Analog Devices Inc. HMC199AMS8
- Part No.:
- HMC199AMS8
- Manufacturer:
- Analog Devices Inc.
- Category:
- RF Switches
- Package:
- 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
- Datasheet:
-
HMC199AMS8.pdf
- Description:
- IC RF SWITCH SPDT 2.5GHZ 8MSOP
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
HMC199AMS8 from Analog Devices is a GaAs dual SPDT RF switch in MSOP-8 package, designed for bypass switching in DC–2.5 GHz signal paths. It integrates two independent SPDT switches and one through-line, delivers <0.6 dB insertion loss at 2.5 GHz, >22 dB isolation between RFC1/RFC2 and RF1/RF2, and supports +3 V/+5 V positive control logic for LNA or filter bypass and single-bit attenuator switching in cellular base stations.
For engineers reviewing the HMC199AMS8 datasheet, HMC199AMS8 pinout, HMC199AMS8 application, or HMC199AMS8 equivalent, key selection criteria include its dual SPDT topology with integrated through path, ultra-low DC control current (<1 µA), 25–30 dB port-to-port isolation, and compatibility with CMOS/TTL logic families without level-shifting.
Technical Context
The HMC199AMS8 implements two monolithic GaAs SPDT switches sharing a common RF through path (RFC1–RFC2), enabling simultaneous or independent routing of RF signals across four ports: RFC1, RFC2, RF1, RF2. Its on-chip positive-voltage control circuitry eliminates need for external bias networks and supports direct interface with HC/HCT logic families.
Switching is governed by complementary A/B control inputs with ±0.5 V tolerance; truth table confirms mutually exclusive ON/OFF states for RFC1↔RFC2 vs. RFC1↔RF1 & RFC2↔RF2 paths. Thermal resistance is 171 °C/W, and operation is specified from –40 °C to +85 °C with ESD rating Class 1A (HBM).
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Frequency Range | DC to 2.5 GHz - supports full-band operation from baseband to PCS/ISM bands without re-tuning. |
| Insertion Loss (DC–2.5 GHz) | 0.6 dB max - ensures minimal signal attenuation in active path, critical for receiver sensitivity preservation. |
| Isolation (RFC1–RFC2 / RF1 / RF2) | 17 dB min at 2.5 GHz - prevents crosstalk between switched paths during high-density RF layout. |
| Input IP3 | 40–55 dBm - enables linear operation with two-tone 13 dBm inputs, suitable for multi-carrier base station front-ends. |
| Switching Speed (tON/tOFF) | 40 ns - allows fast reconfiguration in TDD systems or dynamic filter/LNA selection loops. |
| Control Voltage | 0/+3 V or 0/+5 V - eliminates need for dedicated level shifters when interfacing with standard logic families. |
| Package | MSOP-8, 14.8 mm² footprint - enables compact RF module integration with standardized SMT assembly. |
Pinout & Package
Package: MSOP-8 (Moisture Sensitivity Level 1), low-stress injection-molded plastic body with Sn/Pb lead finish; outline conforms to JEDEC MO-187AA.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCTL_A | Control input A | Drives first SPDT switch; 0 V = RFC1→RFC2 path enabled, +3/+5 V = RFC1→RF1 enabled. |
| VCTL_B | Control input B | Drives second SPDT switch; 0 V = RFC2→RFC2 path enabled, +3/+5 V = RFC2→RF2 enabled. |
| RFC1 | Common RF port 1 | Primary RF input/output shared across both SPDT sections; requires DC blocking capacitor. |
| RFC2 | Common RF port 2 | Secondary common port; forms through-path with RFC1 when both controls are low. |
| RF1 | SPDT branch port 1 | Alternate output for RFC1 when VCTL_A = high; used for LNA/filter bypass path. |
| RF2 | SPDT branch port 2 | Alternate output for RFC2 when VCTL_B = high; enables independent signal routing per channel. |
| GND | Ground (pins 3 & 6) | RF and DC ground reference; both pins must be soldered to PCB RF ground plane per datasheet note. |
| NC | No connect (pin 7) | Internally unused; left unconnected per design - no routing or thermal tie required. |
Key Features
| Feature | Design Value |
|---|---|
| Dual SPDT with integrated through path | Enables three-state RF routing (through, bypass A, bypass B) using only two control lines and one IC. |
| Ultra-low control current | Typical IA/IB = ±0.1 µA at +3 V - reduces MCU GPIO loading and eliminates need for driver buffers. |
| DC–2.5 GHz broadband performance | Specified insertion loss, isolation, and return loss across full band - avoids narrowband tuning in multi-standard radios. |
| CMOS/TTL-compatible control | Operates directly with HC/HCT logic outputs at VDD = 5–7 V - removes level-shifter components and associated board area. |
| Class 1A ESD protection | Withstands ≥250 V HBM - improves manufacturing yield and field reliability in handling-sensitive RF production environments. |
Applications
| Cellular Base Station Front-End | ISM Band Transceiver Module |
|---|---|
Use Scenario: Dynamic LNA gain control and antenna diversity switching in macrocell BTS with multi-band support. IC Role / Device Role / Timing Role: Dual SPDT RF switch routing main and diversity receive paths while maintaining DC-coupled control timing. Use Value: Enables <0.6 dB insertion loss and >22 dB isolation across 700–2500 MHz, preserving SNR during fast TDD frame transitions. |
Use Scenario: Reconfigurable filter bank and power amplifier output switching in 2.4 GHz/5.8 GHz ISM transceivers. IC Role / Device Role / Timing Role: Bypass switch managing RF path selection between PA, LNA, and antenna matching networks. Use Value: Delivers 40–55 dBm IIP3 and 25–30 dB isolation, supporting concurrent multi-channel operation without intermodulation degradation. |
| PCS Handset Front-End | Single-Bit Attenuator Switching |
Use Scenario: Compact RF front-end in PCS-band handsets requiring low-loss antenna switching and TRX path isolation. IC Role / Device Role / Timing Role: Dual SPDT switch implementing Tx/Rx path separation and antenna diversity with minimal footprint. Use Value: MSOP-8 package (14.8 mm²) and <0.5 dB loss at 1.9 GHz reduce PCB area and maintain link budget in space-constrained designs. |
Use Scenario: Programmable step attenuator implementation using switched resistor networks in test equipment and instrumentation. IC Role / Device Role / Timing Role: High-isolation RF switch enabling precise 1-bit attenuation states via controlled path insertion. Use Value: 17–30 dB isolation across DC–2.5 GHz ensures accurate attenuation calibration without leakage-induced measurement error. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar dual SPDT RF switch applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| Qorvo QM11025 | Wider bandwidth (DC–6 GHz), higher P1dB (+32 dBm), but larger 16-pin QFN package and higher supply voltage (2.7–5.5 V). | Targeted at 5G FR1 and mmWave sub-6 GHz modules where extended frequency range and power handling are critical. | Select QM11025 when operating above 2.5 GHz or requiring >+28 dBm input power capability; HMC199AMS8 remains optimal for cost-sensitive DC–2.5 GHz base station bypass. |
| Skyworks SKY13370-374LF | Single SPDT (not dual), lower isolation (18 dB @ 2.5 GHz), smaller 6-pin SOT-6 package, and 0/+2.5 V control. | Designed for handset-level single-path switching where board space is more constrained than functional density. | Choose SKY13370-374LF for ultra-compact single-switch applications; HMC199AMS8 provides dual-path functionality and superior isolation in same MSOP-8 footprint. |
Compared with QM11025 and SKY13370-374LF, the HMC199AMS8 uniquely balances dual SPDT functionality, 2.5 GHz bandwidth, and MSOP-8 size-making it the only option delivering integrated through-path routing and <0.6 dB loss in this form factor for base station and ISM infrastructure.
Availability
HMC199AMS8 is available at Aetrix Electronics and suitable for cellular base stations, ISM band transceivers, and PCS handset front-ends requiring stable component supply, RoHS-compliant sourcing, and long-term industrial lifecycle support.
Supply support for HMC199AMS8 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Analog Devices, Inc. is a global leader in high-performance analog, mixed-signal, and RF ICs, serving communications, industrial, automotive, and aerospace markets with precision signal processing solutions.
The HMC199AMS8 belongs to the Hittite Microwave RF switch product line, acquired by Analog Devices in 2014, and was engineered specifically for broadband infrastructure applications demanding low-loss, high-isolation, and logic-compatible RF path control.
FAQ
What is the maximum RF input power the HMC199AMS8 can handle continuously?
The HMC199AMS8 has an absolute maximum RF input power rating of +29.3 dBm under VCTL = 0/+5 V conditions. However, continuous operation above the 1 dB compression point (25–28 dBm depending on frequency and control voltage) is not recommended. For reliable long-term use, keep input power ≤22 dBm to avoid hot-switching damage and ensure distortion performance remains within spec.
Does the HMC199AMS8 require external DC blocking capacitors?
Yes, the HMC199AMS8 requires DC blocking capacitors at all four RF ports (RFC1, RFC2, RF1, RF2). The datasheet specifies this explicitly, and capacitor value must be selected based on the lowest operating frequency - for example, 330 pF is used on the EV1HMC199AMS8 evaluation board to support down to ~100 MHz. Omitting them risks bias disruption and potential device damage.
Can the HMC199AMS8 operate with 0/+3 V control logic, and how does that affect RF performance?
Yes, the HMC199AMS8 fully supports 0/+3 V positive control logic per its truth table and electrical specs. At +3 V, insertion loss increases slightly (e.g., 0.1 dB higher at 2 GHz), and IIP3 drops ~5 dB compared to +5 V operation, but all parameters remain within guaranteed specifications. This enables direct interface with 3.3 V microcontrollers without level shifting.
What is the thermal resistance (θJA) of the HMC199AMS8, and how does it impact power dissipation?
The HMC199AMS8 has a thermal resistance of 171 °C/W. With a maximum continuous power dissipation of 0.38 W at 85 °C ambient, junction temperature rise is ~65 °C under full load - well below the 150 °C channel temperature limit. Proper PCB grounding of both GND pins (pins 3 and 6) is mandatory to achieve this θJA and prevent thermal derating.
Is the HMC199AMS8 pin-compatible with the RoHS-compliant HMC199AMS8E variant?
Yes, the HMC199AMS8 and HMC199AMS8E share identical pinout, package dimensions, and electrical specifications. The only differences are lead finish (Sn/Pb vs. 100% matte Sn) and peak reflow temperature (235 °C vs. 260 °C). No PCB layout change is needed when migrating from HMC199AMS8 to HMC199AMS8E for RoHS compliance.
HMC199AMS8 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Analog Devices Inc.
- Series:
- -
- Package/Case:
- 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
- Packaging:
- Bulk
- Product Status:
- Obsolete
- RF Type:
- ISM
- Topology:
- -
- Circuit:
- SPDT
- Frequency Range:
- 0Hz ~ 2.5GHz
- Isolation:
- 25dB
- Insertion Loss:
- 0.6dB
- Test Frequency:
- 2GHz, 2.5GHz
- P1dB:
- 28dBm
- IIP3:
- 55dBm
- Features:
- -
- Impedance:
- 50Ohm
- Voltage - Supply:
- 3V
- Operating Temperature:
- -40°C ~ 85°C
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 8-MSOP
HMC199AMS8 FAQ
1.How can I place an order for HMC199AMS8 through Aetrix?
Please submit a Request for Quotation (RFQ) for HMC199AMS8 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for HMC199AMS8 reliable?
The price and inventory of HMC199AMS8 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for HMC199AMS8 is usually 5 days.
3.What payment methods are accepted for HMC199AMS8?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for HMC199AMS8 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for HMC199AMS8?
HMC199AMS8 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your HMC199AMS8 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for HMC199AMS8?
For technical support, including HMC199AMS8 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your HMC199AMS8 requirements.
6.How does Aetrix verify that HMC199AMS8 is sourced from the original manufacturer or authorized distributors?
All HMC199AMS8 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that HMC199AMS8 meets industry standards.
7.What is the process for return or replacement of HMC199AMS8?
All HMC199AMS8 units undergo pre-shipment inspection (PSI). If there is an issue with HMC199AMS8, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The HMC199AMS8 part is unused and in its original packaging.
Return procedure for HMC199AMS8:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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