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Analog Devices Inc. HMC219AMS8
- Part No.:
- HMC219AMS8
- Manufacturer:
- Analog Devices Inc.
- Category:
- RF Mixers
- Package:
- 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
- Datasheet:
-
HMC219AMS8.pdf
- Description:
- IC MIXER 4.5-9GHZ UP/DWN 8MSOP
- Quantity:
- Payment:
- Shipping:
Inventory:3,199
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Product details
Overview
HMC219AMS8 from Hittite Microwave Corporation (now part of Analog Devices) is a GaAs MMIC double-balanced mixer in MSOP-8 package, operating from 4.5–9.0 GHz RF/LO and DC–2.5 GHz IF, with 8.5 dB typical conversion loss, 25 dB LO/RF isolation, and +21 dBm input IP3 at +13 dBm LO drive-used in UNII/HiperLAN transceivers and microwave radios.
For engineers reviewing the HMC219AMS8 datasheet, HMC219AMS8 pinout, HMC219AMS8 application, or HMC219AMS8 equivalent, key selection criteria include RF/LO frequency coverage, conversion loss stability across temperature, LO drive sensitivity (+11 to +15 dBm), IF bandwidth, and ESD robustness (Class 1A HBM).
Technical Context
This passive MMIC mixer uses monolithic GaAs Schottky diodes and integrated planar transformer baluns to achieve broadband double-balanced operation without external bias. It functions as upconverter, downconverter, bi-phase modulator, or phase comparator with no DC power required.
Performance is specified at TA = +25°C with LO drive from +11 to +15 dBm; conversion loss, noise figure, isolation, and linearity (IP3, P1dB) are all characterized across RF/LO (4.5–9.0 GHz) and IF (DC–2.5 GHz) bands, with thermal stability validated from –40°C to +85°C.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| RF/LO Frequency Range | 4.5–9.0 GHz (supports full UNII-3 and HiperLAN/2 bands; usable up to 8.6 GHz at +11 dBm LO) |
| IF Frequency Range | DC–2.5 GHz (enables baseband and low-IF architectures without external filtering) |
| Conversion Loss | 8.5 dB typ. @ +13 dBm LO (low loss enables high receiver sensitivity and reduced cascaded noise) |
| LO–RF Isolation | 25 dB typ. @ +13 dBm LO (minimizes LO leakage into antenna path, easing filter requirements) |
| Input IP3 | +21 dBm typ. @ +13 dBm LO (supports high dynamic range in dense RF environments) |
| P1dB (Input) | +10 dBm typ. @ +13 dBm LO (defines usable compression point for linear operation) |
| Noise Figure (SSB) | 8.5 dB typ. @ +13 dBm LO (directly impacts system noise floor in receive chains) |
| ESD Rating | HBM Class 1A (requires strict handling per JEDEC JS-001; limits board-level protection overhead) |
Pinout & Package
Package: MSOP-8 (Low Stress Injection Molded Plastic, Sn/Pb lead finish, MSL1, 219A marking). Dimensions per Hittite drawing: 3.0 × 3.0 × 0.87 mm body, 0.65 mm lead pitch. All ground leads must be soldered to PCB RF ground.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 | RF Input | Differential RF port (balanced); requires 50 Ω matched trace and symmetric layout |
| 2 | Ground | RF ground reference; must connect directly to solid ground plane via multiple vias |
| 3 | LO Input | Differential LO port (balanced); sensitive to LO drive level (+11 to +15 dBm optimal) |
| 4 | Ground | LO ground reference; isolated from RF ground in layout to prevent coupling |
| 5 | Ground | IF ground reference; shared return for differential IF output |
| 6 | IF Output (−) | Negative leg of differential IF output; requires 50 Ω termination and balanced routing |
| 7 | IF Output (+) | Positive leg of differential IF output; paired with Pin 6 for SSB image rejection |
| 8 | Ground | Common ground for package shielding; ties all internal grounds to PCB ground plane |
Key Features
| Feature | Design Value |
|---|---|
| Double-balanced GaAs MMIC architecture | Eliminates even-order harmonics and local oscillator feedthrough without external baluns |
| Ultra-small MSOP-8 footprint | 3.0 × 3.0 mm area saves PCB space in compact microwave modules and SMT radios |
| Wide IF bandwidth (DC–2.5 GHz) | Supports zero-IF, low-IF, and IF-sampling architectures without IF filtering constraints |
| Thermal stability (–40°C to +85°C) | Conversion loss and IP3 vary < ±0.5 dB over full temp range-no recalibration needed |
| High LO–RF isolation (25 dB) | Reduces need for external LO suppression filters in transmit/receive switch designs |
| Class 1A ESD rating | Enables integration into production lines without special ESD flooring or tooling beyond standard Class 1A protocols |
Applications
| UNII/HiperLAN Transceivers | Microwave Point-to-Point Radios |
|---|---|
Use Scenario: 5.25–5.85 GHz UNII-3 band transceiver in enterprise Wi-Fi access points and client adapters. IC Role / Device Role / Timing Role: Downconverting received RF to 100 MHz IF for ADC sampling; upconverting baseband I/Q to RF for transmission. Use Value: 8.5 dB conversion loss and 25 dB LO–RF isolation reduce front-end gain requirements and simplify duplexer design. | Use Scenario: 6–8 GHz licensed microwave backhaul link operating in outdoor enclosures with wide temperature swing. IC Role / Device Role / Timing Role: Double-balanced mixing in both transmit and receive paths of FDD transceivers. Use Value: Stable IP3 (+21 dBm) and P1dB (+10 dBm) ensure linear operation under varying LO drive and ambient temperature. |
| ISM Band Sensor Links | Test & Measurement Signal Sources |
Use Scenario: 5.8 GHz industrial sensor node using spread-spectrum modulation in factory automation. IC Role / Device Role / Timing Role: Bi-phase modulator for OOK/FSK upconversion; phase comparator in PLL-based local oscillator synthesis. Use Value: DC–2.5 GHz IF bandwidth supports direct baseband modulation without IF translation stages. | Use Scenario: Lab-grade signal generator module requiring clean spectral purity and minimal spurious outputs. IC Role / Device Role / Timing Role: Active mixer stage in harmonic-rich LO chain to generate calibrated test tones. Use Value: Low spurious levels (e.g., −57 dBc 3rd-order LO harmonics at 8 GHz) meet stringent spectral mask requirements. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar double-balanced mixer applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| HMC1040LP3E | Wider RF/LO range (2–18 GHz), higher conversion loss (9.5 dB), larger QFN-16 package | Supports Ka-band; requires more board area and thermal management | Select when extending beyond 9 GHz or needing higher power handling |
| ADL5801ACPZ-R7 | Active mixer (requires +5 V bias), lower noise figure (8.0 dB), narrower RF range (7–2.7 GHz) | Needs DC power and decoupling; better for low-noise receivers below 2.7 GHz | Select for sub-3 GHz systems where active gain and lower NF outweigh passive simplicity |
Compared with HMC219AMS8, HMC1040LP3E extends frequency coverage but trades off size and conversion loss, while ADL5801ACPZ-R7 introduces active bias complexity to improve noise figure-neither is pin-compatible, and each requires layout revision and recalibration.
Availability
HMC219AMS8 is available at Aetrix Electronics and suitable for UNII/HiperLAN transceivers, microwave point-to-point radios, ISM band sensor links, and test & measurement signal sources requiring stable component supply across extended temperature ranges and high-volume production.
Supply support for HMC219AMS8 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Hittite Microwave Corporation was a U.S.-based RF/microwave semiconductor company acquired by Analog Devices in 2014, specializing in high-frequency ICs for wireless infrastructure and defense.
The HMC219AMS8 belongs to Hittite's passive GaAs MMIC mixer product line, designed specifically for compact, high-isolation, wide-IF SMT solutions in 4.5–9 GHz wireless infrastructure and test equipment.
FAQ
What is the recommended LO drive level for optimal performance of the HMC219AMS8?
The HMC219AMS8 achieves best conversion loss (8.5 dB) and IP3 (+21 dBm) at +13 dBm LO drive. Performance remains functional from +11 to +15 dBm, but conversion loss increases to 10 dB and IP3 drops to +15 dBm at +11 dBm. Operating outside this range risks degraded linearity or excessive distortion. The HMC219AMS8 does not require DC bias-only proper LO drive and impedance-matched RF/IF paths.
Does the HMC219AMS8 require external baluns or matching components?
No-the HMC219AMS8 integrates planar transformer baluns on-die, enabling fully differential RF, LO, and IF interfaces without external baluns. However, 50 Ω single-ended traces must be properly matched to the differential ports using microstrip geometry and symmetric layout. The evaluation board (PCB 101650) demonstrates this with Rogers 4350 substrate and controlled-impedance routing. The HMC219AMS8 itself contains no active circuitry or bias networks.
What is the maximum RF input power the HMC219AMS8 can handle without damage?
The absolute maximum RF/IF input power for the HMC219AMS8 is +13 dBm. Exceeding this risks permanent degradation of the GaAs Schottky diodes. At +10 dBm input (near P1dB), compression begins; sustained operation above +10 dBm reduces dynamic range and increases intermodulation. The HMC219AMS8 also has a +27 dBm LO drive limit-exceeding either rating voids reliability guarantees. Thermal derating is not specified; operation must stay within –40°C to +85°C ambient.
How does the HMC219AMS8 perform across temperature, and is calibration required?
The HMC219AMS8 exhibits minimal parameter drift: conversion loss varies ≤ ±0.3 dB and IP3 ≤ ±0.5 dB from –40°C to +85°C at +13 dBm LO. LO–RF isolation remains ≥20 dB across temperature. These stabilities eliminate need for temperature-compensated gain control or real-time calibration in most deployments. The HMC219AMS8 is qualified to operate continuously in industrial environments without thermal management beyond standard PCB copper pour and via stitching.
Is the HMC219AMS8 RoHS-compliant, and what is its moisture sensitivity level?
The HMC219AMS8 uses Sn/Pb lead finish and is not RoHS-compliant; the RoHS variant is HMC219AMS8E (100% matte Sn, MSL1, 260 °C peak reflow). Both variants have MSL1 rating-unlimited floor life at ≤30°C/60% RH, no bake required before reflow. The HMC219AMS8 package is low-stress injection molded plastic; storage temperature range is –65°C to +150°C, and ESD sensitivity is JEDEC Class 1A (≤250 V HBM).
HMC219AMS8 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Analog Devices Inc.
- Series:
- -
- Package/Case:
- 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
- Packaging:
- Bulk
- Product Status:
- Obsolete
- RF Type:
- General Purpose
- Frequency:
- 4.5GHz ~ 9GHz
- Number of Mixers:
- 1
- Gain:
- -
- Noise Figure:
- 8.5dB
- Secondary Attributes:
- Up/Down Converter
- Current - Supply:
- -
- Voltage - Supply:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 8-MSOP
HMC219AMS8 FAQ
1.How can I place an order for HMC219AMS8 through Aetrix?
Please submit a Request for Quotation (RFQ) for HMC219AMS8 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for HMC219AMS8 reliable?
The price and inventory of HMC219AMS8 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for HMC219AMS8 is usually 5 days.
3.What payment methods are accepted for HMC219AMS8?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for HMC219AMS8 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for HMC219AMS8?
HMC219AMS8 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your HMC219AMS8 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for HMC219AMS8?
For technical support, including HMC219AMS8 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your HMC219AMS8 requirements.
6.How does Aetrix verify that HMC219AMS8 is sourced from the original manufacturer or authorized distributors?
All HMC219AMS8 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that HMC219AMS8 meets industry standards.
7.What is the process for return or replacement of HMC219AMS8?
All HMC219AMS8 units undergo pre-shipment inspection (PSI). If there is an issue with HMC219AMS8, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The HMC219AMS8 part is unused and in its original packaging.
Return procedure for HMC219AMS8:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
HMC219AMS8 Tags
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MAX2671EUT+T
Analog Devices Inc./Maxim Integrated
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ADEX-10+
Mini-Circuits
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ADE-2+
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ADE-1+
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LT5560EDD#PBF
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LT5560EDD#TRPBF
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LTC5562IUC#TRPBF
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MAX2681EUT+T
Analog Devices Inc./Maxim Integrated
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ADE-1ASK+
Mini-Circuits
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ADE-1L+
Mini-Circuits
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ADL5350ACPZ-R7
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AD608ARZ-RL
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