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Analog Devices Inc. HMC219BMS8GE
- Part No.:
- HMC219BMS8GE
- Manufacturer:
- Analog Devices Inc.
- Category:
- RF Mixers
- Package:
- 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) Exposed Pad
- Datasheet:
-
HMC219BMS8GE.pdf
- Description:
- IC MMIC MIXER 2.5-7GHZ 8MINISOEP
- Quantity:
- Payment:
- Shipping:
Inventory:228
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Product details
Overview
HMC219BMS8GE from Analog Devices is a GaAs MMIC fundamental double-balanced mixer operating from 2.5 GHz to 7.0 GHz, supporting both upconversion and downconversion with 9 dB typical conversion loss, 40 dB LO-to-RF isolation, and 18 dBm input IP3 - deployed in microwave radios and HiperLAN/U-NII infrastructure.
For engineers reviewing the HMC219BMS8GE datasheet, HMC219BMS8GE pinout, HMC219BMS8GE application, or HMC219BMS8GE equivalent, this page delivers verified RF mixer specifications, validated terminal functions, real-world isolation performance, and direct alternatives for 2.5–7.0 GHz signal translation in compact SMT designs.
Technical Context
The HMC219BMS8GE is a passive monolithic microwave integrated circuit fabricated in GaAs MESFET technology, requiring no external matching components or bias circuitry. Its double-balanced topology uses integrated balun structures to achieve high LO-to-RF (40 dB typ) and LO-to-IF (35 dB typ) isolation across the full 2.5–7.0 GHz RF band.
It supports IF bandwidth from DC to 3 GHz and accepts LO drive of 13 dBm; operation is validated for both lower and upper sideband configurations in upconverter and downconverter modes. The device is dc-coupled on LO and RF ports, while the IF port supports dc operation up to ±6 mA.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| RF Frequency Range | 2.5 GHz to 7.0 GHz - enables coverage of key microwave bands including 2.4 GHz ISM, 3.5 GHz WIMAX, 5 GHz U-NII, and 6 GHz licensed spectrum. |
| IF Frequency Range | DC to 3 GHz - supports baseband I/Q demodulation, zero-IF architectures, and wideband IF sampling without external ac-coupling constraints. |
| Conversion Loss | 9 dB typical - defines signal attenuation between RF and IF paths; low loss reduces required gain staging and system noise figure impact. |
| LO to RF Isolation | 40 dB typical - suppresses LO leakage into antenna or RF front-end, critical for receiver dynamic range and transmitter spectral purity. |
| Input IP3 | 18 dBm typical - quantifies third-order intermodulation resilience; enables handling of multi-carrier signals in dense RF environments. |
| Input P1dB | 11 dBm typical - indicates compression onset; sets usable input power ceiling before distortion degrades EVM or adjacent channel power. |
| Package | 8-lead MINI_SO_EP (3 mm × 3 mm) - RoHS-compliant surface-mount package with exposed thermal pad for efficient PCB heat dissipation. |
Pinout & Package
Package: 8-lead plastic MINI_SO_EP (3 mm × 3 mm) with exposed thermal pad, compatible with standard reflow soldering and high-volume SMT assembly. Exposed pad must be connected to RF/dc ground per layout guidelines.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1, 3, 6, 8 | GND | RF and dc ground terminals; all four must be low-inductance connected to PCB ground plane to maintain balun integrity and thermal performance. |
| 2 | LO | Local oscillator input; 50 Ω dc-coupled port accepting +13 dBm drive; requires clean, stable LO source with minimal phase noise. |
| 4 | NIC | Not internally connected - must remain floating; no trace or solder mask connection permitted to avoid parasitic coupling. |
| 5 | IF | Intermediate frequency output/input; dc-coupled; supports ±6 mA current; use series capacitor if dc blocking required for ac-coupled IF interface. |
| 7 | RF | Radio frequency port; 50 Ω dc-coupled; connects to antenna, filter, or LNA/PA; return loss ≥10 dB ensures minimal mismatch loss. |
Key Features
| Feature | Design Value |
|---|---|
| Passive double-balanced topology | Eliminates need for external baluns or matching networks; simplifies PCB layout and improves repeatability across production units. |
| High LO-to-RF isolation (40 dB) | Reduces risk of LO radiation through antenna path, easing EMC compliance in transceiver modules and base station radios. |
| Wide IF bandwidth (DC–3 GHz) | Enables flexible architecture choices - zero-IF, low-IF, or image-reject configurations - without redesigning IF filtering or amplification. |
| RoHS-compliant MINI_SO_EP | Supports automated high-volume assembly; exposed pad enhances thermal management for sustained operation at +85°C ambient. |
| No external bias or tuning required | Reduces BOM count and design validation effort; eliminates startup sequencing concerns and voltage regulator dependencies. |
Applications
| Microwave Point-to-Point Radio | HiperLAN/2 & U-NII Access Point |
|---|---|
|
Use Scenario: Full-duplex transceiver in 5.8 GHz licensed microwave backhaul link with 40 MHz channel bandwidth. IC Role / Device Role / Timing Role: Downconverter for received RF signal and upconverter for transmitted IF data stream. Use Value: 9 dB conversion loss and 40 dB LO-to-RF isolation preserve SNR and prevent transmit LO leakage from desensitizing receive path. |
Use Scenario: Dual-band 5 GHz Wi-Fi 5 (802.11ac) access point supporting MU-MIMO with integrated RF front-end. IC Role / Device Role / Timing Role: Fundamental mixer translating baseband I/Q signals to 5.2–5.8 GHz RF band in uplink/downlink paths. Use Value: 18 dBm input IP3 handles concurrent multi-user transmissions without spectral regrowth; 3 GHz IF bandwidth accommodates wide digital IF interfaces. |
| ISM Band Industrial Sensor Transceiver | Test & Measurement Signal Generator |
|
Use Scenario: 2.4 GHz industrial radar module for level sensing in harsh factory environments with temperature cycling from −40°C to +85°C. IC Role / Device Role / Timing Role: Downconverter extracting Doppler-shifted IF signal from reflected RF pulses. Use Value: Stable 11 dBm P1dB and 18 dBm IP3 ensure linear response across temperature; dc-coupled IF supports baseband pulse detection without coupling capacitors. |
Use Scenario: Modular RF synthesizer platform generating calibrated CW and modulated signals from 2.5–7.0 GHz for lab-grade spectrum analyzer calibration. IC Role / Device Role / Timing Role: Fundamental mixer core in broadband upconversion stage driven by DDS-based IF and VCO-based LO. Use Value: Low spurious output (e.g., −79 dBc 2×RF−2×LO) and consistent 9 dB conversion loss across band enable accurate amplitude and phase reference generation. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar fundamental mixer applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| HMC218BMS8GE | Same 8-lead MINI_SO_EP package; narrower RF range (2.5–5.5 GHz); 10 dB conversion loss; 37 dB LO-to-RF isolation. | Better suited for sub-6 GHz fixed wireless access where upper band extension beyond 5.5 GHz is unnecessary. | Select when cost sensitivity outweighs need for 6–7 GHz coverage and slightly higher isolation is acceptable. |
| QPC7332 | Qorvo GaAs pHEMT mixer; 2.3–7.0 GHz RF; 8.5 dB conversion loss; 32 dB LO-to-RF isolation; requires external IF filtering. | Higher integration density but demands external matching; optimized for battery-powered portable test equipment. | Choose for ultra-low-power handheld analyzers where board space is constrained and external component count is manageable. |
Compared with HMC219BMS8GE, HMC218BMS8GE trades 1.5 GHz upper-frequency margin and 3 dB isolation for lower cost, while QPC7332 offers marginally better conversion loss but sacrifices integration simplicity and requires careful IF network design.
Availability
HMC219BMS8GE is available at Aetrix Electronics and suitable for microwave radios, HiperLAN/U-NII access points, and ISM-band sensor transceivers requiring stable component supply, long-term lifecycle support, and RoHS-compliant SMT packaging.
Supply support for HMC219BMS8GE includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Analog Devices is a global leader in high-performance analog, mixed-signal, and RF ICs, serving communications, instrumentation, and defense markets with precision signal processing solutions.
The HMC219BMS8GE belongs to Analog Devices' Hittite Microwave MMIC product line, engineered for broadband RF front-end applications demanding high linearity, low conversion loss, and robust thermal performance in compact SMT packages.
FAQ
What is the recommended LO drive level for optimal performance of the HMC219BMS8GE?
The HMC219BMS8GE is characterized and optimized for +13 dBm LO drive level. At this power, it achieves 9 dB typical conversion loss, 40 dB LO-to-RF isolation, and 18 dBm input IP3. Deviating below 11 dBm increases conversion loss; exceeding 15 dBm risks degradation in linearity and may accelerate long-term reliability wear. Always verify LO spectral purity, as phase noise directly impacts system EVM.
Can the HMC219BMS8GE be used for zero-IF (direct-conversion) receiver designs?
Yes, the HMC219BMS8GE supports zero-IF operation because its IF port is dc-coupled and rated for ±6 mA source/sink current. When used in direct-conversion receivers, ensure the IF output is interfaced with a low-noise amplifier having appropriate input impedance and dc offset handling. Avoid exceeding the ±6 mA limit to prevent device malfunction or permanent damage.
Does the HMC219BMS8GE require external matching components or bias circuitry?
No, the HMC219BMS8GE is a fully passive, double-balanced MMIC mixer that requires no external matching networks, bias tees, or dc blocking capacitors on LO or RF ports. Its internal balun structure and 50 Ω matched ports eliminate tuning complexity. Only the IF port may require an external series capacitor if dc blocking is needed - otherwise, it operates directly to dc.
How does the exposed pad on the HMC219BMS8GE package affect thermal performance?
The exposed pad on the HMC219BMS8GE must be soldered to a solid RF/dc ground plane using ≥9 vias (3×3 array) to achieve the specified θJC = 92.5°C/W. Without proper thermal connection, junction temperature can exceed 175°C under full RF/LO power, triggering thermal shutdown or irreversible degradation. Thermal resistance rises sharply if the pad is left unconnected or routed with narrow traces.
Is the HMC219BMS8GE pin-compatible with other Hittite mixer variants like HMC218BMS8GE?
Yes, the HMC219BMS8GE shares identical 8-lead MINI_SO_EP footprint and pinout with HMC218BMS8GE, enabling drop-in replacement in existing layouts. However, due to differences in RF bandwidth (2.5–7.0 GHz vs. 2.5–5.5 GHz) and isolation (40 dB vs. 37 dB), system-level verification of spurious suppression and gain flatness above 5.5 GHz is required after substitution.
HMC219BMS8GE Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Analog Devices Inc.
- Series:
- -
- Package/Case:
- 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) Exposed Pad
- Packaging:
- Strip
- Product Status:
- Active
- RF Type:
- -
- Frequency:
- 2.5GHz ~ 7GHz
- Number of Mixers:
- 1
- Gain:
- -
- Noise Figure:
- 8dB
- Secondary Attributes:
- -
- Current - Supply:
- -
- Voltage - Supply:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 8-MiniSO-EP
HMC219BMS8GE FAQ
1.How can I place an order for HMC219BMS8GE through Aetrix?
Please submit a Request for Quotation (RFQ) for HMC219BMS8GE on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for HMC219BMS8GE reliable?
The price and inventory of HMC219BMS8GE are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for HMC219BMS8GE is usually 5 days.
3.What payment methods are accepted for HMC219BMS8GE?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for HMC219BMS8GE transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for HMC219BMS8GE?
HMC219BMS8GE orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your HMC219BMS8GE order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for HMC219BMS8GE?
For technical support, including HMC219BMS8GE datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your HMC219BMS8GE requirements.
6.How does Aetrix verify that HMC219BMS8GE is sourced from the original manufacturer or authorized distributors?
All HMC219BMS8GE products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that HMC219BMS8GE meets industry standards.
7.What is the process for return or replacement of HMC219BMS8GE?
All HMC219BMS8GE units undergo pre-shipment inspection (PSI). If there is an issue with HMC219BMS8GE, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The HMC219BMS8GE part is unused and in its original packaging.
Return procedure for HMC219BMS8GE:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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