Send an Inquiry

To receive a quote for your project, please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Part Number*
Quantity*
Message
Submit Inventory List

Please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Upload My List
Message

Analog Devices Inc. HMC253LC4

Part No.:
HMC253LC4
Manufacturer:
Analog Devices Inc.
Category:
RF Switches
Package:
24-TFCQFN Exposed Pad
Datasheet:
AetrixHMC253LC4.pdf
Description:
IC RF SWITCH SP8T 3.5GHZ 24CQFN
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:1,300

Please send an inquiry. Send us your inquiry, and we will respond immediately.

Part Number
Quantity*
Price
Name*
Company
Email*
Comments

Product details

Overview

HMC253LC4 from Analog Devices (formerly Hittite Microwave) is a GaAs MMIC SP8T non-reflective RF switch in a 4×4 mm ceramic SMT package, operating from DC to 3.5 GHz with 1.2 dB typical insertion loss, 35 dB isolation at 2 GHz, and TTL/CMOS-compatible 3-bit control (A/B/C) enabling single +5 V supply operation. It serves as a compact replacement for multi-switch configurations in cellular infrastructure front-ends.

For engineers reviewing the HMC253LC4 datasheet, HMC253LC4 pinout, HMC253LC4 application, or HMC253LC4 equivalent, key selection criteria include its non-reflective topology, integrated 3:8 decoder, DC–3.5 GHz bandwidth, +24 dBm input P1dB, and 40 dBm IIP3 - all critical for WiMAX, 3G basestation, and military RF signal routing.

Technical Context

The HMC253LC4 implements a monolithic GaAs-based SP8T architecture with integrated 3:8 TTL/CMOS decoder, requiring only three digital control lines (CTLA, CTLB, CTLC) and a single +5 V bias (Vdd) to select among eight RF paths (RF1–RF8) from common RFC. Its non-reflective design maintains 50 Ω impedance in both on- and off-states across DC–3.5 GHz.

DC blocking capacitors are mandatory at all RF ports (RFC, RF1–RF8), and the exposed ground paddle must be soldered to PCB RF ground. Operating temperature range is −40 °C to +85 °C, with absolute max Vdd = +7 V and control voltage range of −0.5 V to Vdd +1 V.

Key Specifications

Parameter Value and Actual Design Meaning
Frequency Range DC to 3.5 GHz - supports broadband RF routing without band switching in fixed wireless and cellular infrastructure.
Insertion Loss 1.2 dB typ. @ DC–3.0 GHz - minimizes signal attenuation in active antenna systems and repeater transmit chains.
Isolation 35 dB min. @ DC–2.0 GHz - ensures high inter-path suppression for multi-band MIMO front-end isolation.
IIP3 40 dBm typ. @ 0.5–3.5 GHz - enables linear operation with two-tone +7 dBm inputs in high-dynamic-range baseband interfaces.
P1dB +24 dBm typ. @ 0.5–3.5 GHz - supports high-power RF switching in CATV/DBS headend signal distribution.
Switching Speed tON/tOFF = 100 ns max. - allows fast TDD mode reconfiguration in WiBro and LTE-TDD systems.
Control Interface TTL/CMOS 3-bit logic (0/+3 V) with integrated decoder - eliminates external logic, reducing BOM count and layout area.

Pinout & Package

Ceramic 4×4 mm surface-mount package (alumina body, gold-over-nickel plating, MSL3), with 24-terminal leadless design and exposed RF ground paddle requiring solder connection to PCB ground plane.

Pin/Terminal Circuit Role Design Meaning
GND (Pins 1,3,5,7,12,14,16,18,20,21,23) RF and DC Ground Reference Multiple ground pins plus exposed bottom paddle ensure low-inductance RF grounding essential for broadband isolation and return loss stability.
RF1–RF8 & RFC (Pins 2,4,6,13,15,17,19,22,24) DC-coupled 50 Ω RF Ports All RF terminals require external DC blocking capacitors; matched 50 Ω impedance enables direct integration into 50 Ω RF layouts without matching networks.
Vdd (Pin 8) Positive Supply Input +5 V ±10% supply powers internal GaAs FETs and decoder; max 9 mA draw enables low-power system biasing.
CTLA, CTLB, CTLC (Pins 11,10,9) 3-bit Digital Control Inputs Binary-select logic (Low/High = 0/+3 V) drives integrated 3:8 decoder; no external level-shifting needed for FPGA or ASIC GPIO interfacing.

Key Features

Feature Design Value
Non-reflective SP8T topology Maintains 50 Ω match in both on- and off-states across full DC–3.5 GHz band, eliminating need for external termination resistors.
Integrated 3:8 TTL/CMOS decoder Reduces control interface to only 3 logic lines and one supply rail - simplifies host controller routing and firmware logic.
Single +5 V supply operation Eliminates dual-rail biasing; compatible with standard digital supply rails used in basestation control boards and RF modules.
RoHS-compliant ceramic SMT package 4×4 mm footprint with MSL3 rating supports automated assembly and high-reliability deployment in military and telecom environments.
−40 °C to +85 °C operating range Validated performance across industrial temperature extremes, suitable for outdoor repeaters and uncooled remote radio units.

Applications

Basestations & Repeaters WiMAX/WiBro Fixed Wireless

Use Scenario: Multi-band antenna switching in macrocell and small-cell basestations with shared RF front-end resources.

IC Role / Device Role / Timing Role: SP8T RF path selector routing transmit/receive signals between transceivers and antenna arrays.

Use Value: Replaces discrete SP4T + SPDT combinations, reducing component count, board space, and insertion loss accumulation by 0.8 dB per path.

Use Scenario: Dynamic frequency band selection in WiBro base stations supporting 2.3–2.7 GHz and 3.3–3.8 GHz bands.

IC Role / Device Role / Timing Role: High-isolation RF switch enabling rapid TDD frame reconfiguration between uplink/downlink channels.

Use Value: 35 dB isolation at 2.5 GHz prevents cross-band interference; 100 ns switching supports sub-100 µs guard intervals.

Cellular/3G Infrastructure CATV/DBS Headend

Use Scenario: Diversity receive path selection and transmit power amplifier output switching in UMTS Node B equipment.

IC Role / Device Role / Timing Role: Non-reflective SP8T switch managing signal routing between multiple RAKE receivers and PA outputs.

Use Value: 1.2 dB insertion loss preserves SNR margin; +24 dBm P1dB handles peak UMTS burst power without compression.

Use Scenario: Signal source selection and channel routing in cable TV headend modulators and QAM upconverters.

IC Role / Device Role / Timing Role: Broadband RF multiplexer switching between multiple upstream/downstream signal paths.

Use Value: DC–3.5 GHz coverage spans DOCSIS 3.1 upstream (5–85 MHz) and downstream (108–1218 MHz); 40 dBm IIP3 prevents distortion in dense QAM spectra.

Equivalent & Alternatives

The following parts are listed as comparable options for similar SP8T RF switch applications.

Alternative Part Technical Difference Application Difference Selection Advice
HMC547LP3E SPDT GaAs switch, 0.1–6.0 GHz, 0.8 dB IL, no integrated decoder - requires external logic for 8-path selection. Suitable for lower-port-count designs where discrete switching trees are acceptable; lacks monolithic SP8T integration. Select when board space permits cascaded SPDTs and higher isolation (>45 dB) at 5 GHz is required over bandwidth trade-off.
Qorvo QM11036 SP8T GaN switch, 0.7–3.8 GHz, 0.9 dB IL, +33 dBm P1dB, but requires dual supplies (+5 V & −5 V) and no integrated decoder. Better power handling for high-Power CATV nodes, but incompatible TTL control and more complex biasing. Select when >+30 dBm P1dB is mandatory and system can accommodate negative rail generation and external decoding logic.

Compared with HMC547LP3E and QM11036, the HMC253LC4 uniquely combines monolithic SP8T integration, single-supply +5 V operation, and embedded 3:8 decoder - delivering lowest system-level BOM count and fastest time-to-deploy for DC–3.5 GHz infrastructure switching.

Availability

HMC253LC4 is available at Aetrix Electronics and suitable for basestations & repeaters, WiMAX/WiBro fixed wireless, and CATV/DBS headend applications requiring stable component supply, long-lifecycle support, and RoHS-compliant ceramic packaging.

Supply support for HMC253LC4 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Analog Devices acquired Hittite Microwave in 2014, integrating its high-frequency RF IC portfolio into ADI's broader communications and defense solutions.

The HMC253LC4 belongs to Hittite's legacy GaAs MMIC switch product line, engineered specifically for broadband, high-isolation, low-loss RF signal routing in cellular infrastructure, aerospace, and test equipment.

FAQ

What is the recommended DC blocking capacitor value for HMC253LC4 RF ports?

100 pF 0402 capacitors are specified in the HMC253LC4 evaluation board design (PCB #104687) and provide optimal broadband impedance matching from DC to 3.5 GHz. These capacitors must be placed as close as possible to each RF port (RFC, RF1–RF8) to minimize parasitic inductance and preserve return loss performance across the full operating band.

Does HMC253LC4 require external bias sequencing or power-up timing control?

No - the HMC253LC4 has no strict power-up sequencing requirement. Vdd (+5 V) and control signals (CTLA/CTLB/CTLC) may be applied simultaneously. The device draws only 6 mA typical quiescent current and features built-in ESD protection; however, DC blocking capacitors must be installed before applying RF signals to prevent damage from DC offset.

Can HMC253LC4 operate with 0/+5 V control logic instead of 0/+3 V?

Yes - the HMC253LC4 control inputs accept TTL/CMOS logic levels from 0 V (low) to Vdd (+5 V), with guaranteed recognition of logic high at ≥+2.0 V and logic low at ≤+0.8 V. Using +5 V control is fully compliant and does not exceed absolute maximum ratings, though +3 V is preferred for compatibility with mixed-voltage digital systems.

What is the thermal resistance (θJA) of HMC253LC4, and how should it be managed in high-power operation?

The HMC253LC4 does not specify θJA in its datasheet, but its 150 °C maximum channel temperature and −40 °C to +85 °C operating range require full soldering of the exposed ground paddle to a thermally robust PCB ground plane. For continuous +24 dBm operation, use ≥6 thermal vias under the paddle and a minimum 10 mm² copper pour to maintain junction temperature below 120 °C at ambient +70 °C.

Is HMC253LC4 pin-compatible with any newer Analog Devices SP8T switches?

No - the HMC253LC4 has a unique 24-pin 4×4 mm ceramic layout with specific pin assignments (e.g., Vdd on Pin 8, CTLA on Pin 11). Later ADI SP8T devices like the ADMV1013 use different packages (e.g., 32-lead LGA) and control architectures (SPI interface), making them non-pin-compatible replacements requiring PCB redesign.

HMC253LC4 Specifications

Product attributes
Attribute value
Manufacturer:
Analog Devices Inc.
Series:
-
Package/Case:
24-TFCQFN Exposed Pad
Packaging:
Strip
Product Status:
Obsolete
RF Type:
Cellular, CATV
Topology:
Absorptive
Circuit:
SP8T
Frequency Range:
0Hz ~ 3.5GHz
Isolation:
35dB
Insertion Loss:
1.3dB
Test Frequency:
3.5GHz
P1dB:
-
IIP3:
43dBm
Features:
-
Impedance:
50Ohm
Voltage - Supply:
4.5V ~ 5.5V
Operating Temperature:
-40°C ~ 85°C
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
24-CQFN (4x4)

HMC253LC4 FAQ

1.How can I place an order for HMC253LC4 through Aetrix?

Please submit a Request for Quotation (RFQ) for HMC253LC4 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for HMC253LC4 reliable?

The price and inventory of HMC253LC4 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for HMC253LC4 is usually 5 days.

3.What payment methods are accepted for HMC253LC4?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for HMC253LC4 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for HMC253LC4?

HMC253LC4 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your HMC253LC4 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for HMC253LC4?

For technical support, including HMC253LC4 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your HMC253LC4 requirements.

6.How does Aetrix verify that HMC253LC4 is sourced from the original manufacturer or authorized distributors?

All HMC253LC4 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that HMC253LC4 meets industry standards.

7.What is the process for return or replacement of HMC253LC4?

All HMC253LC4 units undergo pre-shipment inspection (PSI). If there is an issue with HMC253LC4, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The HMC253LC4 part is unused and in its original packaging.

Return procedure for HMC253LC4:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

HMC253LC4 Tags

  • HMC253LC4
  • HMC253LC4 PDF
  • HMC253LC4 Datasheet
  • HMC253LC4 Specifications
  • HMC253LC4 Images
  • Analog Devices Inc.
  • Analog Devices Inc. HMC253LC4
  • Buy HMC253LC4
  • HMC253LC4 Price
  • HMC253LC4 Distributor
  • HMC253LC4 Supplier
  • HMC253LC4 Wholesale
Related Products
BGS13SN8E6327XTSA1
BGS13SN8E6327XTSA1

Infineon Technologies

BGS12WN6E6327XTSA1
BGS12WN6E6327XTSA1

Infineon Technologies

BGS12P2L6E6327XTSA1
BGS12P2L6E6327XTSA1

Infineon Technologies

BGS12PN10E6327XTSA1
BGS12PN10E6327XTSA1

Infineon Technologies

NJG1801K75-TE1
NJG1801K75-TE1

Nisshinbo Micro Devices Inc.

BGS14PN10E6327XTSA1
BGS14PN10E6327XTSA1

Infineon Technologies

SKY13348-374LF
SKY13348-374LF

Skyworks Solutions Inc.

4259-63
4259-63

pSemi

PE42421SCAA-Z
PE42421SCAA-Z

pSemi

AS179-92LF
AS179-92LF

Skyworks Solutions Inc.

SKY13351-378LF
SKY13351-378LF

Skyworks Solutions Inc.

AS215-92LF
AS215-92LF

Skyworks Solutions Inc.

Tech Hub

Search

Search

PRODUCT

PRODUCT

PHONE

PHONE

USER

USER