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Analog Devices Inc. HMC1106-SX
- Part No.:
- HMC1106-SX
- Manufacturer:
- Analog Devices Inc.
- Category:
- RF Mixers
- Package:
- Die
- Datasheet:
-
HMC1106-SX.pdf
- Description:
- IC MMIC MIXER 15-36GHZ DIE
- Quantity:
- Payment:
- Shipping:
Inventory:4,651
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Product details
Overview
HMC1106-SX from Analog Devices (formerly Hittite Microwave) is a GaAs MMIC double-balanced passive mixer die for microwave downconversion, operating with RF input 15–36 GHz, LO drive 20–50 GHz, and IF output DC–24 GHz. It requires no DC bias, delivers +15 dBm LO drive, achieves 38 dB LO/RF isolation, and supports automotive radar and SATCOM front-ends.
For engineers reviewing the HMC1106-SX datasheet, HMC1106-SX pinout, HMC1106-SX application, or HMC1106-SX equivalent, key selection criteria include its wide IF bandwidth, low conversion loss (typ. 11 dB), high input IP3 (typ. 22 dBm), and die-level integration for millimeter-wave system-in-package designs.
Technical Context
The HMC1106-SX implements a double-balanced Schottky diode ring topology fabricated on GaAs, enabling broadband passive mixing without DC bias. Its symmetrical layout provides inherent suppression of even-order harmonics and local oscillator leakage.
It operates as a downconverter with fixed-IF or swept-IF configurations, supporting LSB operation across all specified bands. All bond pads are Ti/Au metallized and fully passivated, with the die backside serving as RF/DC ground reference.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| RF Frequency Range | 15–36 GHz - covers E-band and Ka-band radar/satcom channels |
| LO Frequency Range | 20–50 GHz - enables flexible local oscillator synthesis for multi-band systems |
| IF Frequency Range | DC–24 GHz - supports baseband I/Q demodulation and wideband IF digitization |
| Conversion Loss | Typ. 11 dB (max 14 dB) - defines signal path attenuation in receiver chain design |
| LO/RF Isolation | 38 dB - limits LO radiation into antenna path, critical for transmit/receive coexistence |
| Input IP3 | Typ. 22 dBm - determines third-order intermodulation handling in dense RF environments |
| Die Size | 1.79 × 1.46 × 0.1 mm - enables compact multilayer module integration with minimal parasitic coupling |
Pinout & Package
Package: Bare die (chip) in GP-2 gel pack; 0.102 mm (0.004″) thick GaAs substrate; backside metallized Ti/Au for RF/DC grounding.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| Pad 1 | LO Input | AC-coupled 50 Ω matched port; accepts +13 to +17 dBm LO drive |
| Pad 2 | RF Input | AC-coupled 50 Ω matched port; handles 15–36 GHz RF signal with -55 to +85 °C operation |
| Pad 3 | IF Output | DC-coupled 50 Ω matched port; delivers downconverted signal from DC to 24 GHz |
| Die Bottom | GND | Required RF/DC ground connection; must be eutectically or conductively bonded to system ground plane |
Key Features
| Feature | Design Value |
|---|---|
| No DC bias required | Eliminates external bias networks and associated noise/leakage paths in high-frequency layouts |
| +15 dBm typical LO drive | Reduces need for high-power LO amplifiers in compact transceiver modules |
| 38 dB LO/RF isolation | Minimizes LO leakage into antenna path, easing filtering requirements in full-duplex systems |
| DC–24 GHz IF bandwidth | Enables direct sampling of wide IF signals without intermediate frequency translation stages |
| Class 1A ESD rating (250 V HBM) | Supports robust handling during assembly while maintaining millimeter-wave performance integrity |
Applications
| Automotive Radar | SATCOM Terminals |
|---|---|
Use Scenario: 77 GHz FMCW radar transceiver in ADAS forward collision warning system. IC Role / Device Role / Timing Role: Downconverter translating 76–81 GHz RF echo to 1–6 GHz IF for ADC sampling. Use Value: 38 dB LO/RF isolation prevents self-interference; DC–24 GHz IF supports complex modulation schemes including chirp compression. |
Use Scenario: Outdoor VSAT terminal receiving Ku-band downlink (10.7–12.75 GHz) with uplink LO at 13 GHz. IC Role / Device Role / Timing Role: Image-reject mixer in dual-conversion LNB architecture with first IF at 0.9–5.5 GHz. Use Value: Wide 15–36 GHz RF range accommodates multiple satellite bands; +15 dBm LO drive simplifies LO chain design. |
| Test Equipment | Military EW Systems |
Use Scenario: Portable spectrum analyzer front-end covering 26.5–40 GHz with real-time bandwidth >1 GHz. IC Role / Device Role / Timing Role: First-stage mixer converting RF to mid-IF (e.g., 2–6 GHz) before further downconversion. Use Value: Low 11 dB typ. conversion loss preserves dynamic range; 22 dBm input IP3 maintains linearity under strong interferers. |
Use Scenario: Electronic warfare receiver detecting pulsed radar signals across Ka-band (26.5–40 GHz). IC Role / Device Role / Timing Role: High-isolation mixer in channelized receiver architecture with fast-tuning LO synthesizer. Use Value: 32 dB LO/IF isolation suppresses LO feedthrough into sensitive IF amplifiers; die form factor enables conformal array integration. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar passive mixer applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| HMC1048-SX | Narrower RF range (17–27 GHz); higher conversion loss (13 dB typ.); same die size and pad layout | Limited to lower Ka-band; less suitable for 30+ GHz radar or SATCOM uplinks | Select when cost sensitivity outweighs bandwidth need and LO power budget allows +17 dBm drive |
| QPC1006 | GaAs pHEMT-based active mixer; requires +5 V bias; 18–44 GHz RF; 10 dB conversion gain | Provides gain instead of loss; adds noise figure penalty (~8 dB); needs bias sequencing | Choose only when system-level NF budget permits active gain and board space allows bias circuitry |
Compared with HMC1048-SX, the HMC1106-SX extends RF coverage to 36 GHz with 2 dB lower conversion loss; versus QPC1006, it eliminates bias complexity and LO noise multiplication but requires external IF amplification due to passive loss.
Availability
HMC1106-SX is available at Aetrix Electronics and suitable for microwave point-to-point radios, automotive radar modules, and SATCOM terminals requiring stable component supply across extended temperature ranges and high-frequency performance consistency.
Supply support for HMC1106-SX includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Analog Devices acquired Hittite Microwave in 2014 and integrates its high-frequency RF portfolio into precision analog and RF solutions for defense, communications, and instrumentation markets.
The HMC1106-SX belongs to the Hittite GaAs MMIC mixer product line, designed specifically for millimeter-wave downconversion in space-constrained, high-isolation receiver architectures.
FAQ
What is the maximum LO input power rating for the HMC1106-SX?
The HMC1106-SX has an absolute maximum LO input power of +17 dBm, with typical operation specified at +15 dBm. Exceeding +17 dBm risks permanent damage to the Schottky diodes. Derating is required above +85 °C ambient per the 157 mW continuous dissipation limit and 570 °C/W thermal resistance specification. Always verify LO source stability and transient suppression in final design.
Does the HMC1106-SX require DC bias or external matching components?
No, the HMC1106-SX is a passive double-balanced mixer requiring no DC bias. All three ports (LO, RF, IF) are internally matched to 50 Ω, with AC coupling on LO and RF pads and DC coupling on the IF pad. External matching is unnecessary in a 50 Ω environment contacted via RF probes or properly designed microstrip transitions.
What is the operating temperature range for the HMC1106-SX?
The HMC1106-SX is rated for operation from –55 °C to +85 °C, with storage temperature spanning –65 °C to +150 °C. Performance data (e.g., conversion loss, IP3, isolation) is characterized at +25 °C but validated across this full range, including plots showing variation at –55 °C and +85 °C in the datasheet.
How is the die grounded, and what mounting method is recommended?
The HMC1106-SX die bottom serves as the primary RF/DC ground and must be bonded directly to the system ground plane. Recommended methods include AuSn eutectic die attach (255–265 °C work surface) or conductive epoxy. Mechanical mounting must avoid surface contact-handle only by edges-and maintain ≤0.152 mm die-to-substrate spacing to minimize bond wire inductance.
Can the HMC1106-SX be used for upconversion?
The HMC1106-SX is characterized and optimized for downconversion (RF → IF), with datasheet specifications and application notes focused on LSB operation. While its double-balanced topology is theoretically bidirectional, upconversion performance (IF → RF) is not guaranteed, characterized, or supported by Analog Devices; use requires full system-level validation of spurious output, conversion gain/loss, and isolation behavior.
HMC1106-SX Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Analog Devices Inc.
- Series:
- -
- Package/Case:
- Die
- Packaging:
- Tray
- Product Status:
- Active
- RF Type:
- VSAT
- Frequency:
- 15GHz ~ 36GHz
- Number of Mixers:
- 1
- Gain:
- -
- Noise Figure:
- -
- Secondary Attributes:
- -
- Current - Supply:
- -
- Voltage - Supply:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- Die
HMC1106-SX FAQ
1.How can I place an order for HMC1106-SX through Aetrix?
Please submit a Request for Quotation (RFQ) for HMC1106-SX on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for HMC1106-SX reliable?
The price and inventory of HMC1106-SX are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for HMC1106-SX is usually 5 days.
3.What payment methods are accepted for HMC1106-SX?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for HMC1106-SX transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for HMC1106-SX?
HMC1106-SX orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your HMC1106-SX order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for HMC1106-SX?
For technical support, including HMC1106-SX datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your HMC1106-SX requirements.
6.How does Aetrix verify that HMC1106-SX is sourced from the original manufacturer or authorized distributors?
All HMC1106-SX products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that HMC1106-SX meets industry standards.
7.What is the process for return or replacement of HMC1106-SX?
All HMC1106-SX units undergo pre-shipment inspection (PSI). If there is an issue with HMC1106-SX, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The HMC1106-SX part is unused and in its original packaging.
Return procedure for HMC1106-SX:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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