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Analog Devices Inc. HMC175MS8E

Part No.:
HMC175MS8E
Manufacturer:
Analog Devices Inc.
Category:
RF Mixers
Package:
8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Datasheet:
AetrixHMC175MS8E.pdf
Description:
IC MIXER DBL-BAL 3.4GHZ 8-MSOP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:3,585

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Product details

Overview

HMC175MS8E from Analog Devices (formerly Hittite Microwave) is a GaAs MMIC double-balanced mixer in MSOP-8 package, operating from 1.7–4.5 GHz RF/LO and DC–1.0 GHz IF. It delivers 8 dB typical conversion loss, +18 dBm input IP3, and 30–32 dB LO-to-RF/IF isolation. It serves as upconverter/downconverter or biphase modulator/demodulator in compact wireless transceivers.

For engineers reviewing the HMC175MS8E datasheet, HMC175MS8E pinout, HMC175MS8E application, or HMC175MS8E equivalent, key selection criteria include broadband RF/LO frequency coverage, ultra-small MSOP-8 footprint, high linearity (+18 dBm IIP3), thermal stability across –40°C to +85°C, and RoHS-compliant matte tin lead finish.

Technical Context

The HMC175MS8E is a passive, doubly balanced diode-ring mixer implemented in GaAs MMIC technology. Its architecture provides inherent suppression of LO feedthrough and even-order harmonics, enabling clean IF output with minimal filtering. It requires +13 dBm LO drive for optimal performance and operates without DC bias.

Designed for surface-mount integration, the device uses all-grounded package leads (except RF, LO, IF) and mandates direct soldering of ground leads and exposed paddle to PCB RF ground. Its 0.118″ × 0.190″ × 0.040″ MSOP-8 footprint supports miniaturized RF front-ends where board space and intermodulation rejection are critical.

Key Specifications

Parameter Value and Actual Design Meaning
RF/LO Frequency Range 1.7–4.5 GHz - Supports PCS, ISM, and LTE bands in single device without tuning.
IF Bandwidth DC–1.0 GHz - Enables baseband, low-IF, and zero-IF architectures with wide demodulation capability.
Conversion Loss 8 dB typ. - Low signal attenuation preserves SNR in receiver chains and reduces post-mixer gain requirements.
Input IP3 +18 dBm typ. - High linearity resists third-order intermodulation in dense-signal environments like base stations.
LO-to-RF Isolation 30 dB typ. - Minimizes LO leakage into antenna path, easing filter design and improving transmit spectral purity.
LO-to-IF Isolation 32 dB typ. - Reduces LO contamination at IF output, lowering noise floor in sensitive demodulators.
Operating Temp. –40°C to +85°C - Qualified for industrial and outdoor wireless infrastructure deployment.
ESD Rating HBM Class 1A - Requires strict ESD handling during assembly but enables robust field operation.

Pinout & Package

Package: RoHS-compliant MSOP-8 (0.118″ × 0.190″ × 0.040″), low-stress molded plastic with 100% matte Sn lead finish, MSL1 rated (260°C peak reflow).

Pin/Terminal Circuit Role Design Meaning
1 RF Input Differential RF port; matched to 50 Ω; requires external balun or differential drive for optimal balance.
2 Ground Exposed paddle connection point; must be soldered directly to PCB RF ground plane.
3 LO Input Differential LO port; requires +13 dBm drive level for specified conversion loss and isolation.
4 Ground Ground lead; must be soldered to PCB ground to maintain RF return path integrity.
5 IF Output Differential IF output; DC–1.0 GHz bandwidth supports direct baseband sampling or low-IF processing.
6 Ground Ground lead; part of symmetric grounding scheme essential for common-mode rejection.
7 Ground Ground lead; ensures low-inductance return path for RF/LO/IF currents.
8 Ground Ground lead; completes 5-ground-pin configuration required for >30 dB isolation performance.

Key Features

Feature Design Value
Ultra-small MSOP-8 footprint 0.118″ × 0.190″ - Enables integration into PCMCIA cards and mini-base station modules where board area is constrained.
Passive double-balanced topology No DC bias required - Eliminates power supply routing, simplifies layout, and improves reliability in unpowered standby modes.
High LO/RF and LO/IF isolation ≥30 dB - Reduces need for external LO filtering and eases RF front-end filtering complexity in full-duplex systems.
Thermal stability Specified over –40°C to +85°C - Ensures consistent conversion loss and IP3 across environmental extremes without recalibration.
RoHS-compliant matte Sn finish MSL1, 260°C peak reflow - Compatible with lead-free manufacturing while maintaining solder joint reliability.

Applications

Mini-Base Stations Portable Wireless Terminals

Use Scenario: Compact 2G/3G/LTE small-cell radio units requiring low-profile RF front-ends with high dynamic range.

IC Role / Device Role / Timing Role: Downconverter in receive path and upconverter in transmit path, handling 1.7–4.5 GHz band aggregation.

Use Value: 8 dB conversion loss and +18 dBm IIP3 enable high sensitivity and strong adjacent-channel interference rejection in spectrum-congested deployments.

Use Scenario: Battery-powered handheld radios and portable test equipment needing low-power, small-footprint mixing.

IC Role / Device Role / Timing Role: Biphase modulator/demodulator in QPSK/QAM transceivers operating across PCS and ISM bands.

Use Value: Passive operation eliminates DC power draw; MSOP-8 size allows placement near antenna switches without sacrificing RF performance.

PCMCIA Wireless Cards ISM-Band IoT Gateways

Use Scenario: Legacy PCMCIA-format 802.11a/b/g client adapters requiring minimal board real estate and high integration density.

IC Role / Device Role / Timing Role: Frequency translator between baseband ASIC and 2.4/5.2 GHz RF frontend.

Use Value: DC–1.0 GHz IF bandwidth supports direct-conversion architectures; 32 dB LO/IF isolation prevents LO leakage into baseband ADCs.

Use Scenario: Industrial IoT gateways operating in 2.4 GHz ISM band with multi-node coexistence and long-range link budgets.

IC Role / Device Role / Timing Role: Receiver mixer in sub-GHz or 2.4 GHz transceiver IC reference designs.

Use Value: +18 dBm IIP3 mitigates intermodulation from nearby Bluetooth/Wi-Fi emitters; –40°C to +85°C rating ensures outdoor enclosure operation.

Equivalent & Alternatives

The following parts are listed as comparable options for similar double-balanced mixer applications.

Alternative Part Technical Difference Application Difference Selection Advice
HMC175MS8 Sn/Pb lead finish, MSL1 (235°C peak reflow), identical electrical specs and pinout. Legacy leaded assembly lines; not suitable for RoHS-compliant production. Select HMC175MS8E for new designs requiring RoHS compliance and lead-free reflow.
ADL5801ACPZ-R7 Active mixer with 5.5–10.5 GHz RF range, +22 dBm IIP3, requires +5 V bias and consumes 120 mA. Broadband test equipment and microwave links where higher frequency and active gain are needed. Choose ADL5801ACPZ-R7 only when extending beyond 4.5 GHz or requiring conversion gain instead of passive loss.

Compared with HMC175MS8 (leaded variant) and ADL5801ACPZ-R7 (active broadband mixer), the HMC175MS8E offers the optimal balance of ultra-compact size, passive simplicity, and proven 1.7–4.5 GHz performance for cost-sensitive, space-constrained wireless infrastructure-without DC power or thermal management overhead.

Availability

HMC175MS8E is available at Aetrix Electronics and suitable for mini-base stations, portable wireless terminals, and PCMCIA wireless cards requiring stable component supply, RoHS compliance, and guaranteed long-term availability for industrial deployments.

Supply support for HMC175MS8E includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Analog Devices, Inc. is a global leader in high-performance analog, mixed-signal, and RF ICs, serving communications, industrial, automotive, and aerospace markets since 1965.

The HMC175MS8E belongs to Analog Devices' legacy Hittite Microwave RF mixer product line, engineered specifically for miniaturized, high-isolation, broadband wireless infrastructure where passive performance and SMT scalability are critical.

FAQ

What is the recommended LO drive level for optimal performance of the HMC175MS8E?

The HMC175MS8E is characterized and optimized for +13 dBm LO drive. At this level, it achieves 8 dB typical conversion loss, 30 dB LO-to-RF isolation, and +18 dBm input IP3. Deviating below +11 dBm increases conversion loss; exceeding +15 dBm yields diminishing returns and risks compression. The HMC175MS8E does not require DC bias, making LO drive level the primary operational control parameter.

Does the HMC175MS8E require external baluns for RF, LO, or IF ports?

Yes-the HMC175MS8E has fully differential RF, LO, and IF ports. To interface with single-ended 50 Ω systems, external baluns are required on all three ports. The evaluation board (PCB 101650) uses SMA connectors with integrated baluns. Without proper balancing, common-mode rejection degrades, reducing isolation and increasing spurious outputs. The HMC175MS8E's performance specifications assume ideal differential drive and termination.

What is the absolute maximum RF/IF input power rating for the HMC175MS8E?

The absolute maximum RF/IF input power for the HMC175MS8E is +13 dBm. Exceeding this level risks permanent damage to the GaAs diode ring, especially under mismatched conditions. This limit applies regardless of signal modulation or duty cycle. For reliable operation, design RF/IF input levels ≤ +10 dBm, particularly in high-reliability applications such as mini-base stations where the HMC175MS8E is commonly deployed.

How does the HMC175MS8E differ from the HMC175MS8 in terms of manufacturability?

The HMC175MS8E uses 100% matte Sn lead finish and is rated for 260°C peak reflow (MSL1), making it compatible with modern lead-free assembly processes. In contrast, the HMC175MS8 uses Sn/Pb solder finish and is rated for 235°C peak reflow. Both share identical die, pinout, and electrical specs-but only the HMC175MS8E meets RoHS Directive 2011/65/EU and IPC-J-STD-020D.2 requirements for new production.

Can the HMC175MS8E be used as a phase modulator or demodulator?

Yes-the HMC175MS8E's double-balanced architecture supports biphase (0°/180°) modulation and demodulation when the LO port is driven with a digital square wave and the RF or IF port serves as the data input. Its high LO-to-RF/IF isolation (>30 dB) and broadband response (1.7–4.5 GHz) make it suitable for QPSK and OQPSK implementations in portable wireless terminals where the HMC175MS8E replaces discrete transformer-based modulators.

HMC175MS8E Specifications

Product attributes
Attribute value
Manufacturer:
Analog Devices Inc.
Series:
-
Package/Case:
8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Packaging:
Strip
Product Status:
Obsolete
RF Type:
General Purpose
Frequency:
1.7GHz ~ 4.5GHz
Number of Mixers:
1
Gain:
-
Noise Figure:
8dB
Secondary Attributes:
Up/Down Converter
Current - Supply:
-
Voltage - Supply:
-
Mounting Type:
Surface Mount
Supplier Device Package:
8-MSOP

HMC175MS8E FAQ

1.How can I place an order for HMC175MS8E through Aetrix?

Please submit a Request for Quotation (RFQ) for HMC175MS8E on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for HMC175MS8E reliable?

The price and inventory of HMC175MS8E are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for HMC175MS8E is usually 5 days.

3.What payment methods are accepted for HMC175MS8E?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for HMC175MS8E transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for HMC175MS8E?

HMC175MS8E orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your HMC175MS8E order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for HMC175MS8E?

For technical support, including HMC175MS8E datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your HMC175MS8E requirements.

6.How does Aetrix verify that HMC175MS8E is sourced from the original manufacturer or authorized distributors?

All HMC175MS8E products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that HMC175MS8E meets industry standards.

7.What is the process for return or replacement of HMC175MS8E?

All HMC175MS8E units undergo pre-shipment inspection (PSI). If there is an issue with HMC175MS8E, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The HMC175MS8E part is unused and in its original packaging.

Return procedure for HMC175MS8E:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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