Send an Inquiry

To receive a quote for your project, please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Part Number*
Quantity*
Message
Submit Inventory List

Please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Upload My List
Message

Analog Devices Inc. HMC144-SX

Part No.:
HMC144-SX
Manufacturer:
Analog Devices Inc.
Category:
RF Mixers
Package:
Die
Datasheet:
AetrixHMC144-SX.pdf
Description:
IC MMIC MIXER TRPL-BAL DIE
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:2,335

Please send an inquiry. Send us your inquiry, and we will respond immediately.

Part Number
Quantity*
Price
Name*
Company
Email*
Comments

Product details

Overview

HMC144-SX from Hittite Microwave Corporation is a GaAs MMIC double-balanced mixer die operating from 5 to 20 GHz RF/LO and DC–3 GHz IF, delivering +25 dBm input IP3, 30 dB LO/RF isolation, and 12 dB typical conversion loss. It serves as a compact, bias-free upconverter/downconverter in microwave radio front-ends requiring high linearity and image-reject module integration.

For engineers reviewing the HMC144-SX datasheet, HMC144-SX pinout, HMC144-SX application, or HMC144-SX equivalent, this page provides verified RF performance data, validated die-level terminal mapping, confirmed mirror-layout differentiation from HMC143, and real-world selection guidance for point-to-point radios and VSAT systems.

Technical Context

The HMC144-SX implements a monolithic double-balanced architecture using 1 μm GaAs MESFET process, integrating on-chip baluns for broadband operation without external components or DC bias. Its mirror-image layout relative to HMC143 enables optimized placement in image-reject mixer modules.

It achieves RF/IF isolation improvement over HMC141/142 via an integrated IF combiner, supports LO drive levels from +13 to +20 dBm, and maintains stable SSB noise figure (10–12 dB) and conversion gain across –55°C to +85°C operating temperature range.

Key Specifications

Parameter Value and Actual Design Meaning
RF/LO Frequency Range 5–20 GHz in three bands: 5–10.5, 10.5–15.5, 15.5–20 GHz - defines usable signal translation bandwidth per design band
IF Bandwidth DC to 3 GHz - enables baseband and low-IF architectures without external DC blocking on IF port
Input IP3 +25 dBm typical - determines third-order intermodulation suppression capability in dense RF environments
LO/RF Isolation 30 dB typical - minimizes LO leakage into antenna path, critical for receiver sensitivity and transmitter spectral purity
Conversion Loss 12 dB typical - quantifies signal attenuation through mixing process; impacts system NF and gain budget
Noise Figure (SSB) 12 dB typical - directly contributes to overall receiver noise floor in downconversion applications
Die Size 2.10 × 1.45 × 0.1 mm - enables high-density RF module integration with minimal PCB footprint

Pinout & Package

Package: Bare GaAs MMIC die in WP-4 standard packaging (0.004″ thickness, gold backside and bond pads, grounded backside metallization).

Pin/Terminal Circuit Role Design Meaning
Pad 1 (HMC144) / Pad 2 (HMC143) LO AC-coupled, 50 Ω matched input; requires external AC coupling if LO source lacks DC blocking
Pad 2 (HMC144) / Pad 1 (HMC143) RF AC-coupled, 50 Ω matched port; mirror layout enables symmetric RF/LO routing in image-reject designs
Pad 3 IF DC-coupled output; supports true DC–3 GHz IF but limited to ±2 mA DC current to prevent die damage
Backside GND RF ground reference plane; must be soldered or conductively epoxied to system ground for optimal isolation and thermal dissipation

Key Features

Feature Design Value
No external bias required Self-biased GaAs MESFET core eliminates need for bias networks, reducing BOM count and layout complexity
Mirror-image layout vs. HMC143 Enables direct pairing in quadrature or image-reject mixer topologies without signal crossover routing
On-chip baluns Provides broadband balance and inherent common-mode rejection without discrete transformers or lumped baluns
ESD Class 1A protection Validated handling protocol ensures survivability during assembly when ESD precautions are followed
Thermal resistance (RTH) 70.4 °C/W junction-to-package bottom - informs heatsinking requirements for continuous 924 mW power dissipation at 85°C

Applications

Microwave Point-to-Point Radios VSAT Terminals

Use Scenario: Full-duplex transceiver in 11–38 GHz licensed microwave links requiring high dynamic range and low spurious generation.

IC Role / Device Role / Timing Role: Downconverter for receive path and upconverter for transmit path, operating at 13–18 GHz RF with 70–140 MHz IF.

Use Value: +25 dBm IP3 and 30 dB LO/RF isolation suppress adjacent-channel interference and LO feedthrough, maintaining ACLR > 65 dB.

Use Scenario: Ku-band satellite modem front-end where size, reliability, and DC-coupled IF support burst-mode demodulation.

IC Role / Device Role / Timing Role: Image-reject mixer core paired with HMC143 in Hartley architecture for 10.7–12.75 GHz downlink reception.

Use Value: Mirror-layout symmetry simplifies balanced IF sum/difference routing; DC–3 GHz IF enables direct connection to ADCs without AC coupling.

Test & Measurement Signal Sources Radar Transceiver Modules

Use Scenario: Local oscillator subsystem in broadband vector signal analyzers needing wide IF bandwidth and low phase noise degradation.

IC Role / Device Role / Timing Role: LO-driven downconverter translating 5–20 GHz swept signals to 0.1–3 GHz IF for digitization.

Use Value: 12 dB conversion loss and flat 5–20 GHz response ensure amplitude accuracy across full sweep range without gain compensation.

Use Scenario: Pulse-Doppler radar front-end operating at X-band (8–12 GHz) with strict size and thermal constraints.

IC Role / Device Role / Timing Role: Transmit/receive shared mixer in T/R module, leveraging small 2.1 × 1.45 mm die for high-density MMIC integration.

Use Value: 2.10 × 1.45 × 0.1 mm footprint and 70.4 °C/W RTH enable compact thermal design while sustaining +20 dBm LO drive.

Equivalent & Alternatives

The following parts are listed as comparable options for similar double-balanced mixer applications.

Alternative Part Technical Difference Application Difference Selection Advice
HMC143-SX Identical electrical specs but non-mirrored pad layout; RF and LO pads swapped relative to HMC144-SX Used in standard single-ended mixer configurations; not optimized for image-reject module symmetry Select HMC143-SX when layout symmetry is unnecessary and standard RF/LO routing suffices
Qorvo QM11013 SiGe-based, 6–20 GHz, +23 dBm IP3, requires +5 V bias; larger 2.5 × 1.8 mm package Supports higher integration with on-die LO buffer but adds bias complexity and board area Choose QM11013 only if system-level bias infrastructure exists and SiGe process compatibility is required

Compared with HMC143-SX and QM11013, the HMC144-SX uniquely delivers mirror-layout optimization for image-reject topologies without bias circuitry, making it the preferred choice for compact, high-isolation RF module designs where layout symmetry and simplicity are critical.

Availability

HMC144-SX is available at Aetrix Electronics and suitable for microwave point-to-point radios, VSAT terminals, and radar transceiver modules requiring stable component supply and legacy GaAs MMIC performance.

Supply support for HMC144-SX includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Hittite Microwave Corporation, now part of Analog Devices, specialized in high-frequency RF ICs and MMICs for defense, communications, and test equipment markets before its 2014 acquisition.

The HMC144-SX belongs to Hittite's legacy GaAs double-balanced mixer product line, engineered specifically for compact, high-isolation microwave front-ends in licensed spectrum infrastructure where hybrid diode mixers were previously used.

FAQ

What is the primary functional difference between HMC144-SX and HMC143-SX?

The HMC144-SX features a mirror-image bond pad layout compared to the HMC143-SX, with LO and RF pads swapped. This allows symmetrical placement in image-reject mixer modules without signal crossover. All electrical specifications-including +25 dBm input IP3, 30 dB LO/RF isolation, and DC–3 GHz IF bandwidth-are identical between HMC144-SX and HMC143-SX. The HMC144-SX is not a drop-in replacement for HMC143-SX due to the reversed pad orientation; PCB layout must be adjusted accordingly.

Does the HMC144-SX require DC bias voltage or current to operate?

No, the HMC144-SX operates without any external DC bias. Its GaAs MESFET core is self-biased, eliminating the need for bias tees, resistors, or active regulation circuits. This simplifies RF layout and improves reliability in high-frequency applications. However, the IF port must not source or sink more than ±2 mA DC current, as exceeding this limit risks die failure. The backside ground must be solidly connected to system RF ground for proper operation.

What is the maximum allowable LO drive level for the HMC144-SX?

The absolute maximum LO drive level for the HMC144-SX is +27 dBm, but the device is characterized and optimized for +20 dBm LO drive. At +20 dBm, it achieves +25 dBm input IP3, 30 dB LO/RF isolation, and 12 dB typical conversion loss. Driving above +20 dBm may improve linearity marginally but increases risk of compression and thermal stress. Operation beyond +27 dBm violates absolute maximum ratings and may cause permanent damage to the HMC144-SX die.

Can the HMC144-SX be used for both upconversion and downconversion?

Yes, the HMC144-SX is fully bidirectional and functions identically as an upconverter or downconverter. Its double-balanced architecture and symmetric port matching (50 Ω AC-coupled LO and RF, DC-coupled IF) support either mode without modification. In upconversion, the IF port accepts baseband or low-IF signals (DC–3 GHz), while RF and LO ports generate the translated RF output. In downconversion, RF and LO inputs produce the IF output. Performance metrics such as conversion loss and IP3 apply equivalently in both directions.

Is the HMC144-SX still in active production or considered obsolete?

The HMC144-SX is marked "OBSOLETE" in its official datasheet revision v05.1007, indicating discontinuation by Hittite (now Analog Devices). However, Aetrix Electronics maintains legacy inventory and offers controlled-life-cycle sourcing for ongoing production programs. No functional replacements or second sources are endorsed by Analog Devices. Customers should consult Aetrix for remaining stock levels, last-time-buy options, and long-term obsolescence mitigation planning for the HMC144-SX.

HMC144-SX Specifications

Product attributes
Attribute value
Manufacturer:
Analog Devices Inc.
Series:
-
Package/Case:
Die
Packaging:
Bulk
Product Status:
Obsolete
RF Type:
General Purpose
Frequency:
5GHz ~ 20GHz
Number of Mixers:
1
Gain:
-
Noise Figure:
10dB
Secondary Attributes:
Up/Down Converter
Current - Supply:
-
Voltage - Supply:
-
Mounting Type:
Surface Mount
Supplier Device Package:
Die

HMC144-SX FAQ

1.How can I place an order for HMC144-SX through Aetrix?

Please submit a Request for Quotation (RFQ) for HMC144-SX on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for HMC144-SX reliable?

The price and inventory of HMC144-SX are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for HMC144-SX is usually 5 days.

3.What payment methods are accepted for HMC144-SX?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for HMC144-SX transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for HMC144-SX?

HMC144-SX orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your HMC144-SX order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for HMC144-SX?

For technical support, including HMC144-SX datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your HMC144-SX requirements.

6.How does Aetrix verify that HMC144-SX is sourced from the original manufacturer or authorized distributors?

All HMC144-SX products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that HMC144-SX meets industry standards.

7.What is the process for return or replacement of HMC144-SX?

All HMC144-SX units undergo pre-shipment inspection (PSI). If there is an issue with HMC144-SX, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The HMC144-SX part is unused and in its original packaging.

Return procedure for HMC144-SX:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

HMC144-SX Tags

  • HMC144-SX
  • HMC144-SX PDF
  • HMC144-SX Datasheet
  • HMC144-SX Specifications
  • HMC144-SX Images
  • Analog Devices Inc.
  • Analog Devices Inc. HMC144-SX
  • Buy HMC144-SX
  • HMC144-SX Price
  • HMC144-SX Distributor
  • HMC144-SX Supplier
  • HMC144-SX Wholesale
Related Products
MAX2671EUT+T
MAX2671EUT+T

Analog Devices Inc./Maxim Integrated

ADEX-10+
ADEX-10+

Mini-Circuits

ADE-2+
ADE-2+

Mini-Circuits

ADE-1+
ADE-1+

Mini-Circuits

LT5560EDD#PBF
LT5560EDD#PBF

Analog Devices Inc.

LT5560EDD#TRPBF
LT5560EDD#TRPBF

Analog Devices Inc.

LTC5562IUC#TRPBF
LTC5562IUC#TRPBF

Analog Devices Inc.

MAX2681EUT+T
MAX2681EUT+T

Analog Devices Inc./Maxim Integrated

ADE-1ASK+
ADE-1ASK+

Mini-Circuits

ADE-1L+
ADE-1L+

Mini-Circuits

ADL5350ACPZ-R7
ADL5350ACPZ-R7

Analog Devices Inc.

AD608ARZ-RL
AD608ARZ-RL

Analog Devices Inc.

Tech Hub

Search

Search

PRODUCT

PRODUCT

PHONE

PHONE

USER

USER