Analog Devices Inc. HMC194MS8ETR
- Part No.:
- HMC194MS8ETR
- Manufacturer:
- Analog Devices Inc.
- Category:
- RF Switches
- Package:
- 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
- Datasheet:
-
HMC194MS8ETR.pdf
- Description:
- IC RF SWITCH SPDT 3GHZ 8MSOP
- Quantity:
- Payment:

- Shipping:

Inventory:1,978
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
HMC194MS8ETR from Analog Devices (formerly Hittite Microwave) is a GaAs MMIC SPDT RF switch operating from DC to 3 GHz, delivering 0.9 dB typical insertion loss at 3 GHz and 50 dB isolation between RF1/RF2 paths under +5 V control, ideal for antenna switching in portable wireless transceivers.
For engineers reviewing the HMC194MS8ETR datasheet, HMC194MS8ETR pinout, HMC194MS8ETR application, or HMC194MS8ETR equivalent, key selection criteria include its positive-voltage CMOS/TTL-compatible control (0/+3V to 0/+7V), reflective-open OFF-state architecture, ultra-small MSOP-8 package, and verified performance across cellular, MMDS, and WLAN frequency bands.
Technical Context
The HMC194MS8ETR implements a monolithic GaAs MMIC architecture with integrated control logic enabling single-supply positive-voltage operation. Its reflective SPDT topology ensures RF1 and RF2 present open-circuit impedance when de-asserted, eliminating need for external termination resistors in many configurations.
Designed for DC–3 GHz broadband operation, it maintains consistent RF performance across control voltages (0/+3V to 0/+7V), with tON/tOFF of 24 ns and tRISE/tFALL of 10 ns. On-chip biasing minimizes external component count while supporting hot-switch capability up to +24 dBm.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Frequency Range | DC to 3 GHz - supports full-band operation from baseband through PCS, UMTS, and Wi-Fi 2.4 GHz without re-tuning. |
| Insertion Loss (Typ.) | 0.9 dB at 3 GHz - enables low-loss signal routing critical for battery-powered portable RF front-ends. |
| Isolation (RF1/RF2) | 50 dB at DC–1 GHz - prevents crosstalk between transmit/receive paths in TDD systems and diversity antennas. |
| Control Voltage Range | 0/+3 V to 0/+7 V - directly interfaces with HC, HCT, and 3.3–5 V CMOS logic without level-shifting circuitry. |
| Switching Speed | tON/tOFF = 24 ns - supports fast mode switching in time-division duplex (TDD) and beamforming applications. |
| Input P1dB | +28 dBm at 0.5–3 GHz - handles medium-power transmit signals without compression in small-cell and client-side radios. |
| ESD Rating | HBM Class 1B (≥2 kV) - requires standard ESD handling but permits integration into automated SMT lines with proper precautions. |
Pinout & Package
Package: 8-lead MSOP (Mini Small Outline Package), RoHS-compliant, matte tin finish, MSL1, body dimensions 3.0 × 3.0 × 1.1 mm.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 (GND) | Ground | RF and substrate ground reference; must be soldered directly to PCB ground plane per RF layout best practices. |
| 2 (RF1) | RF Switch Port 1 | Reflective-open when OFF; connects to antenna or filter path in SPDT configuration. |
| 3 (A) | Control Input A | Positive logic input; high voltage selects RF→RF1 path; tolerates ±0.2 Vdc variation. |
| 4 (GND) | Ground | Dedicated ground pin adjacent to control inputs to minimize coupling and ensure clean switching edges. |
| 5 (GND) | Ground | RF ground return for RFC port; critical for maintaining 50 Ω impedance continuity. |
| 6 (RFC) | Common RF Port | Input/output shared node; requires DC blocking capacitor; impedance-matched to 50 Ω system. |
| 7 (B) | Control Input B | Positive logic input; high voltage selects RF→RF2 path; complementary to Pin 3 for differential control. |
| 8 (RF2) | RF Switch Port 2 | Reflective-open when OFF; routes to secondary antenna, diversity branch, or receive chain. |
Key Features
| Feature | Design Value |
|---|---|
| Ultra-small MSOP-8 footprint | 3.0 × 3.0 mm area saves >40% board space vs. SOIC-8 switches-critical for compact mobile and IoT RF modules. |
| Reflective-open OFF-state | Eliminates need for external 50 Ω terminations on RF1/RF2, reducing BOM count and parasitic losses in high-frequency layouts. |
| CMOS/TTL-compatible control | Operates with 0/+3 V to 0/+7 V logic levels-directly driven by microcontroller GPIOs or FPGA I/O banks without buffer ICs. |
| High linearity (IP3 = 53 dBm) | Preserves signal integrity in multi-tone environments such as LTE carrier aggregation and Wi-Fi OFDM channels. |
| Hot-switch capable (+24 dBm) | Enables dynamic antenna reconfiguration during active transmission-essential for adaptive MIMO and beam steering. |
Applications
| Cellular Base Station Remote Radio Head | Portable Wi-Fi 6 Client Device |
|---|---|
|
Use Scenario: Antenna diversity switching in 4G/5G small-cell RRH units with dual-polarized antennas. IC Role / Device Role / Timing Role: SPDT RF switch routing main/diversity paths under baseband processor control. Use Value: 50 dB isolation prevents desensitization during simultaneous Rx/Tx monitoring; 0.9 dB loss preserves link budget in low-SNR outdoor deployments. |
Use Scenario: Dynamic antenna selection between internal PCB trace and external u.FL connector in laptop Wi-Fi 6 adapters. IC Role / Device Role / Timing Role: High-speed RF path selector synchronized with MAC-layer channel switching. Use Value: 24 ns switching speed enables sub-10 μs antenna reconfiguration-meeting IEEE 802.11ax fast channel switching requirements. |
| MMDS Subscriber Terminal | ISM Band Industrial Sensor Transceiver |
|
Use Scenario: Transmit/receive path isolation in 2.5–2.7 GHz fixed-wireless MMDS CPE units. IC Role / Device Role / Timing Role: Reflective SPDT switch isolating PA output from LNA input during TDD burst transitions. Use Value: Reflective-open OFF-state eliminates 50 Ω termination loss, improving overall system NF by 0.3 dB in noise-critical receive chains. |
Use Scenario: Frequency-agile sensor node transmitting at 915 MHz and receiving at 2.4 GHz using shared antenna. IC Role / Device Role / Timing Role: Dual-band RF switch enabling single-antenna full-duplex operation via time-slicing. Use Value: DC–3 GHz bandwidth covers both ISM bands; +28 dBm P1dB supports long-range LoRaWAN-style transmissions without external amplification. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar SPDT RF switch applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| Qorvo QM11036 | Higher frequency range (DC–6 GHz); 0.7 dB IL @ 3 GHz; requires negative voltage for OFF-state. | Better suited for 5G FR1 and UWB applications; incompatible with pure-positive-control systems. | Select QM11036 only if 6 GHz coverage and lower loss are required-and negative bias generation is acceptable. |
| Skyworks SKY13370-374LF | Lower isolation (42 dB @ 2.4 GHz); 0.6 dB IL @ 2.4 GHz; 6-pin SOT-6 package; no RFC pin separation. | Optimized for cost-sensitive 2.4 GHz Wi-Fi clients; lacks DC-coupled capability and reflective-open architecture. | Choose SKY13370-374LF for high-volume 2.4 GHz-only designs where board space and BOM cost outweigh isolation needs. |
Compared with QM11036 and SKY13370-374LF, the HMC194MS8ETR uniquely balances DC–3 GHz bandwidth, 50 dB isolation, reflective-open design, and single-supply positive control-making it the preferred choice for portable, multi-band, and TDD-constrained RF systems requiring minimal external components.
Availability
HMC194MS8ETR is available at Aetrix Electronics and suitable for cellular base stations, portable wireless terminals, and MMDS subscriber equipment requiring stable component supply and guaranteed long-term manufacturability.
Supply support for HMC194MS8ETR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Analog Devices acquired Hittite Microwave in 2014, integrating its high-performance RF/Microwave portfolio into ADI's broader signal chain solutions.
The HMC194MS8ETR belongs to Hittite's legacy GaAs MMIC SPDT switch family, engineered specifically for compact, high-isolation RF front-end switching in portable and infrastructure wireless systems.
FAQ
What is the maximum RF input power the HMC194MS8ETR can handle without damage?
The HMC194MS8ETR has an absolute maximum RF input power rating of +27 dBm under normal operating conditions. At 0/+5 V control, its hot-switch power level is rated at +24 dBm-meaning it can safely switch RF signals up to that level while actively toggling states. Exceeding these limits risks permanent degradation of the GaAs FETs. Always observe the specified control voltage range (−0.2 to +7.5 Vdc) and thermal derating above 85 °C when designing for sustained high-power operation with the HMC194MS8ETR.
Does the HMC194MS8ETR require external DC blocking capacitors, and why?
Yes, the HMC194MS8ETR requires external DC blocking capacitors at RFC, RF1, and RF2 ports. This is because the device uses a GaAs MMIC process with internally biased FETs that cannot tolerate DC voltage at RF ports. The capacitor value determines the lowest usable frequency-e.g., a 100 pF capacitor sets a −3 dB cutoff near 30 MHz. Omitting these capacitors may cause bias disruption, increased insertion loss, or device failure. The HMC194MS8ETR datasheet specifies this requirement explicitly in the Typical Application Circuit section.
Can the HMC194MS8ETR be used in a non-reflective (absorptive) configuration?
No-the HMC194MS8ETR is designed exclusively as a reflective SPDT switch: RF1 and RF2 present open-circuit impedance when OFF. It does not integrate internal 50 Ω terminations, nor does it support absorptive operation without external resistors. Adding external 50 Ω shunt resistors to RF1/RF2 would degrade isolation, increase insertion loss, and compromise linearity. For absorptive switching, consider alternatives like the HMC241QS16 or Qorvo QM11036 with integrated terminations-but note those require different control schemes and package footprints versus the HMC194MS8ETR.
What is the significance of the 'E' suffix in HMC194MS8ETR?
The 'E' in HMC194MS8ETR denotes the RoHS-compliant version: matte tin (100% Sn) lead finish, low-stress injection-molded plastic body, and peak reflow temperature rating of 260 °C. It replaces the legacy Sn/Pb version (HMC194MS8) and is fully compatible in form, fit, and function. The 'TR' suffix indicates tape-and-reel packaging for automated SMT assembly. All electrical specifications, pinout, and thermal characteristics remain identical between HMC194MS8 and HMC194MS8ETR-only material content and assembly compatibility differ.
How does control voltage affect linearity and power handling in the HMC194MS8ETR?
Higher control voltages improve linearity and power handling: at 0/+7 V, the HMC194MS8ETR achieves +24 dBm P1dB and 53 dBm IP3, versus +28 dBm P1dB and 49 dBm IP3 at 0/+5 V. This occurs because stronger gate overdrive reduces channel resistance and distortion. However, maximum control voltage is limited to +7.5 Vdc (absolute max). For most applications, 0/+5 V provides optimal balance of performance, compatibility, and margin-while 0/+7 V is reserved for high-dynamic-range scenarios where the HMC194MS8ETR's full linearity potential must be exploited.
HMC194MS8ETR Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Analog Devices Inc.
- Series:
- -
- Package/Case:
- 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- RF Type:
- General Purpose
- Topology:
- Reflective
- Circuit:
- SPDT
- Frequency Range:
- -
- Isolation:
- -
- Insertion Loss:
- -
- Test Frequency:
- -
- P1dB:
- 38dBm (typ) IP1dB
- IIP3:
- 53dBm (typ)
- Features:
- -
- Impedance:
- 50Ohm
- Voltage - Supply:
- -
- Operating Temperature:
- -40°C ~ 85°C
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 8-MSOP
HMC194MS8ETR FAQ
1.How can I place an order for HMC194MS8ETR through Aetrix?
Please submit a Request for Quotation (RFQ) for HMC194MS8ETR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for HMC194MS8ETR reliable?
The price and inventory of HMC194MS8ETR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for HMC194MS8ETR is usually 5 days.
3.What payment methods are accepted for HMC194MS8ETR?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for HMC194MS8ETR transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for HMC194MS8ETR?
HMC194MS8ETR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your HMC194MS8ETR order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for HMC194MS8ETR?
For technical support, including HMC194MS8ETR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your HMC194MS8ETR requirements.
6.How does Aetrix verify that HMC194MS8ETR is sourced from the original manufacturer or authorized distributors?
All HMC194MS8ETR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that HMC194MS8ETR meets industry standards.
7.What is the process for return or replacement of HMC194MS8ETR?
All HMC194MS8ETR units undergo pre-shipment inspection (PSI). If there is an issue with HMC194MS8ETR, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The HMC194MS8ETR part is unused and in its original packaging.
Return procedure for HMC194MS8ETR:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
HMC194MS8ETR Tags

-
BGS13SN8E6327XTSA1
Infineon Technologies

-
BGS12WN6E6327XTSA1
Infineon Technologies

-
BGS12P2L6E6327XTSA1
Infineon Technologies

-
BGS12PN10E6327XTSA1
Infineon Technologies

-
NJG1801K75-TE1
Nisshinbo Micro Devices Inc.

-
BGS14PN10E6327XTSA1
Infineon Technologies

-
SKY13348-374LF
Skyworks Solutions Inc.

-
4259-63
pSemi

-
PE42421SCAA-Z
pSemi

-
AS179-92LF
Skyworks Solutions Inc.

-
SKY13351-378LF
Skyworks Solutions Inc.

-
AS215-92LF
Skyworks Solutions Inc.
Tech Hub
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…

