Analog Devices Inc. HMC220BMS8GETR
- Part No.:
- HMC220BMS8GETR
- Manufacturer:
- Analog Devices Inc.
- Category:
- RF Mixers
- Package:
- 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) Exposed Pad
- Datasheet:
-
HMC220BMS8GETR.pdf
- Description:
- 5-12 GHZ DBL-BAL MIXER
- Quantity:
- Payment:

- Shipping:

Inventory:1,098
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Product details
Overview
HMC220BMS8GETR from Analog Devices is a GaAs MMIC fundamental double-balanced mixer operating from 5 GHz to 12 GHz RF, with DC–4 GHz IF bandwidth and no external bias or matching required. It delivers 9.5 dB typical conversion loss at 10 dBm LO drive, 31 dB typical LO-to-RF isolation, and supports both upconversion and downconversion in microwave radio and satellite communication systems.
For engineers reviewing the HMC220BMS8GETR datasheet, HMC220BMS8GETR pinout, HMC220BMS8GETR application, or HMC220BMS8GETR equivalent, key selection criteria include its wideband IF response (DC–4 GHz), ultrasmall 8-lead MINI_SO_EP package with exposed pad, RoHS-compliant surface-mount construction, and absence of dc bias requirements for rapid integration into high-frequency transceivers.
Technical Context
The HMC220BMS8GETR implements a monolithic GaAs Schottky diode core with integrated planar transformer baluns, enabling double-balanced operation without external components. Its architecture provides inherent suppression of even-order harmonics and strong LO-to-RF/IF isolation via optimized balun symmetry.
It operates as a fundamental mixer-no subharmonic pumping-supporting both lower- and upper-sideband downconversion/upconversion across its full 5–12 GHz RF range. The device requires only ac-coupled 50 Ω LO and RF ports and a dc-coupled IF port capable of sinking/sourcing ≤3 mA.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| RF Frequency Range | 5–12 GHz: Full operational band for microwave transceiver front-ends without tuning or switching. |
| IF Bandwidth | DC–4 GHz: Enables baseband-to-S-band IF interfaces, including zero-IF and low-IF architectures. |
| Conversion Loss | 9.5 dB typ @ 10 dBm LO: Predictable signal path loss; enables link budget planning without external gain compensation. |
| LO-to-RF Isolation | 31 dB typ: Minimizes LO leakage into antenna paths, reducing spurious emissions and receiver desensitization. |
| IIP3 | 17 dBm typ @ 10 dBm LO: Supports moderate dynamic range in crowded spectral environments like wireless backhaul. |
| Operating Temp | −40°C to +85°C: Qualified for industrial and mobile outdoor deployment without derating. |
| Package | 8-Lead MINI_SO_EP (RH-8-1): 3.0 × 3.0 mm footprint with thermal EPAD for >495 mW power dissipation. |
Pinout & Package
Package: 8-Lead Mini Small Outline Package with Exposed Pad (MINI_SO_EP, JEDEC MO-187-AA-T, package option RH-8-1), 3.0 mm × 3.0 mm body, 0.75 mm height, exposed thermal pad requiring low-impedance RF/dc ground connection.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 | LO | Ac-coupled 50 Ω local oscillator input; no dc bias needed; drives internal diode quad. |
| 2, 3, 6, 7 | GND | RF/dc ground terminals; must connect to low-inductance ground plane; critical for balun balance and thermal conduction. |
| 4 | NIC | Not internally connected; may float or tie to ground; no electrical or thermal impact on performance. |
| 5 | IF | Dc-coupled intermediate frequency output/input; max ±3 mA current; supports dc-to-4 GHz operation. |
| 8 | RF | Ac-coupled 50 Ω radio frequency port; internally matched; handles −10 dBm to +25 dBm RF input. |
| EPAD | Exposed Pad | Thermal and electrical ground interface; soldered to PCB thermal vias; essential for junction temperature control. |
Key Features
| Feature | Design Value |
|---|---|
| No dc bias required | Eliminates external bias tees, regulators, and decoupling networks-reducing BOM count and layout area. |
| No external matching | 50 Ω LO/RF ports and dc-coupled IF enable direct integration into standard RF PCBs without tuning stubs or lumped elements. |
| Double-balanced topology | Provides inherent rejection of LO×2, RF×2, and LO±RF spurs-simplifying post-mixer filtering in sensitive receivers. |
| Ultrasmall MINI_SO_EP | 3.0 × 3.0 mm footprint with EPAD supports high-density microwave module designs and automated SMT assembly. |
| RoHS-compliant & MSL1 | Compatible with lead-free reflow profiles up to 260°C; qualified for high-volume manufacturing without wire bonding. |
Applications
| VSAT Terminals | Microwave Radio |
|---|---|
Use Scenario: Compact Ku-band transmit/receive modules in portable satellite ground stations. IC Role / Device Role / Timing Role: Fundamental downconverter translating 10.7–12.75 GHz RF to L-band IF (950–2150 MHz) for demodulation. Use Value: Eliminates dc bias circuitry and matching networks, reducing module size by >30% versus discrete diode mixers. |
Use Scenario: Point-to-point wireless backhaul radios operating at 6–11 GHz licensed bands. IC Role / Device Role / Timing Role: Upconverter generating 7.125 GHz RF output from 100 MHz IF with precise LO injection. Use Value: 31 dB LO-to-RF isolation prevents LO radiation from violating EIRP regulatory limits in outdoor deployments. |
| Military EW Subsystems | Automotive DSRC |
Use Scenario: Wideband electronic warfare receivers scanning 5–12 GHz spectrum for threat detection. IC Role / Device Role / Timing Role: Image-reject downconverter with DC–4 GHz IF enabling real-time digital IF processing. Use Value: DC-coupled IF supports zero-IF architectures for instantaneous frequency measurement without IF filter switching. |
Use Scenario: 5.9 GHz dedicated short-range communications (DSRC) V2X transceivers in automotive ADAS. IC Role / Device Role / Timing Role: Low-conversion-loss mixer in compact 5.850–5.925 GHz transceiver front-end. Use Value: 9.5 dB typical conversion loss preserves SNR in battery-powered roadside units with limited RF power budget. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar fundamental mixer applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| HMC220BMS8GE | Same die, identical specs; differs only in tape-and-reel packaging (TR) vs. cut-tape (CT). | No functional difference; suitable for same RF designs and PCB layouts. | Select HMC220BMS8GETR for automated pick-and-place; HMC220BMS8GE for manual prototyping or low-volume builds. |
| QPC1006 | GaAs pHEMT-based active mixer; requires +5 V bias; 7.5–11.5 GHz RF range; 12 dB conversion gain (not loss). | Active architecture enables gain but adds power supply complexity and noise figure penalty (~12 dB NF vs. 9.5 dB). | Choose QPC1006 only when system-level gain is prioritized over power efficiency and simplicity. |
Compared with HMC220BMS8GETR, HMC220BMS8GE offers identical RF performance in cut-tape form for flexibility, while QPC1006 trades passive simplicity and low noise for active gain-requiring additional biasing and increasing overall system noise floor.
Availability
HMC220BMS8GETR is available at Aetrix Electronics and suitable for microwave radio, satellite communication terminals, and military electronic warfare subsystems requiring stable component supply across extended temperature ranges and high-frequency reliability.
Supply support for HMC220BMS8GETR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Analog Devices, Inc. is a global leader in high-performance analog, mixed-signal, and RF ICs, serving precision instrumentation, communications, and defense markets since 1965.
The HMC220BMS8GETR belongs to Analog Devices' Hittite Microwave MMIC product line, engineered specifically for broadband microwave front-end applications demanding small size, high isolation, and minimal external components.
FAQ
What is the recommended LO drive level for optimal performance of the HMC220BMS8GETR?
The HMC220BMS8GETR achieves best balance of conversion loss, IIP3, and noise figure at 10 dBm LO drive. At this level, typical conversion loss is 9.5 dB, IIP3 is 17 dBm, and SSB noise figure is 9.5 dB. Operation from 7–13 dBm is supported, with IIP3 improving to 18.5 dBm at 13 dBm-but conversion loss increases slightly to 9 dB. HMC220BMS8GETR must not be driven below 7 dBm or above 25 dBm per absolute maximum ratings.
Can the HMC220BMS8GETR be used for zero-IF (direct-conversion) receiver designs?
Yes, the HMC220BMS8GETR supports zero-IF operation because its IF port is dc-coupled and functional from DC to 4 GHz. When used in a direct-conversion receiver, the IF output passes baseband signals without high-pass filtering. However, designers must ensure the IF load does not source or sink more than ±3 mA to avoid malfunction-HMC220BMS8GETR will fail if this current limit is exceeded.
Is the NIC pin (Pin 4) of the HMC220BMS8GETR required to be grounded?
No, Pin 4 (NIC) of the HMC220BMS8GETR is Not Internally Connected and has no electrical function. It may be left floating or soldered to ground-neither choice affects RF performance, conversion loss, isolation, or thermal behavior. This pin exists solely for mechanical symmetry and package compatibility; HMC220BMS8GETR operation is fully independent of NIC pin treatment.
What thermal design guidelines apply to the exposed pad of the HMC220BMS8GETR?
The exposed pad (EPAD) of the HMC220BMS8GETR must be soldered to a low-impedance thermal and electrical ground plane using ≥9 solder paste vias (0.3 mm diameter, spaced ≤1 mm apart) under the pad. Per datasheet, thermal resistance θJC is 180°C/W and θJA is 104.7°C/W on a JEDEC 2S2P board-failure to implement adequate thermal vias risks junction temperatures exceeding 175°C at full 495 mW dissipation, triggering permanent damage.
Does the HMC220BMS8GETR support both upconversion and downconversion in the same circuit?
Yes, the HMC220BMS8GETR is bidirectional: it functions identically as an upconverter (IF→RF) or downconverter (RF→IF) without hardware change. In upconversion, IF (DC–4 GHz) modulates the LO to generate RF (5–12 GHz); in downconversion, RF is translated to IF. Performance metrics-including conversion loss, IIP3, and isolation-are specified for both modes in the datasheet, and HMC220BMS8GETR requires no configuration pins or external switches to toggle between them.
HMC220BMS8GETR Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Analog Devices Inc.
- Series:
- -
- Package/Case:
- 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) Exposed Pad
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- RF Type:
- VSAT
- Frequency:
- 5GHz ~ 12GHz
- Number of Mixers:
- 1
- Gain:
- -
- Noise Figure:
- 10dB
- Secondary Attributes:
- Up/Down Converter
- Current - Supply:
- -
- Voltage - Supply:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 8-MSOP-EP
HMC220BMS8GETR FAQ
1.How can I place an order for HMC220BMS8GETR through Aetrix?
Please submit a Request for Quotation (RFQ) for HMC220BMS8GETR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for HMC220BMS8GETR reliable?
The price and inventory of HMC220BMS8GETR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for HMC220BMS8GETR is usually 5 days.
3.What payment methods are accepted for HMC220BMS8GETR?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for HMC220BMS8GETR transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for HMC220BMS8GETR?
HMC220BMS8GETR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your HMC220BMS8GETR order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for HMC220BMS8GETR?
For technical support, including HMC220BMS8GETR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your HMC220BMS8GETR requirements.
6.How does Aetrix verify that HMC220BMS8GETR is sourced from the original manufacturer or authorized distributors?
All HMC220BMS8GETR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that HMC220BMS8GETR meets industry standards.
7.What is the process for return or replacement of HMC220BMS8GETR?
All HMC220BMS8GETR units undergo pre-shipment inspection (PSI). If there is an issue with HMC220BMS8GETR, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The HMC220BMS8GETR part is unused and in its original packaging.
Return procedure for HMC220BMS8GETR:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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