Analog Devices Inc. HMC174MS8ETR
- Part No.:
- HMC174MS8ETR
- Manufacturer:
- Analog Devices Inc.
- Category:
- RF Switches
- Package:
- 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
- Datasheet:
-
HMC174MS8ETR.pdf
- Description:
- IC RF SWITCH SPDT 3GHZ 8MSOP
- Quantity:
- Payment:

- Shipping:

Inventory:1,179
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
HMC174MS8ETR from Analog Devices (formerly Hittite Microwave) is a GaAs MMIC SPDT transmit/receive switch for RF front-end signal routing in DC–3 GHz systems. It delivers 0.5 dB typical insertion loss at 2 GHz, +60 dBm input IP3 at 8 V bias, and supports positive CMOS/TTL-compatible control (0/+8 V). Its primary role is high-linearity T/R path selection in cellular/3G/WiMAX transceivers with LNA protection.
For engineers reviewing the HMC174MS8ETR datasheet, HMC174MS8ETR pinout, HMC174MS8ETR application, or HMC174MS8ETR equivalent, key selection criteria include its 0.5 dB insertion loss at 2 GHz, +60 dBm IIP3 at 8 V, MSOP-8 package footprint, reflective OFF-state ports, and single-supply operation from 3–10 Vdc with <500 µA quiescent current.
Technical Context
The HMC174MS8ETR implements a monolithic GaAs MMIC architecture with integrated bias control circuitry enabling single positive supply operation (3–10 Vdc) and logic-level compatible control inputs (A/B). Its RF path uses reflective SPDT topology: RFC connects to either RF1 or RF2 depending on control state, while unselected port presents a reflective short.
Switching is governed by a truth table where A=0 V/B=Vdd selects RF1, A=Vdd/B=0 V selects RF2, and both low disables both paths. RF ports are DC-coupled and require external blocking capacitors; all ground pins (6, 7) and exposed pad (pin 3, 5, 8 reference) must connect directly to PCB RF ground for optimal isolation and return loss performance.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Frequency Range | DC to 3 GHz - supports full-band operation from baseband through WiMAX and 3G uplink/downlink bands. |
| Insertion Loss (2 GHz) | 0.5 dB typical - enables minimal signal attenuation in active T/R paths, preserving SNR in sensitive receiver chains. |
| Input IP3 (0.5–3 GHz) | +60 dBm at 8 V - ensures high linearity under strong interferer conditions, critical for LNA protection and repeater applications. |
| Isolation (2 GHz) | 26 dB typical - suppresses leakage between transmit and receive paths, preventing desensitization of LNA during TX burst. |
| Return Loss (2 GHz) | 20 dB typical - indicates good 50 Ω match at RF ports, reducing reflections that degrade system VSWR and group delay. |
| Switching Speed | 10 ns rise/fall, 24 ns ON/OFF - supports fast TDD frame switching in LTE/WiMAX without timing margin violation. |
| Supply Voltage Range | 3–10 Vdc - allows flexible biasing: 3 V for low-power portable use, 8 V for maximum P1dB (36 dBm) and IP3 performance. |
Pinout & Package
Package: MSOP-8 (3.0 × 3.0 × 0.85 mm, 14.8 mm² footprint), RoHS-compliant matte tin finish, MSL1 rated (260 °C peak reflow), low-stress molded plastic body with copper alloy leadframe. All ground leads (pins 6, 7) and RF port terminals (pins 3, 5, 8) require direct connection to PCB RF ground plane.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 (A) | Control Input A | Logic-select line: 0 V or Vdd determines RF path; tolerant of ±0.2 V offset; draws ≤100 µA. |
| 2 (B) | Control Input B | Complementary logic-select line; paired with A per truth table to define RF1/RF2 state or disable both. |
| 3 (RFC) | Common RF Port | DC-coupled 50 Ω input/output; requires external blocking capacitor; connects to antenna or transceiver common node. |
| 4 (Vdd) | Positive Supply | Bias rail (3–10 Vdc); supplies internal GaAs FETs and level-shifting circuitry; bypass with 100 pF + 10,000 pF. |
| 5 (RF1) | RF Path 1 Terminal | DC-coupled 50 Ω port; reflective short when OFF; used for TX path or diversity RX in TDD systems. |
| 6, 7 (GND) | Ground Terminals | RF/DC ground reference; must be soldered to solid ground plane; critical for isolation and thermal dissipation. |
| 8 (RF2) | RF Path 2 Terminal | DC-coupled 50 Ω port; reflective short when OFF; typically assigned to LNA input or secondary RX chain. |
Key Features
| Feature | Design Value |
|---|---|
| Reflective SPDT Architecture | Unselected RF port presents a reflective short - eliminates need for external termination resistors and saves board space in compact front-ends. |
| Single-Supply Positive Control | Operates from 3–10 Vdc with 0/+Vdd logic - simplifies power domain design and eliminates negative supply or level shifters in CMOS/TTL-driven systems. |
| High Linearity at Elevated Bias | +60 dBm IIP3 and 36 dBm P1dB at 8 V - enables robust operation in high-power repeater and infrastructure base station T/R modules. |
| Low Quiescent Current | <500 µA at 5 V - supports battery-powered portable wireless devices without compromising RF performance. |
| DC-Coupled RF Ports | All RF pins (RFC, RF1, RF2) are DC-coupled - allows integration with DC-biased LNAs or PA drivers without AC coupling constraints. |
Applications
| Cellular Base Station Transceivers | LNA Protection Circuits |
|---|---|
Use Scenario: TDD-based 3G/LTE small cell radio unit requiring fast, low-loss switching between PA output and LNA input on shared antenna port. IC Role / Device Role / Timing Role: SPDT T/R switch routing transmit signal to antenna and receive signal to LNA, synchronized to TDD frame timing. Use Value: 0.5 dB insertion loss preserves PA efficiency and LNA noise figure; +60 dBm IIP3 prevents intermodulation distortion from strong out-of-band blockers. | Use Scenario: Front-end protection for ultra-low-noise LNA in handheld 3G/WiMAX client devices exposed to accidental TX power injection. IC Role / Device Role / Timing Role: High-isolation switch placed between antenna and LNA input, activated only during RX mode to block TX leakage. Use Value: 26 dB isolation at 2 GHz prevents LNA saturation; reflective OFF-state avoids 3 dB loss from terminated switch architectures. |
| WiMAX Customer Premises Equipment | Automotive Telematics Antenna Sharing |
Use Scenario: Dual-band (2.3/3.5 GHz) WiMAX CPE using single antenna for both uplink and downlink with dynamic TDD scheduling. IC Role / Device Role / Timing Role: Band-agnostic RF path selector enabling shared antenna architecture across licensed WiMAX frequency bands. Use Value: DC–3 GHz bandwidth covers both 2.3 GHz and 3.5 GHz bands; 24 ns switching time meets WiMAX frame boundary timing requirements. | Use Scenario: Integrated telematics module combining GPS, cellular (LTE), and DSRC/WAVE in automotive dashboard, sharing single roof-mounted antenna. IC Role / Device Role / Timing Role: Multi-protocol antenna switch managing concurrent or time-sliced access to shared RF front-end resources. Use Value: 3 V–10 V supply range supports automotive 5 V and 12 V domains via regulator; -40°C to +85°C rating meets AEC-Q200 ambient requirements. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar SPDT T/R switch applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| HMC547LP3E | Wider bandwidth (DC–6 GHz), higher P1dB (39 dBm), larger 3×3 mm QFN-16 package, requires dual supply (Vdd/Vgg). | Targeted at microwave backhaul and test equipment needing >3 GHz coverage and higher power handling. | Select HMC547LP3E only if operation beyond 3 GHz or >36 dBm P1dB is required; layout and biasing changes needed. |
| Qorvo QM11035 | Integrated driver, 0.35 dB IL at 2.6 GHz, 30 dB isolation, 1.8–5 V control, 2×2 mm DFN-6 package, no RFC/RF1/RF2 reflective design. | Optimized for smartphone front-end modules with tight size constraints and integrated logic interface. | Choose QM11035 for mobile handset designs prioritizing miniaturization and simplified control; lacks reflective OFF-state and high-voltage linearity. |
Compared with HMC547LP3E and QM11035, the HMC174MS8ETR offers the best balance of low insertion loss (0.5 dB), high IIP3 (+60 dBm), and MSOP-8 compatibility for cost-sensitive infrastructure and portable wireless designs operating strictly within DC–3 GHz.
Availability
HMC174MS8ETR is available at Aetrix Electronics and suitable for cellular/3G infrastructure, WiMAX customer premises equipment, and automotive telematics applications requiring stable component supply, extended temperature support (-40°C to +85°C), and RoHS-compliant packaging.
Supply support for HMC174MS8ETR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Analog Devices acquired Hittite Microwave in 2014 and integrates its high-frequency RF/Microwave portfolio into precision analog and RF solutions for communications, defense, and instrumentation.
The HMC174MS8ETR belongs to Hittite's GaAs MMIC SPDT switch product line, designed specifically for high-linearity, low-loss T/R path selection in DC–3 GHz wireless infrastructure and portable transceivers.
FAQ
What is the maximum RF input power the HMC174MS8ETR can handle before compression?
The HMC174MS8ETR delivers 36 dBm input P1dB across 0.5–3.0 GHz when biased at 8 Vdc. At 5 Vdc, P1dB drops to 32 dBm. This makes the HMC174MS8ETR suitable for medium-power repeater and base station applications where maintaining linear operation under high signal levels is essential. The HMC174MS8ETR's P1dB is voltage-scalable and specified with 0/8 V control states.
Does the HMC174MS8ETR require external blocking capacitors on its RF ports?
Yes, the HMC174MS8ETR requires external DC-blocking capacitors on RFC, RF1, and RF2 because all three RF ports are DC-coupled. Capacitor value determines the low-frequency cutoff - for example, a 100 pF capacitor sets flow ≈ 16 MHz with 50 Ω impedance. The HMC174MS8ETR evaluation board uses 100 pF (0402) caps per RF port, confirming this design requirement.
What is the meaning of "reflective short" for the OFF-state RF ports of the HMC174MS8ETR?
A "reflective short" means that when an RF port (e.g., RF1) is disabled, it presents a near-short-circuit impedance to RF signals instead of a 50 Ω termination. This avoids 3 dB insertion loss inherent in absorptive switches and eliminates the need for external 50 Ω resistors. The HMC174MS8ETR leverages this architecture to maximize power efficiency in T/R applications where isolation is managed by system-level filtering rather than on-die termination.
Can the HMC174MS8ETR operate with 3.3 V logic control signals?
Yes - the HMC174MS8ETR supports control voltages from 0 V to Vdd, and Vdd can be set as low as 3 Vdc. When Vdd = 3.3 V, applying 0 V to pin A and 3.3 V to pin B selects RF1, satisfying standard 3.3 V CMOS logic thresholds. The HMC174MS8ETR truth table explicitly validates operation at 3 V, with control currents below 30 µA per input, ensuring compatibility with low-voltage microcontrollers.
Is the HMC174MS8ETR pin-compatible with the non-RoHS HMC174MS8 variant?
Yes - the HMC174MS8ETR and HMC174MS8 share identical MSOP-8 pinout, electrical specifications, and mechanical dimensions. The only differences are RoHS compliance (matte Sn vs. Sn/Pb finish), MSL1 reflow profile (260 °C vs. 235 °C), and package marking (H174 + 4-digit lot vs. H174 only). The HMC174MS8ETR replaces HMC174MS8 in new designs requiring lead-free assembly without layout or schematic changes.
HMC174MS8ETR Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Analog Devices Inc.
- Series:
- -
- Package/Case:
- 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- RF Type:
- WiMax
- Topology:
- Reflective
- Circuit:
- SPDT
- Frequency Range:
- 0Hz ~ 3GHz
- Isolation:
- 20dB
- Insertion Loss:
- 1.3dB
- Test Frequency:
- 3GHz
- P1dB:
- 36dBm
- IIP3:
- 56dBm
- Features:
- -
- Impedance:
- 50Ohm
- Voltage - Supply:
- 3V ~ 8V
- Operating Temperature:
- -40°C ~ 85°C
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 8-MSOP
HMC174MS8ETR FAQ
1.How can I place an order for HMC174MS8ETR through Aetrix?
Please submit a Request for Quotation (RFQ) for HMC174MS8ETR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for HMC174MS8ETR reliable?
The price and inventory of HMC174MS8ETR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for HMC174MS8ETR is usually 5 days.
3.What payment methods are accepted for HMC174MS8ETR?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for HMC174MS8ETR transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for HMC174MS8ETR?
HMC174MS8ETR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your HMC174MS8ETR order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for HMC174MS8ETR?
For technical support, including HMC174MS8ETR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your HMC174MS8ETR requirements.
6.How does Aetrix verify that HMC174MS8ETR is sourced from the original manufacturer or authorized distributors?
All HMC174MS8ETR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that HMC174MS8ETR meets industry standards.
7.What is the process for return or replacement of HMC174MS8ETR?
All HMC174MS8ETR units undergo pre-shipment inspection (PSI). If there is an issue with HMC174MS8ETR, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The HMC174MS8ETR part is unused and in its original packaging.
Return procedure for HMC174MS8ETR:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
HMC174MS8ETR Tags

-
BGS13SN8E6327XTSA1
Infineon Technologies

-
BGS12WN6E6327XTSA1
Infineon Technologies

-
BGS12P2L6E6327XTSA1
Infineon Technologies

-
BGS12PN10E6327XTSA1
Infineon Technologies

-
NJG1801K75-TE1
Nisshinbo Micro Devices Inc.

-
BGS14PN10E6327XTSA1
Infineon Technologies

-
SKY13348-374LF
Skyworks Solutions Inc.

-
4259-63
pSemi

-
PE42421SCAA-Z
pSemi

-
AS179-92LF
Skyworks Solutions Inc.

-
SKY13351-378LF
Skyworks Solutions Inc.

-
AS215-92LF
Skyworks Solutions Inc.
Tech Hub
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…

