Analog Devices Inc. HMC174MS8
- Part No.:
- HMC174MS8
- Manufacturer:
- Analog Devices Inc.
- Category:
- RF Switches
- Package:
- 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
- Datasheet:
-
HMC174MS8.pdf
- Description:
- IC RF SWITCH SPDT 3GHZ 8MSOP
- Quantity:
- Payment:

- Shipping:

Inventory:3,689
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
HMC174MS8 from Analog Devices (formerly Hittite Microwave) is a GaAs MMIC SPDT transmit/receive switch for RF front-end signal routing in DC–3 GHz systems. It delivers 0.5 dB typical insertion loss at 2 GHz, +60 dBm input IP3 at 0/8 V control, and operates with single positive supply (3–10 V). Its reflective OFF-state design and CMOS/TTL-compatible control make it suitable for LNA protection and cellular/3G transceiver paths.
For engineers reviewing the HMC174MS8 datasheet, HMC174MS8 pinout, HMC174MS8 application, or HMC174MS8 equivalent, key selection criteria include its 0.5 dB insertion loss at 2 GHz, +60 dBm IIP3 at 8 V bias, MSOP-8 package footprint, reflective OFF-state behavior, and compatibility with 3–8 V logic-level control inputs.
Technical Context
The HMC174MS8 implements a GaAs-based monolithic SPDT T/R switch architecture with integrated bias control circuitry enabling single-supply operation. It uses reflective switching: RF1 and RF2 present short-circuit terminations when OFF, while RFC remains active during signal path selection.
Control logic follows a two-input truth table (A/B pins) with ±0.2 V tolerance, supporting 3–10 V Vdd and compatible with HC/HCT logic families. Switching speed is characterized by 10 ns tRISE/tFALL and 24 ns tON/tOFF across DC–3 GHz.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Frequency Range | DC to 3 GHz - supports full-band cellular/3G/WiMAX operation without external tuning |
| Insertion Loss (2 GHz) | 0.5 dB typical - minimizes signal attenuation in high-gain receive paths |
| Input IP3 (0.5–1.0 GHz) | +60 dBm at 8 V - enables high-linearity operation in crowded RF environments |
| Isolation (1 GHz) | 26 dB typical - suppresses leakage between transmit and receive paths |
| Switching Speed | 10 ns rise/fall time - supports fast TDD mode transitions in LTE/WiMAX base stations |
| Supply Voltage Range | 3 V to 10 V - allows flexible biasing for power vs. linearity trade-offs |
| Operating Temperature | −40 °C to +85 °C - qualified for automotive telematics and industrial outdoor equipment |
Pinout & Package
Package: MSOP-8 (14.8 mm²), low-stress injection-molded plastic, Sn/Pb lead finish, MSL1 rated. All ground pins (6, 7) must be soldered directly to PCB RF ground plane; RFC, RF1, and RF2 are DC-coupled 50 Ω ports requiring external blocking capacitors.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 (A) | Control Input A | Logic-select pin per truth table; accepts 0 to Vdd voltage; ±0.2 V tolerance |
| 2 (B) | Control Input B | Complementary logic-select pin; determines RF path state with A |
| 3 (RFC) | Common RF Port | DC-coupled 50 Ω input/output; connects to antenna or transceiver RF interface |
| 4 (Vdd) | Positive Supply | Bias input (3–10 V); sets RF power handling and linearity performance |
| 5 (RF1) | RF Path 1 | DC-coupled 50 Ω port; reflective short when OFF; used for TX or RX path |
| 6, 7 (GND) | Ground Terminals | RF/DC ground connections; must be low-inductance soldered to PCB ground plane |
| 8 (RF2) | RF Path 2 | DC-coupled 50 Ω port; reflective short when OFF; alternate TX or RX path |
Key Features
| Feature | Design Value |
|---|---|
| Reflective OFF-state | RF1 and RF2 present shorts when unselected - eliminates need for external termination resistors |
| Single-supply operation | 3–10 V Vdd enables direct integration with system logic rails without charge pumps or negative supplies |
| CMOS/TTL-compatible control | A/B inputs accept standard logic levels (0/Vdd) - simplifies interface with FPGA or baseband processor GPIOs |
| High-power RF capability | P1dB = 36 dBm at 0.5–3 GHz with 8 V bias - supports high-output PA stages and repeater front-ends |
| Low DC current draw | 25 µA control current at 5 V - reduces standby power in battery-operated portable wireless devices |
Applications
| Infrastructure & Repeaters | Cellular/3G Base Stations |
|---|---|
Use Scenario: Bidirectional signal routing in macrocell repeaters handling uplink/downlink separation. IC Role / Device Role / Timing Role: SPDT T/R switch selecting between antenna and transceiver chains in FDD/TDD configurations. Use Value: 0.5 dB insertion loss preserves link budget; +60 dBm IIP3 prevents intermodulation distortion from adjacent channel interference. |
Use Scenario: Front-end switching in 3G UMTS femtocells and picocells for simultaneous TX/RX path isolation. IC Role / Device Role / Timing Role: Reflective SPDT switch managing antenna duplexing where external circulators are impractical. Use Value: 26 dB isolation at 2 GHz ensures sufficient TX-to-RX suppression; MSOP-8 footprint enables compact multilayer PCB layout. |
| LNA Protection | Automotive Telematics |
Use Scenario: Placed before LNA input to shunt high-power TX bursts away from sensitive receiver components. IC Role / Device Role / Timing Role: Fast-switching protective switch activated synchronously with PA enable signals. Use Value: 10 ns tRISE ensures LNA is isolated before TX ramp-up; reflective OFF-state avoids DC path to LNA input. |
Use Scenario: RF path selection in vehicle-mounted 4G LTE modems and V2X communication modules operating in harsh thermal environments. IC Role / Device Role / Timing Role: T/R switch routing GNSS, cellular, and DSRC signals through shared antenna interfaces. Use Value: −40 °C to +85 °C rating ensures reliability under hood temperature cycling; 3.3 V compatibility matches automotive MCU I/O levels. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar SPDT T/R switch applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| Qorvo QM11036 | 0.6 dB IL @ 2 GHz; +55 dBm IIP3; 3–5 V only; QFN-12 package | Lower power handling; requires PCB redesign due to different footprint and ground pad layout | Preferred for new designs targeting RoHS-only supply chains and higher integration density |
| Skyworks SKY13370-374LF | 0.7 dB IL @ 2 GHz; +57 dBm IIP3; 1.8–5 V control; 2×2 mm QFN-6 | Narrower voltage range; smaller package limits thermal dissipation at high RF power | Selected when space-constrained layouts and 1.8 V logic compatibility are prioritized over peak linearity |
Compared with QM11036 and SKY13370-374LF, the HMC174MS8 offers superior third-order intercept (+60 dBm) and wider supply flexibility (3–10 V), making it optimal for high-dynamic-range infrastructure and automotive applications where RF robustness outweighs footprint minimization.
Availability
HMC174MS8 is available at Aetrix Electronics and suitable for infrastructure & repeaters, cellular/3G base stations, and LNA protection applications requiring stable component supply, long-term lifecycle support, and traceable sourcing for production programs.
Supply support for HMC174MS8 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Analog Devices acquired Hittite Microwave in 2014 and maintains its high-frequency RF portfolio, specializing in GaAs, GaN, and SiGe MMIC solutions for defense, communications, and test equipment.
The HMC174MS8 belongs to Hittite's legacy GaAs SPDT T/R switch product line, engineered for high-linearity, wideband RF front-end signal routing in wireless infrastructure and portable transceivers.
FAQ
What is the maximum RF input power the HMC174MS8 can handle without compression?
The HMC174MS8 delivers 36 dBm input P1dB across 0.5–3.0 GHz when biased at 8 V. At lower Vdd (e.g., 5 V), P1dB drops to 32 dBm. These values are measured under 50 Ω conditions with matched ports and reflect actual large-signal compression thresholds used in repeater and base station front-end design. The HMC174MS8 must be operated within these limits to avoid gain compression and harmonic generation.
Does the HMC174MS8 require external termination resistors on RF1 and RF2 when OFF?
No. The HMC174MS8 presents reflective shorts at RF1 and RF2 when those paths are OFF, eliminating the need for external 50 Ω termination resistors. This internal termination simplifies PCB layout and reduces component count in space-constrained RF modules. The RFC port remains active during switching, and all RF ports are DC-coupled - external DC-blocking capacitors remain mandatory.
Can the HMC174MS8 operate with 1.8 V logic control inputs?
No. The HMC174MS8 requires control voltages referenced to Vdd, with valid logic states defined as 0 V and Vdd (±0.2 V tolerance). Its minimum Vdd is 3 V, so 1.8 V logic cannot directly drive A/B pins. To interface with 1.8 V controllers, level-shifting circuitry or a compatible 3.3 V logic family (e.g., 74LVC) must be used. The HMC174MS8 does not support independent low-voltage control signaling.
What is the thermal resistance (θJA) of the HMC174MS8 in its MSOP-8 package?
The HMC174MS8 datasheet does not specify θJA explicitly. However, its MSOP-8 package features exposed ground leads (pins 6 and 7) that must be soldered to a solid PCB ground plane to achieve effective thermal dissipation. Under recommended layout - including thermal vias and copper pour - the device sustains continuous RF power up to its P1dB rating across −40 °C to +85 °C ambient without derating, as verified in Hittite's application notes and evaluation board testing.
Is the HMC174MS8 pin-compatible with the HMC174MS8E variant?
Yes. The HMC174MS8 and HMC174MS8E share identical pinout, electrical specifications, and mechanical dimensions. The sole difference is RoHS compliance: HMC174MS8E uses 100% matte tin lead finish and has MSL1 reflow rating up to 260 °C, whereas HMC174MS8 uses Sn/Pb finish and 235 °C reflow limit. Both variants use the same H174 package marking and are functionally interchangeable in existing designs.
HMC174MS8 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Analog Devices Inc.
- Series:
- -
- Package/Case:
- 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
- Packaging:
- Strip
- Product Status:
- Obsolete
- RF Type:
- WiMax
- Topology:
- Reflective
- Circuit:
- SPDT
- Frequency Range:
- 0Hz ~ 3GHz
- Isolation:
- 20dB
- Insertion Loss:
- 1.3dB
- Test Frequency:
- 3GHz
- P1dB:
- 36dBm
- IIP3:
- 56dBm
- Features:
- -
- Impedance:
- 50Ohm
- Voltage - Supply:
- 3V ~ 8V
- Operating Temperature:
- -40°C ~ 85°C
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 8-MSOP
HMC174MS8 FAQ
1.How can I place an order for HMC174MS8 through Aetrix?
Please submit a Request for Quotation (RFQ) for HMC174MS8 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for HMC174MS8 reliable?
The price and inventory of HMC174MS8 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for HMC174MS8 is usually 5 days.
3.What payment methods are accepted for HMC174MS8?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for HMC174MS8 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for HMC174MS8?
HMC174MS8 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your HMC174MS8 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for HMC174MS8?
For technical support, including HMC174MS8 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your HMC174MS8 requirements.
6.How does Aetrix verify that HMC174MS8 is sourced from the original manufacturer or authorized distributors?
All HMC174MS8 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that HMC174MS8 meets industry standards.
7.What is the process for return or replacement of HMC174MS8?
All HMC174MS8 units undergo pre-shipment inspection (PSI). If there is an issue with HMC174MS8, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The HMC174MS8 part is unused and in its original packaging.
Return procedure for HMC174MS8:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
HMC174MS8 Tags

-
BGS13SN8E6327XTSA1
Infineon Technologies

-
BGS12WN6E6327XTSA1
Infineon Technologies

-
BGS12P2L6E6327XTSA1
Infineon Technologies

-
BGS12PN10E6327XTSA1
Infineon Technologies

-
NJG1801K75-TE1
Nisshinbo Micro Devices Inc.

-
BGS14PN10E6327XTSA1
Infineon Technologies

-
SKY13348-374LF
Skyworks Solutions Inc.

-
4259-63
pSemi

-
PE42421SCAA-Z
pSemi

-
AS179-92LF
Skyworks Solutions Inc.

-
SKY13351-378LF
Skyworks Solutions Inc.

-
AS215-92LF
Skyworks Solutions Inc.
Tech Hub
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…

