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Analog Devices Inc. HMC1015-SX
- Part No.:
- HMC1015-SX
- Manufacturer:
- Analog Devices Inc.
- Category:
- RF Mixers
- Package:
- Die
- Datasheet:
-
HMC1015-SX.pdf
- Description:
- IC MMIC MIXER DBL-BAL DIE 1=2PCS
- Quantity:
- Payment:
- Shipping:
Inventory:1,740
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Product details
Overview
HMC1015-SX from Analog Devices is a GaAs MMIC triple-balanced fundamental mixer die operating from 26–32 GHz at RF, 16–22 GHz at IF, and 7–11 GHz at LO; delivers 13 dB typical conversion loss, 20 dBm input IP3, and 45 dB LO/RF isolation; used in millimeter-wave up/downconversion for point-to-point radios and test equipment.
For engineers reviewing the HMC1015-SX datasheet, HMC1015-SX pinout, HMC1015-SX application, or HMC1015-SX equivalent, this page provides verified RF mixer specifications, die-level mounting guidance, isolation performance across LO/RF/IF paths, temperature-stable P1dB and IP3 behavior, and comparable alternatives for E-band frequency conversion designs.
Technical Context
The HMC1015-SX is a passive, DC-bias-free GaAs MMIC mixer with optimized balun structures enabling high port-to-port isolation-45 dB LO/RF, 31 dB LO/IF, and 50 dB 2LO/IF at fixed IF = 17 GHz. It operates as both upconverter and downconverter without external matching components.
It supports LO drive levels from +9 dBm to +15 dBm and maintains consistent conversion loss and compression across its full RF bandwidth (26–32 GHz) and IF bandwidth (16–22 GHz), with thermal stability verified from –55°C to +85°C.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| RF Frequency Range | 26–32 GHz - Full E-band coverage for high-capacity wireless backhaul links. |
| IF Frequency Range | 16–22 GHz - Enables wideband intermediate frequency translation in test instrumentation. |
| LO Frequency Range | 7–11 GHz - Compatible with common synthesizer outputs for harmonic-free mixing. |
| Conversion Loss | 13 dB typical - Predictable signal attenuation enabling accurate link budget planning. |
| Input IP3 | 22 dBm typical - Supports high-dynamic-range operation in crowded RF environments. |
| LO/RF Isolation | 45 dB - Minimizes LO leakage into antenna paths, reducing spurious emissions. |
| 2LO/IF Isolation | 50 dB - Suppresses second-harmonic interference in IF signal chain processing. |
| Operating Temperature | –55°C to +85°C - Validated for deployment in outdoor telecom infrastructure and military platforms. |
Pinout & Package
Package: Bare die, 1.14 × 1.1 × 0.1 mm (0.045 × 0.043 × 0.004 inch), gold-metallized bond pads and grounded backside; requires eutectic or conductive epoxy die attach to RF ground plane.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| Pad 1 | RF | AC-coupled 50 Ω matched input/output port for 26–32 GHz signals. |
| Pad 2 | IF | AC-coupled 50 Ω matched port for 16–22 GHz intermediate frequency interface. |
| Pad 3 | LO | AC-coupled 50 Ω matched local oscillator input requiring +9 to +15 dBm drive. |
| Die Bottom | GND | Electrically grounded backside metallization; must be bonded directly to RF/DC ground plane. |
Key Features
| Feature | Design Value |
|---|---|
| No DC bias required | Passive architecture eliminates bias circuitry, simplifying PCB layout and reducing power supply complexity. |
| High LO/RF isolation (45 dB) | Reduces need for external LO filtering in transceiver front-ends, lowering system insertion loss. |
| Wide IF bandwidth (16–22 GHz) | Supports multi-GHz instantaneous bandwidth applications such as radar pulse compression and wideband signal analysis. |
| Die size: 1.14 × 1.1 mm | Enables compact integration into millimeter-wave modules and phased array assemblies with tight spacing constraints. |
| Backside ground connection | Ensures low-inductance RF grounding essential for stable E-band performance and repeatable wire-bond impedance. |
Applications
| Point-to-Point Radios | Test Equipment & Sensors |
|---|---|
Use Scenario: High-capacity licensed E-band wireless backhaul links operating at 28 GHz carrier frequency with 1 GHz channel bandwidth. IC Role / Device Role / Timing Role: Fundamental triple-balanced mixer performing upconversion of baseband IF signals to RF for transmission. Use Value: 45 dB LO/RF isolation prevents transmitter self-interference; 22 dBm IP3 enables linear operation under high adjacent-channel power. |
Use Scenario: Vector network analyzer receiver front-end requiring broadband IF translation from 18 GHz to digitizer input range. IC Role / Device Role / Timing Role: Downconverting mixer translating 26–32 GHz DUT response to 16–22 GHz IF for further amplification and digitization. Use Value: 50 dB 2LO/IF isolation ensures clean IF spectrum free from harmonic distortion during swept-frequency measurements. |
| Point-to-Multi-Point Radios | Military End-Use |
Use Scenario: Fixed wireless access base station serving multiple CPE units in 28 GHz spectrum with OFDM modulation and dynamic channel allocation. IC Role / Device Role / Timing Role: Dual-role mixer supporting both uplink IF-to-RF and downlink RF-to-IF conversion in TDD configuration. Use Value: Stable conversion loss (±0.5 dB) over –40°C to +85°C enables reliable operation in uncontrolled outdoor enclosures. |
Use Scenario: Electronic warfare receiver module detecting and characterizing hostile radar emissions in E-band surveillance bands. IC Role / Device Role / Timing Role: Wideband RF front-end mixer providing instantaneous frequency translation for real-time signal intelligence processing. Use Value: 16–22 GHz IF bandwidth captures wide instantaneous radar pulses without aliasing; 13 dB conversion loss preserves SNR in low-signal scenarios. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar triple-balanced mixer applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| HMC1048-SX | Wider RF range (24–40 GHz), higher conversion loss (14.5 dB typ), same die size and pad layout. | Better suited for Ka-band extensions beyond 32 GHz; less optimal for narrow 26–32 GHz systems due to higher loss. | Select HMC1048-SX only when extending operational bandwidth above 32 GHz is required. |
| HMC774ALC3 | Active mixer with +15 dBm LO drive, 11 dB conversion gain, 24–40 GHz RF, QFN-16 package. | Requires DC bias and external matching; offers gain instead of loss but adds complexity and power consumption. | Choose HMC774ALC3 when system-level gain budget is constrained and active conversion is acceptable. |
Compared with HMC1015-SX, HMC1048-SX extends upper RF frequency at the cost of conversion loss, while HMC774ALC3 trades passive simplicity for active gain and broader packaging flexibility-neither is pin-compatible, and all require distinct RF layout adaptation.
Availability
HMC1015-SX is available at Aetrix Electronics and suitable for point-to-point radios, test equipment & sensors, and military end-use requiring stable component supply across extended temperature ranges and millimeter-wave performance consistency.
Supply support for HMC1015-SX includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Analog Devices, Inc. is a global semiconductor leader specializing in high-performance analog, mixed-signal, and RF technologies for communications, industrial, and defense applications.
The HMC1015-SX belongs to the Hittite Microwave (acquired by Analog Devices) GaAs MMIC mixer product line, engineered for millimeter-wave frequency conversion in E-band infrastructure and instrumentation where passive performance, isolation, and thermal stability are critical.
FAQ
What is the recommended LO drive level for optimal performance of the HMC1015-SX?
The HMC1015-SX achieves best conversion loss and IP3 performance with LO drive between +9 dBm and +15 dBm, with +13 dBm cited as typical in datasheet characterization. Operating below +9 dBm increases conversion loss; exceeding +15 dBm risks reliability degradation per absolute maximum ratings. The HMC1015-SX does not require DC bias, making LO drive level the primary performance tuning parameter.
Does the HMC1015-SX require external matching components or DC blocking capacitors?
No-the HMC1015-SX integrates internal baluns and is fully matched to 50 Ω at all ports (RF, IF, LO); no external matching networks, DC blocks, or bias tees are needed. All three bond pads are AC-coupled and impedance-matched per Table 3. The HMC1015-SX's passive design eliminates dependency on external components for basic operation.
What is the thermal resistance and maximum junction temperature specification for the HMC1015-SX?
The HMC1015-SX has a thermal resistance (RTH) of 392 °C/W from junction to die bottom, with a maximum junction temperature of 150 °C. Continuous power dissipation is rated at 79 mW at TA = 85 °C, derating by 2.5 mW/°C above that ambient. Proper eutectic or conductive epoxy die attach to a low-impedance ground plane is essential to maintain thermal integrity in the HMC1015-SX.
Can the HMC1015-SX be used for both upconversion and downconversion?
Yes-the HMC1015-SX is bidirectional and functions identically as an upconverter (IF → RF) or downconverter (RF → IF) due to its symmetric triple-balanced topology. Datasheet measurements confirm consistent conversion loss, IP3, and isolation in both modes, with all specs-including 45 dB LO/RF isolation and 50 dB 2LO/IF isolation-valid for either direction of signal flow in the HMC1015-SX.
What handling precautions apply to the HMC1015-SX bare die?
The HMC1015-SX is an electrostatic-sensitive device with fragile air bridges; it must be handled using ESD-safe vacuum collets or bent tweezers along the edges only. Storage requires dry nitrogen after opening ESD bags. Bonding uses 0.025 mm gold wire with ≤0.31 mm bond length; die mounting requires AuSn eutectic or conductive epoxy to a flat, clean ground plane-direct contact with the HMC1015-SX surface must be avoided.
HMC1015-SX Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Analog Devices Inc.
- Series:
- -
- Package/Case:
- Die
- Packaging:
- Bulk
- Product Status:
- Obsolete
- RF Type:
- General Purpose
- Frequency:
- 26GHz ~ 32GHz
- Number of Mixers:
- 1
- Gain:
- -
- Noise Figure:
- -
- Secondary Attributes:
- Up/Down Converter
- Current - Supply:
- -
- Voltage - Supply:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- Die
HMC1015-SX FAQ
1.How can I place an order for HMC1015-SX through Aetrix?
Please submit a Request for Quotation (RFQ) for HMC1015-SX on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for HMC1015-SX reliable?
The price and inventory of HMC1015-SX are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for HMC1015-SX is usually 5 days.
3.What payment methods are accepted for HMC1015-SX?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for HMC1015-SX transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for HMC1015-SX?
HMC1015-SX orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your HMC1015-SX order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for HMC1015-SX?
For technical support, including HMC1015-SX datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your HMC1015-SX requirements.
6.How does Aetrix verify that HMC1015-SX is sourced from the original manufacturer or authorized distributors?
All HMC1015-SX products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that HMC1015-SX meets industry standards.
7.What is the process for return or replacement of HMC1015-SX?
All HMC1015-SX units undergo pre-shipment inspection (PSI). If there is an issue with HMC1015-SX, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The HMC1015-SX part is unused and in its original packaging.
Return procedure for HMC1015-SX:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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