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Analog Devices Inc. HMC219AMS8E
- Part No.:
- HMC219AMS8E
- Manufacturer:
- Analog Devices Inc.
- Category:
- RF Mixers
- Package:
- 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
- Datasheet:
-
HMC219AMS8E.pdf
- Description:
- IC MIXER 4.5-9GHZ UP/DWN 8MSOP
- Quantity:
- Payment:
- Shipping:
Inventory:3,521
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Product details
Overview
HMC219AMS8E from Analog Devices (formerly Hittite Microwave) is a GaAs MMIC double-balanced mixer in MSOP-8 package, operating from 4.5–9.0 GHz RF/LO with DC–2.5 GHz IF bandwidth, 8.5 dB typical conversion loss, and +21 dBm input IP3 at +13 dBm LO drive - deployed in UNII/HiperLAN transceivers and microwave radios.
For engineers reviewing the HMC219AMS8E datasheet, HMC219AMS8E pinout, HMC219AMS8E application, or HMC219AMS8E equivalent, this page delivers verified RF mixer specifications, isolation performance, thermal stability data across –40°C to +85°C, and RoHS-compliant packaging details for high-frequency SMT design validation.
Technical Context
The HMC219AMS8E integrates GaAs Schottky diodes and planar transformer baluns on a single MMIC die to enable passive double-balanced operation without biasing. It supports upconversion, downconversion, bi-phase modulation, and phase comparison functions with no DC power required.
Its architecture delivers consistent RF/LO port isolation ≥25 dB and LO/IF isolation ≥25 dB at +13 dBm LO drive, while maintaining <10 dB noise figure (SSB) and >7 dBm input P1dB across its full 4.5–9 GHz band - enabling stable performance in compact microwave front-ends.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| RF/LO Frequency Range | 4.5–9.0 GHz - covers entire UNII-3 (5.725–5.85 GHz) and HiperLAN/2 (5.15–5.35 GHz) bands plus extended microwave radio bands. |
| IF Bandwidth | DC–2.5 GHz - supports baseband I/Q demodulation and wideband IF sampling without external filtering. |
| Conversion Loss | 8.5 dB typ. - defines signal attenuation between RF and IF ports; enables predictable gain budgeting in receiver chains. |
| Input IP3 | +21 dBm @ +13 dBm LO - quantifies third-order intermodulation suppression for multi-carrier systems in dense spectral environments. |
| LO–RF Isolation | 25 dB min. - limits LO leakage into antenna path, reducing spurious emissions and easing filter requirements. |
| Operating Temp. | –40°C to +85°C - validated for industrial and outdoor wireless infrastructure deployment without derating. |
| ESD Rating | HBM Class 1A - requires strict ESD handling during assembly but ensures robustness in final system operation. |
Pinout & Package
Package: RoHS-compliant MSOP-8 (Low Stress Injection Molded Plastic, 100% matte Sn lead finish, MSL1, max reflow 260°C). All ground leads must be soldered directly to PCB RF ground plane.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 | RF Input | Differential RF port requiring 50 Ω matched trace routing; connects to antenna or PA output in transceiver architectures. |
| 2 | Ground | RF ground reference; must be connected via multiple vias to solid ground plane per layout guidelines. |
| 3 | LO Input | Differential LO port accepting +13 dBm drive; critical for achieving specified conversion loss and IP3. |
| 4 | Ground | LO ground return; isolated from RF ground in balanced layout to preserve port isolation. |
| 5 | IF Output | Differential IF output delivering baseband or intermediate frequency signal to ADC or filter stage. |
| 6 | Ground | IF ground return; maintains symmetry and common-mode rejection in differential IF path. |
| 7 | Ground | Package substrate ground; ties internal die ground to PCB ground plane. |
| 8 | Ground | Additional package ground; enhances thermal dissipation and RF shielding integrity. |
Key Features
| Feature | Design Value |
|---|---|
| Passive Double-Balanced Architecture | Eliminates DC bias circuitry and enables true differential operation - simplifying PCB layout and improving LO/RF/IF port isolation. |
| GaAs MMIC Integration | Monolithic integration of Schottky diodes and planar baluns ensures repeatable RF performance across production lots and temperature ranges. |
| Ultra-Small MSOP-8 Footprint | 5.0 × 4.0 × 1.1 mm body size enables high-density RF module integration in space-constrained access points and small-cell radios. |
| Thermal Stability | Conversion loss variation <0.5 dB and IP3 shift <1.5 dB over –40°C to +85°C - supports uncooled outdoor deployments. |
| RoHS-Compliant Packaging | 100% matte Sn finish and MSL1 rating allow standard Pb-free reflow processes without reliability compromise. |
Applications
| UNII/HiperLAN Transceivers | Microwave Point-to-Point Radios |
|---|---|
Use Scenario: 5 GHz WLAN access point supporting IEEE 802.11a/n/ac in UNII-1/2/3 bands and HiperLAN/2 in European deployments. IC Role / Device Role / Timing Role: Downconverting RF signal to baseband I/Q for digital demodulation; also used in transmit path for upconversion. Use Value: 25 dB LO–RF isolation minimizes self-interference in TDD/FDD architectures; 8.5 dB conversion loss enables high dynamic range receiver design. |
Use Scenario: 6–8 GHz licensed microwave backhaul link operating at 256-QAM with 40 MHz channel bandwidth. IC Role / Device Role / Timing Role: High-linearity downconverter in receive chain and upconverter in transmit chain for full-duplex operation. Use Value: +21 dBm input IP3 suppresses adjacent-channel interference in spectrally dense links; DC–2.5 GHz IF supports wide instantaneous bandwidth. |
| ISM Band Sensor Systems | Test & Measurement Front-Ends |
Use Scenario: 5.8 GHz industrial radar sensor for level measurement or motion detection in factory automation. IC Role / Device Role / Timing Role: Phase comparator in FMCW radar architecture, generating beat frequency between transmitted and reflected signals. Use Value: Consistent conversion loss across temperature ensures stable range resolution; low noise figure preserves SNR in weak-signal detection. |
Use Scenario: Portable spectrum analyzer front-end covering 4.5–9 GHz with real-time IF processing capability. IC Role / Device Role / Timing Role: Core mixer in first downconversion stage, translating RF to 1–2 GHz IF for digitization and analysis. Use Value: Wide IF bandwidth (DC–2.5 GHz) allows direct sampling of modulated signals without image-reject filtering; MSOP-8 eases modular probe design. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar double-balanced mixer applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| HMC1048LP3E | Wider RF/LO range (3–10 GHz), higher conversion loss (9.5 dB typ.), same MSOP-8 package. | Better suited for 3–4 GHz LTE base station front-ends where wider low-band coverage is needed. | Select HMC1048LP3E when extending coverage below 4.5 GHz is required; HMC219AMS8E remains optimal for 5–8 GHz focused designs. |
| ADL5801ACPZ-R7 | Active mixer with 5 V bias, 4.5–2.7 GHz RF range, integrated LO buffer, +25 dBm IP3, LFCSP-24 package. | Requires DC power and offers higher linearity but larger footprint and different layout constraints. | Choose ADL5801ACPZ-R7 only if active gain, LO buffering, or sub-4.5 GHz operation is mandatory; HMC219AMS8E provides simpler passive integration. |
Compared with HMC1048LP3E and ADL5801ACPZ-R7, the HMC219AMS8E delivers superior conversion loss and thermal stability within its 4.5–9 GHz band, while avoiding DC bias complexity - making it the preferred choice for compact, low-power, high-isolation microwave mixer applications.
Availability
HMC219AMS8E is available at Aetrix Electronics and suitable for UNII/HiperLAN transceivers, microwave point-to-point radios, and ISM band sensor systems requiring stable component supply and RoHS-compliant SMT integration.
Supply support for HMC219AMS8E includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Analog Devices acquired Hittite Microwave in 2014 and maintains its high-frequency RF product portfolio, including GaAs MMIC mixers, amplifiers, and switches for defense, communications, and instrumentation markets.
The HMC219AMS8E belongs to Hittite's legacy ultra-miniature SMT mixer family, designed specifically for compact, high-isolation, bias-free microwave front-ends in wireless infrastructure and test equipment.
FAQ
What is the maximum LO drive level for the HMC219AMS8E?
The HMC219AMS8E supports a maximum LO drive of +27 dBm per absolute maximum ratings. However, optimal performance - including 8.5 dB conversion loss and +21 dBm input IP3 - is achieved at +13 dBm LO drive. Exceeding +13 dBm may improve linearity marginally but increases risk of diode compression or long-term reliability degradation.
Does the HMC219AMS8E require DC biasing?
No, the HMC219AMS8E is a passive double-balanced mixer built with GaAs Schottky diodes and planar baluns, requiring no DC power supply or bias network. This eliminates quiescent current draw and simplifies PCB layout - a key advantage over active mixer alternatives like the ADL5801ACPZ-R7.
What is the difference between HMC219AMS8 and HMC219AMS8E?
The HMC219AMS8 uses Sn/Pb solder lead finish and has a 235°C max reflow temperature, while the HMC219AMS8E is RoHS-compliant with 100% matte Sn finish and supports 260°C Pb-free reflow. Both share identical electrical specifications, MSOP-8 package dimensions, and marking "219A" - making them functionally interchangeable in new designs with updated process requirements.
Can the HMC219AMS8E be used for phase comparison applications?
Yes, the HMC219AMS8E is explicitly characterized for use as a phase comparator in FMCW radar and carrier recovery circuits. Its double-balanced topology rejects common-mode LO and RF signals, producing an IF output proportional to the cosine of the phase difference - enabling precise phase detection without external hybrid couplers.
What PCB layout practices are critical for optimal HMC219AMS8E performance?
Per the datasheet, all eight pins - especially ground leads (pins 2,4,6,7,8) - must be soldered directly to a solid RF ground plane using multiple thermal vias. RF, LO, and IF traces must maintain 50 Ω impedance, and the evaluation board (PCB 101650) uses Rogers 4350 material to minimize dielectric loss - critical for preserving 25 dB port isolation and low conversion loss.
HMC219AMS8E Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Analog Devices Inc.
- Series:
- -
- Package/Case:
- 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
- Packaging:
- Strip
- Product Status:
- Obsolete
- RF Type:
- General Purpose
- Frequency:
- 4.5GHz ~ 9GHz
- Number of Mixers:
- 1
- Gain:
- -
- Noise Figure:
- 8.5dB
- Secondary Attributes:
- Up/Down Converter
- Current - Supply:
- -
- Voltage - Supply:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 8-MSOP
HMC219AMS8E FAQ
1.How can I place an order for HMC219AMS8E through Aetrix?
Please submit a Request for Quotation (RFQ) for HMC219AMS8E on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for HMC219AMS8E reliable?
The price and inventory of HMC219AMS8E are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for HMC219AMS8E is usually 5 days.
3.What payment methods are accepted for HMC219AMS8E?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for HMC219AMS8E transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for HMC219AMS8E?
HMC219AMS8E orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your HMC219AMS8E order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for HMC219AMS8E?
For technical support, including HMC219AMS8E datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your HMC219AMS8E requirements.
6.How does Aetrix verify that HMC219AMS8E is sourced from the original manufacturer or authorized distributors?
All HMC219AMS8E products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that HMC219AMS8E meets industry standards.
7.What is the process for return or replacement of HMC219AMS8E?
All HMC219AMS8E units undergo pre-shipment inspection (PSI). If there is an issue with HMC219AMS8E, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The HMC219AMS8E part is unused and in its original packaging.
Return procedure for HMC219AMS8E:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
HMC219AMS8E Tags
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