Analog Devices Inc. HMC1058-SX
- Part No.:
- HMC1058-SX
- Manufacturer:
- Analog Devices Inc.
- Category:
- RF Mixers
- Package:
- Die
- Datasheet:
-
HMC1058-SX.pdf
- Description:
- IC MMIC IQ MIXER GAAS DIE
- Quantity:
- Payment:

- Shipping:

Inventory:3,611
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
HMC1058-SX from Analog Devices is a GaAs MMIC sub-harmonic mixer die operating at 71–86 GHz RF, 29–43 GHz LO, and DC–12 GHz IF, with −11 dB typical conversion loss, 43 dB 2LO/RF isolation, and no DC bias required. It serves as a passive upconverter or downconverter in E-band communications and automotive radar front-ends.
For engineers reviewing the HMC1058-SX datasheet, HMC1058-SX pinout, HMC1058-SX application, or HMC1058-SX equivalent, key selection criteria include RF/LO frequency alignment, sub-harmonic pump efficiency, 50 Ω matched ports, die-level integration requirements, and thermal management for millimeter-wave assembly.
Technical Context
The HMC1058-SX implements a passive Schottky diode-based sub-harmonic architecture, enabling LO drive at half the RF frequency (e.g., 37.25 GHz LO for 74.5 GHz RF). Its monolithic GaAs construction provides full passivation and Ti/Au metallization on all bond pads and the grounded backside.
It operates without DC bias and delivers broadband IF response from DC to 12 GHz, supporting both USB and LSB sideband operation. Performance is characterized in a 50 Ω environment using RF probing, with conversion gain and IP3 measured under defined LO power (±9 dBm) and temperature (−55°C to +85°C) conditions.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| RF Frequency Range | 71–86 GHz: Supports full E-band (71–76 GHz and 81–86 GHz) licensed spectrum for high-capacity wireless links. |
| LO Frequency Range | 29–43 GHz: Enables sub-harmonic pumping-halving LO generation complexity versus fundamental mixers. |
| IF Frequency Range | DC–12 GHz: Allows baseband-to-millimeter-wave translation with wideband modulation support (e.g., OFDM, FMCW). |
| Conversion Loss | −11 dB typical: Defines signal attenuation between RF and IF paths; impacts system noise figure and dynamic range budget. |
| 2LO/RF Isolation | 43 dB: Suppresses second harmonic of LO from coupling into RF path-critical for spectral purity in sensitive receivers. |
| LO/RF Isolation | 28 dB: Limits LO leakage into antenna or RF chain, reducing self-interference and improving receiver blocking performance. |
| Die Size | 1.15 × 0.97 × 0.1 mm: Ultra-compact chip-scale form factor requiring precision wire bonding and thermal grounding via backside metal. |
Pinout & Package
Package: Unpackaged GaAs MMIC die (bare die), 0.1 mm thick, with Ti/Au metallized bond pads and grounded gold backside. Requires eutectic or conductive epoxy mounting to RF ground plane.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| Pad 1 | RF | 50 Ω matched input/output port for 71–86 GHz signals; must be connected via low-inductance microstrip or bond wire. |
| Pad 2 | LO | AC-coupled 50 Ω port for 29–43 GHz sub-harmonic pump; requires external DC blocking if bias injection is used elsewhere. |
| Pad 3 | IF | AC-coupled 50 Ω port for DC–12 GHz intermediate frequency; supports bidirectional use in up/downconversion. |
| Die Bottom | GND | Electrically grounded backside metallization-must be soldered or epoxied directly to RF ground plane for thermal and RF return path integrity. |
Key Features
| Feature | Design Value |
|---|---|
| No DC bias required | Eliminates bias network design, reduces component count, and avoids LO injection through bias lines in high-frequency layouts. |
| Low LO drive (9 dBm) | Reduces power consumption and heat generation in LO chains; enables use with lower-power synthesizers or frequency multipliers. |
| High 2LO/RF isolation (43 dB) | Minimizes spurious responses from LO harmonics-essential for meeting spectral mask requirements in E-band radios. |
| Wide IF bandwidth (DC–12 GHz) | Supports complex modulation schemes (e.g., 400ZR, IEEE 802.11ay) and FMCW radar chirp processing without IF filtering constraints. |
| Passivated Schottky diodes | Ensures long-term reliability under thermal cycling and humidity exposure in military and automotive environments. |
Applications
| E-Band Point-to-Point Radio | Automotive Radar Transceiver |
|---|---|
Use Scenario: High-capacity wireless backhaul link operating in 71–76 GHz and 81–86 GHz bands with 2 GHz channel bandwidth. IC Role / Device Role / Timing Role: Sub-harmonic downconverter translating received 74.5 GHz RF to 4 GHz IF for digitization and demodulation. Use Value: −11 dB conversion loss and 43 dB 2LO/RF isolation maintain SNR and suppress adjacent-channel interference in dense urban deployments. | Use Scenario: 77 GHz forward collision avoidance radar using FMCW waveform with 4 GHz IF output for ADC sampling. IC Role / Device Role / Timing Role: Bidirectional mixer core handling both transmit upconversion (IF→RF) and receive downconversion (RF→IF) in T/R module. Use Value: DC–12 GHz IF bandwidth accommodates wide chirp spans; 28 dB LO/RF isolation prevents transmit leakage from desensitizing receive path. |
| Millimeter-Wave Test Equipment | Military EW/SIGINT Receiver |
Use Scenario: Vector signal analyzer front-end covering 71–86 GHz with calibrated amplitude and phase response. IC Role / Device Role / Timing Role: Precision downconverter providing traceable IF output for real-time spectrum analysis and modulation error vector magnitude (EVM) measurement. Use Value: Matched 50 Ω ports and stable conversion loss across temperature (−55°C to +85°C) enable repeatable calibration without recalibration drift. | Use Scenario: Wideband electronic warfare receiver detecting and characterizing hostile radar emissions in E-band. IC Role / Device Role / Timing Role: Front-end mixer enabling rapid frequency scanning across 71–86 GHz with minimal image rejection hardware. Use Value: High LO/IF isolation (20 dB) and RF/IF isolation (18 dB) reduce internal crosstalk, preserving dynamic range during simultaneous multi-signal capture. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar sub-harmonic mixer applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| HMC1048-SX | Lower RF band: 57–66 GHz; −12 dB conversion loss; 38 dB 2LO/RF isolation. | Targets V-band systems (57–66 GHz), not E-band; unsuitable for 71–86 GHz compliance-critical designs. | Select HMC1048-SX only when operating below 66 GHz and requiring marginally better conversion loss. |
| HMC1118-SX | Higher RF band: 79–90 GHz; −10.5 dB conversion loss; 40 dB 2LO/RF isolation; larger die (1.25 × 1.05 mm). | Covers upper E-band extension and W-band edge; requires revised RF layout due to different pad spacing and thermal mass. | Choose HMC1118-SX for 81–90 GHz coverage where extended upper frequency is mandatory. |
Compared with HMC1048-SX and HMC1118-SX, the HMC1058-SX uniquely balances 71–86 GHz coverage, −11 dB conversion loss, and 43 dB 2LO/RF isolation in a 1.15 × 0.97 mm footprint-making it the optimal choice for standard E-band infrastructure and radar systems requiring regulatory-compliant operation.
Availability
HMC1058-SX is available at Aetrix Electronics and suitable for E-band communications systems, automotive radar modules, and millimeter-wave test equipment requiring stable component supply, controlled die-level sourcing, and traceable lot documentation.
Supply support for HMC1058-SX includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Analog Devices, Inc. is a global semiconductor leader specializing in high-performance analog, mixed-signal, and RF technologies for precision signal processing.
The HMC1058-SX belongs to the Hittite Microwave (now Analog Devices) GaAs MMIC mixer product line, engineered for millimeter-wave infrastructure, defense, and automotive radar applications demanding high isolation and broadband IF response.
FAQ
What is the operating temperature range for the HMC1058-SX?
The HMC1058-SX is specified for operation from −55°C to +85°C ambient temperature. Its maximum junction temperature is 170°C, and thermal resistance (junction to die bottom) is 555°C/W-requiring direct thermal connection of the grounded backside to a heatsink or ground plane for reliable high-power operation. The HMC1058-SX performance data is validated across this full range.
Does the HMC1058-SX require DC bias voltage or current?
No, the HMC1058-SX is a passive Schottky diode-based mixer and requires no DC bias. All three ports (RF, LO, IF) are AC-coupled, with Pad 2 (LO) and Pad 3 (IF) explicitly noted as AC-coupled in the official pad description table. This eliminates bias network design complexity and potential LO injection paths. The HMC1058-SX functions solely on RF and LO signal energy.
What is the absolute maximum LO power rating for the HMC1058-SX?
The absolute maximum LO drive level for the HMC1058-SX is +20 dBm, per the Absolute Maximum Ratings table. Operation above this level risks permanent damage to the Schottky diodes. Typical characterization uses +9 dBm LO, delivering −11 dB conversion loss; exceeding +20 dBm violates safe operating area limits and voids reliability guarantees for the HMC1058-SX.
How is the HMC1058-SX mounted and grounded in practice?
The HMC1058-SX die must be mounted with its gold-plated backside directly bonded to an RF ground plane using AuSn eutectic preform (255°C work surface) or electrically conductive epoxy. Bond pads 1–3 connect via ≤12 mil gold wire bonds to 50 Ω microstrip lines on alumina substrates. The die bottom serves as the primary RF and thermal return path-floating or poorly grounded mounting degrades isolation and causes thermal runaway. This mounting method is mandatory for HMC1058-SX functionality.
Can the HMC1058-SX be used for both upconversion and downconversion?
Yes, the HMC1058-SX is bidirectional and supports both upconversion (IF → RF) and downconversion (RF → IF), as confirmed in the General Description and Typical Applications sections. Its passive architecture and symmetric 50 Ω port matching enable either mode. Measured IP3 and conversion gain data are provided separately for upconverter and downconverter configurations in the datasheet-validating dual-mode use of the HMC1058-SX.
HMC1058-SX Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Analog Devices Inc.
- Series:
- -
- Package/Case:
- Die
- Packaging:
- Tray
- Product Status:
- Active
- RF Type:
- General Purpose
- Frequency:
- 71GHz ~ 86GHz
- Number of Mixers:
- 1
- Gain:
- -
- Noise Figure:
- -
- Secondary Attributes:
- Up/Down Converter
- Current - Supply:
- -
- Voltage - Supply:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- Die
HMC1058-SX FAQ
1.How can I place an order for HMC1058-SX through Aetrix?
Please submit a Request for Quotation (RFQ) for HMC1058-SX on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for HMC1058-SX reliable?
The price and inventory of HMC1058-SX are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for HMC1058-SX is usually 5 days.
3.What payment methods are accepted for HMC1058-SX?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for HMC1058-SX transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for HMC1058-SX?
HMC1058-SX orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your HMC1058-SX order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for HMC1058-SX?
For technical support, including HMC1058-SX datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your HMC1058-SX requirements.
6.How does Aetrix verify that HMC1058-SX is sourced from the original manufacturer or authorized distributors?
All HMC1058-SX products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that HMC1058-SX meets industry standards.
7.What is the process for return or replacement of HMC1058-SX?
All HMC1058-SX units undergo pre-shipment inspection (PSI). If there is an issue with HMC1058-SX, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The HMC1058-SX part is unused and in its original packaging.
Return procedure for HMC1058-SX:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
HMC1058-SX Tags

-
MAX2671EUT+T
Analog Devices Inc./Maxim Integrated

-
ADEX-10+
Mini-Circuits

-
ADE-2+
Mini-Circuits

-
ADE-1+
Mini-Circuits

-
LT5560EDD#PBF
Analog Devices Inc.

-
LT5560EDD#TRPBF
Analog Devices Inc.

-
LTC5562IUC#TRPBF
Analog Devices Inc.

-
MAX2681EUT+T
Analog Devices Inc./Maxim Integrated

-
ADE-1ASK+
Mini-Circuits

-
ADE-1L+
Mini-Circuits

-
ADL5350ACPZ-R7
Analog Devices Inc.

-
AD608ARZ-RL
Analog Devices Inc.
Tech Hub
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…

