critical.
Availability
HMC1015 is available at Aetrix Electronics and suitable for point-to-point radios, military radar sensors, and test equipment requiring stable component supply across extended temperature ranges and millimeter-wave frequency bands.
Supply support for HMC1015 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Analog Devices, Inc. (including former Hittite Microwave) is a global leader in high-performance analog, RF, and microwave semiconductors, serving aerospace, defense, and communications markets.
The HMC1015 belongs to the Hittite MMIC mixer product line, engineered specifically for bias-free, high-isolation millimeter-wave frequency conversion in E-band infrastructure and instrumentation.
FAQ
What is the recommended LO drive level for optimal performance of the HMC1015?
The HMC1015 operates optimally with LO drive levels between +9 dBm and +15 dBm. At +13 dBm, it achieves 13 dB typical conversion loss and 22 dBm input IP3. Driving below +9 dBm increases conversion loss and degrades linearity; exceeding +15 dBm risks reliability per absolute maximum ratings. All published specs assume LO = +13 dBm unless noted, and HMC1015 performance remains stable across this range without adjustment.
Does the HMC1015 require external DC bias or matching components?
No, the HMC1015 is a fully passive GaAs MMIC mixer die requiring no DC bias or external matching components. Its internal balun structures and 50 Ω AC-coupled ports (RF, IF, LO) enable direct connection to microstrip lines. This eliminates bias networks, decoupling capacitors, and impedance-tuning elements - reducing bill-of-materials and PCB area while improving reliability in harsh environments.
What is the thermal resistance and maximum junction temperature specification for the HMC1015?
The HMC1015 has a thermal resistance (RTH) of 392 °C/W from junction to die bottom, with a maximum junction temperature of 150 °C. Continuous power dissipation is rated at 79 mW at TA = 85 °C, derating by 2.5 mW/°C above that. Proper thermal management - such as eutectic die attach to a grounded metal carrier - is essential to maintain performance and reliability under sustained RF/LO drive conditions.
Can the HMC1015 be used for both upconversion and downconversion?
Yes, the HMC1015 is bidirectional and supports both upconversion and downconversion. In upconversion mode, IF (16–22 GHz) and LO (7–11 GHz) inputs produce RF output (26–32 GHz); in downconversion, RF (26–32 GHz) and LO (7–11 GHz) yield IF (16–22 GHz). Its symmetric triple-balanced architecture ensures consistent isolation and conversion loss in either direction, verified in datasheet plots for both configurations.
What are the handling and mounting requirements for the HMC1015 bare die?
The HMC1015 is an electrostatic-sensitive bare die requiring ESD-safe handling: store in nitrogen after opening ESD bags, avoid liquid cleaning, and handle only by edges. Mounting requires bonding the gold backside to RF ground via AuSn eutectic (255–290 °C) or conductive epoxy. Microstrip lines should be placed within 0.076–0.152 mm of the die, and wire bonds must be <0.31 mm long using 1-mil gold wire to preserve RF integrity.
HMC1015 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Analog Devices Inc.
- Series:
- -
- Package/Case:
- Die
- Packaging:
- Bulk
- Product Status:
- Obsolete
- RF Type:
- VSAT
- Frequency:
- 26GHz ~ 32GHz
- Number of Mixers:
- 1
- Gain:
- -
- Noise Figure:
- -
- Secondary Attributes:
- -
- Current - Supply:
- -
- Voltage - Supply:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- Die
HMC1015 FAQ
1.How can I place an order for HMC1015 through Aetrix?
Please submit a Request for Quotation (RFQ) for HMC1015 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for HMC1015 reliable?
The price and inventory of HMC1015 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for HMC1015 is usually 5 days.
3.What payment methods are accepted for HMC1015?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for HMC1015 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for HMC1015?
HMC1015 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your HMC1015 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for HMC1015?
For technical support, including HMC1015 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your HMC1015 requirements.
6.How does Aetrix verify that HMC1015 is sourced from the original manufacturer or authorized distributors?
All HMC1015 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that HMC1015 meets industry standards.
7.What is the process for return or replacement of HMC1015?
All HMC1015 units undergo pre-shipment inspection (PSI). If there is an issue with HMC1015, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The HMC1015 part is unused and in its original packaging.
Return procedure for HMC1015:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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