Analog Devices Inc. HMC1063LP3ETR
- Part No.:
- HMC1063LP3ETR
- Manufacturer:
- Analog Devices Inc.
- Category:
- RF Mixers
- Package:
- 16-VFQFN Exposed Pad
- Datasheet:
-
HMC1063LP3ETR.pdf
- Description:
- IC RF MIXER IQ 24-28GHZ 16SMD
- Quantity:
- Payment:

- Shipping:

Inventory:2,880
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Product details
Overview
HMC1063LP3ETR from Analog Devices (formerly Hittite Microwave) is a GaAs MMIC I/Q mixer designed for 24–28 GHz RF systems, functioning as either an image-reject mixer or single-sideband upconverter. It delivers 21 dBc image rejection, −9.5 dB typical conversion gain, and +17 dBm input IP3 at 10 dBm LO drive, with DC–3 GHz IF bandwidth. It serves in millimeter-wave point-to-point radios and satellite communication front-ends.
For engineers reviewing the HMC1063LP3ETR datasheet, HMC1063LP3ETR pinout, HMC1063LP3ETR application, or HMC1063LP3ETR equivalent, key selection criteria include its 24–28 GHz RF range, 16-pin 3×3 mm SMT package, LSB/USB sideband suppression performance, LO-to-RF isolation of 42 dB, and compatibility with surface-mount manufacturing without wire bonding.
Technical Context
The HMC1063LP3ETR integrates two double-balanced GaAs Schottky diode mixer cells and an on-die 90° hybrid to enable intrinsic quadrature signal processing. Its architecture supports both downconversion (RF→IF) and upconversion (IF→RF) modes with external IF hybrid configuration.
It operates with a fixed 1000 MHz LSB IF output when used as an image-reject mixer, and achieves DC–3 GHz IF bandwidth in upconverter mode. LO drive requirement is low at +10 dBm, and thermal design is enabled by a thermally enhanced exposed paddle with 164 °C/W channel-to-ground thermal resistance.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| RF Frequency Range | 24–28 GHz - Covers full E-band (24–30 GHz) lower segment for 5G backhaul and radar. |
| LO Frequency Range | 21–31 GHz - Supports wide LO tuning for flexible local oscillator synthesis. |
| IF Bandwidth | DC–3 GHz - Enables baseband I/Q processing and wide instantaneous bandwidth reception. |
| Image Rejection | 21 dBc typical - Reduces image band interference without external filtering in receiver chains. |
| Conversion Gain | −9.5 dB typical - Defines signal path loss budget; requires low-noise amplification post-mixer. |
| Input IP3 | +17 dBm - Supports high dynamic range operation in crowded mmWave spectrums. |
| LO–RF Isolation | 42 dB typical - Minimizes LO leakage into antenna paths, easing filter requirements. |
Pinout & Package
Package: 16-lead 3×3 mm leadless Pb-free SMT package (MSL1, RoHS-compliant), with exposed ground paddle requiring soldering to PCB RF ground plane.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1, 5, 6, 8, 9, 12, 13, 15, 16 | N/C | Internally unconnected; must be externally grounded per RF layout best practice. |
| 2, 4, 10 | GND | Dedicated RF/DC ground pins; connect directly to ground plane with multiple vias. |
| 3 | LO | DC-coupled 50 Ω matched input; accepts +10 dBm nominal LO drive. |
| 7 | IF2 | Differential IF output (LSB/USB); DC-coupled; max ±3 mA current for DC operation. |
| 14 | IF1 | Differential IF output complement; paired with Pin 7 for I/Q signal extraction. |
| 11 | RFOUT | DC-coupled 50 Ω RF port; used as RF input in downconverter mode or RF output in upconverter mode. |
Key Features
| Feature | Design Value |
|---|---|
| Monolithic GaAs Schottky process | Enables stable 24–28 GHz operation with low phase noise contribution and high temperature tolerance (−40°C to +85°C). |
| Integrated 90° hybrid | Eliminates need for off-chip quadrature splitters, reducing board area and insertion loss in I/Q signal paths. |
| Low LO drive requirement | +10 dBm LO enables use with low-power synthesizers, lowering system power and heat dissipation. |
| DC–3 GHz IF bandwidth | Supports complex modulation schemes (e.g., QPSK, 16-QAM) and wideband digital predistortion feedback loops. |
| Exposed thermal paddle | 164 °C/W thermal resistance allows reliable 550 mW continuous dissipation at 85°C ambient. |
Applications
| Point-to-Point Radio | Satellite Communications |
|---|---|
Use Scenario: High-capacity 5G wireless backhaul links operating in E-band (24–28 GHz). IC Role / Device Role / Timing Role: I/Q downconverter extracting baseband I/Q signals from received RF carrier. Use Value: 21 dBc image rejection reduces adjacent-channel interference without external image-reject filters, shrinking BOM and footprint. |
Use Scenario: LEO satellite user terminal transceivers requiring compact, high-linearity mmWave mixing. IC Role / Device Role / Timing Role: Single-sideband upconverter translating baseband I/Q to 26 GHz transmit band. Use Value: +17 dBm input IP3 maintains signal fidelity under multi-carrier conditions, minimizing intermodulation distortion in shared spectrum. |
| Military Radar/EW | Millimeter-Wave Sensors |
Use Scenario: Phased-array radar receivers performing Doppler processing in 24–28 GHz bands. IC Role / Device Role / Timing Role: Image-reject mixer suppressing clutter-induced image responses in pulse-Doppler architectures. Use Value: 42 dB LO–RF isolation prevents LO radiation from compromising radar cross-section measurement accuracy. |
Use Scenario: Automotive or industrial 24 GHz radar sensors for object detection and velocity sensing. IC Role / Device Role / Timing Role: Compact I/Q demodulator enabling real-time phase-coherent IF sampling. Use Value: 3×3 mm SMT package allows dense array integration; DC–3 GHz IF supports high-resolution FMCW chirp processing. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar I/Q mixer applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| HMC1047LP3E | 20–28 GHz RF range; 18 dBc image rejection; −11 dB conversion gain; same 3×3 mm package. | Better suited for wider RF coverage including 20–24 GHz; lower image rejection limits dynamic range in high-selectivity receivers. | Select when broader low-end RF coverage is required and 21 dBc image rejection is not mandatory. |
| Qorvo QM11024 | 24–30 GHz RF range; 25 dBc image rejection; −8 dB conversion gain; 4×4 mm QFN package. | Higher image rejection improves sensitivity in narrowband EW systems; larger footprint increases layout complexity. | Select when >23 dBc image rejection is critical and board space permits 4×4 mm footprint. |
Compared with HMC1063LP3ETR, HMC1047LP3E trades RF bandwidth extension for reduced image rejection and gain, while QM11024 offers superior image suppression in a larger package-making HMC1063LP3ETR optimal for space-constrained E-band systems needing balanced performance.
Availability
HMC1063LP3ETR is available at Aetrix Electronics and suitable for point-to-point radio, satellite communications, and military radar applications requiring stable component supply across extended temperature ranges and high-frequency reliability.
Supply support for HMC1063LP3ETR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Analog Devices acquired Hittite Microwave in 2014 and continues its legacy of high-performance RF/mmWave ICs for defense, aerospace, and communications markets.
The HMC1063LP3ETR belongs to Hittite's GaAs MMIC I/Q mixer product line, engineered specifically for compact, high-linearity E-band transceivers where integration, thermal efficiency, and sideband purity are critical.
FAQ
What is the recommended LO drive level for optimal performance of the HMC1063LP3ETR?
The HMC1063LP3ETR is characterized at +10 dBm LO drive, delivering −9.5 dB typical conversion gain and 21 dBc image rejection. Lower LO power degrades conversion gain and image rejection; higher levels increase distortion. Operation outside +8 to +12 dBm requires verification against the datasheet's LO drive vs. performance curves. The HMC1063LP3ETR performs best when driven precisely at +10 dBm across its 24–28 GHz RF band.
Can the HMC1063LP3ETR operate with DC-coupled IF outputs?
Yes, the HMC1063LP3ETR supports DC-coupled IF operation on Pins 7 (IF2) and 14 (IF1), but total DC current sourced or sunk per pin must not exceed ±3 mA to prevent malfunction or damage. For AC-coupled applications, external DC blocking capacitors are recommended. This capability enables direct connection to baseband ADCs or I/Q demodulators without level-shifting circuitry, preserving signal integrity in zero-IF architectures.
What is the thermal management requirement for the HMC1063LP3ETR?
The HMC1063LP3ETR features an exposed ground paddle with 164 °C/W thermal resistance. To maintain junction temperature ≤175 °C, the paddle must be soldered to a solid PCB ground plane using ≥9 thermal vias (0.3 mm diameter, spaced ≤1 mm apart). At 85 °C ambient, maximum continuous dissipation is 550 mW; derating is 6 mW/°C above that. Proper thermal design ensures stable conversion gain and IP3 over −40°C to +85°C operation.
Does the HMC1063LP3ETR require an external 90° hybrid for I/Q operation?
No-the HMC1063LP3ETR integrates a monolithic 90° hybrid for internal quadrature generation. However, external IF hybrids are used in evaluation setups to optimize sideband rejection beyond the on-die capability. When used as an image-reject mixer, the HMC1063LP3ETR achieves 21 dBc rejection without external hybrids; adding one can improve rejection to >30 dBc in calibrated systems. The HMC1063LP3ETR's self-contained architecture eliminates discrete hybrid components in most standard implementations.
What are the absolute maximum ratings for RF and LO inputs on the HMC1063LP3ETR?
The HMC1063LP3ETR has absolute maximum ratings of +13 dBm for RF input (at +10 dBm LO), +14.5 dBm for LO input (at −10 dBm RF), and +11.5 dBm for IF input. Exceeding these risks permanent damage. These limits assume proper thermal management and grounding. The device is ESD-sensitive (HBM Class 1A), requiring strict handling precautions. Operating near these limits degrades long-term reliability-design margins should keep sustained RF/LO inputs ≥3 dB below absolute maxima.
HMC1063LP3ETR Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Analog Devices Inc.
- Series:
- -
- Package/Case:
- 16-VFQFN Exposed Pad
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- RF Type:
- General Purpose
- Frequency:
- 24GHz ~ 28GHz
- Number of Mixers:
- 2
- Gain:
- -
- Noise Figure:
- -
- Secondary Attributes:
- Up Converter
- Current - Supply:
- -
- Voltage - Supply:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 16-QFN (3x3)
HMC1063LP3ETR FAQ
1.How can I place an order for HMC1063LP3ETR through Aetrix?
Please submit a Request for Quotation (RFQ) for HMC1063LP3ETR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for HMC1063LP3ETR reliable?
The price and inventory of HMC1063LP3ETR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for HMC1063LP3ETR is usually 5 days.
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Once your HMC1063LP3ETR order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for HMC1063LP3ETR?
For technical support, including HMC1063LP3ETR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your HMC1063LP3ETR requirements.
6.How does Aetrix verify that HMC1063LP3ETR is sourced from the original manufacturer or authorized distributors?
All HMC1063LP3ETR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that HMC1063LP3ETR meets industry standards.
7.What is the process for return or replacement of HMC1063LP3ETR?
All HMC1063LP3ETR units undergo pre-shipment inspection (PSI). If there is an issue with HMC1063LP3ETR, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The HMC1063LP3ETR part is unused and in its original packaging.
Return procedure for HMC1063LP3ETR:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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