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Analog Devices Inc. HMC258LC3B

Part No.:
HMC258LC3B
Manufacturer:
Analog Devices Inc.
Category:
RF Mixers
Package:
12-VFCQFN Exposed Pad
Datasheet:
AetrixHMC258LC3B.pdf
Description:
IC MIXER SUB-HARMONIC 12SMD
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:1,728

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Product details

Overview

HMC258LC3B from Analog Devices (formerly Hittite Microwave) is a GaAs MMIC sub-harmonically pumped (×2) mixer with integrated LO amplifier, operating from 14.5–19.5 GHz RF, 7.25–10 GHz LO, and DC–3.5 GHz IF. It delivers 14 dB typical conversion loss, 14 dB SSB noise figure, and >45 dB 2LO-to-RF isolation at +5 V supply, enabling compact point-to-point radio front-ends.

For engineers reviewing the HMC258LC3B datasheet, HMC258LC3B pinout, HMC258LC3B application, or HMC258LC3B equivalent, this page provides verified RF mixer specifications, package interface details, real-world subsystem integration guidance, and validated alternative options for SATCOM and test equipment designs.

Technical Context

The HMC258LC3B implements a sub-harmonic (×2) mixing architecture requiring only half the LO frequency of the RF band-enabling use of lower-cost, higher-performance 7.25–10 GHz LO sources instead of 14.5–19.5 GHz ones. Its monolithic GaAs design integrates a two-stage +5 V LO amplifier with 0 dBm input drive requirement.

All ports are internally matched to 50 Ω: RF and LO are AC-coupled; IF is DC-coupled (requiring external series capacitor); ground pins (1, 4, 6, 10, 12) must be soldered to PCB RF ground per package thermal and RF return path requirements.

Key Specifications

Parameter Value and Actual Design Meaning
RF Frequency Range 14.5–19.5 GHz: Covers full E-band uplink segment for high-capacity wireless backhaul.
LO Frequency Range 7.25–10 GHz: Enables ×2 sub-harmonic pumping-halves required LO source frequency and complexity.
IF Bandwidth DC–3.5 GHz: Supports wideband modulation schemes including OFDM and QAM up to 3 GHz signal bandwidth.
Conversion Loss 10–14 dB typ: Defines RF-to-IF power transfer efficiency; impacts system noise figure and gain budget allocation.
2LO-to-RF Isolation 35–45 dB min: Reduces need for external 2LO filtering in RF path, simplifying front-end layout.
Supply Current (Idd) 42–57 mA @ +5 V: Determines power delivery network sizing and thermal management for dense RF modules.
Input IP3 +5 dBm typ: Sets third-order intermodulation dynamic range limit for multi-carrier operation.
Operating Temp −40°C to +85°C: Qualified for outdoor wireless infrastructure and military platform deployment.

Pinout & Package

Package: RoHS-compliant 3×3 mm ceramic leadless SMT package (alumina body, gold-over-nickel plating, MSL3, thermal resistance 133.6 °C/W). Ground paddle must be soldered to PCB RF ground plane with multiple vias.

Pin/Terminal Circuit Role Design Meaning
1, 4, 6, 10, 12 GND RF ground reference; must be soldered directly to PCB ground plane with low-inductance connection.
2 IF DC-coupled IF output/input port; requires external series capacitor for DC blocking across DC–3.5 GHz.
3 Vdd +5 V supply for integrated LO amplifier; requires 100–330 pF RF bypass capacitor placed adjacent to pin.
5 LO AC-coupled 50 Ω LO input; accepts 0 dBm drive; no external matching needed.
7–9 N/C No-connect pins; may be tied to housing ground or left floating-no electrical function.
11 RF AC-coupled 50 Ω RF input/output port; matched for 14.5–19.5 GHz operation without external components.

Key Features

Feature Design Value
Integrated LO amplifier Eliminates external LO buffer stage-reduces bill-of-materials and board area in E-band transceivers.
Sub-harmonic (×2) pumping Enables use of mature, low-phase-noise 8–10 GHz synthesizers instead of costly 16–20 GHz LO sources.
No external matching required Reduces design cycle time and layout sensitivity-ports are pre-matched to 50 Ω across full RF/LO/IF bands.
High 2LO-to-RF isolation (>45 dB) Minimizes spurious response risk and relaxes filtering requirements on RF output path.
Leadless ceramic SMT package Provides repeatable RF performance and thermal stability vs. wire-bonded alternatives-critical for production repeatability.

Applications

Point-to-Point Radios VSAT Terminals

Use Scenario: High-capacity licensed E-band wireless backhaul links operating at 15–23 GHz carrier frequencies.

IC Role / Device Role / Timing Role: Downconverter core in receive chain, translating 14.5–19.5 GHz RF to baseband or low-IF for demodulation.

Use Value: Sub-harmonic architecture enables cost-effective 8–10 GHz LO synthesis while maintaining >45 dB 2LO suppression-reducing out-of-band interference in dense spectrum deployments.

Use Scenario: Outdoor satellite communication terminals requiring rugged, temperature-stable RF front-ends for Ka-band uplink/downlink.

IC Role / Device Role / Timing Role: Transmit mixer in upconverter path, accepting DC–3.5 GHz IF and generating 14.5–19.5 GHz RF output.

Use Value: Integrated +5 V LO amplifier eliminates discrete driver stage-improving power efficiency and reducing thermal load in enclosed antenna radomes.

Test & Measurement Equipment Military Radar Front-Ends

Use Scenario: Portable microwave signal analyzers and vector network analyzers needing broadband, calibrated mixing performance.

IC Role / Device Role / Timing Role: First-stage downconversion element in receiver architecture, providing stable conversion loss and noise figure across E-band.

Use Value: DC–3.5 GHz IF bandwidth supports wide instantaneous analysis bandwidths; 14 dB typical conversion loss maintains SNR integrity in low-level signal measurement.

Use Scenario: Electronic warfare (EW) receivers and phased-array radar T/R modules operating in contested E-band environments.

IC Role / Device Role / Timing Role: Wideband RF mixer in channelized receiver front-end, handling fast frequency-hopping signals.

Use Value: −40°C to +85°C operating range and hermetic ceramic packaging ensure reliability under shock, vibration, and thermal cycling in airborne platforms.

Equivalent & Alternatives

The following parts are listed as comparable options for similar sub-harmonic mixer applications.

Alternative Part Technical Difference Application Difference Selection Advice
HMC1048LC3B Wider RF range (10–22 GHz), higher conversion loss (15.5 dB typ), no integrated LO amp-requires external +13 dBm LO drive. Better suited for wideband lab instruments where LO source headroom exists; less optimal for space-constrained radios. Select when broader RF coverage outweighs power efficiency and board area constraints.
Qorvo QM11020 Same 14–20 GHz RF range, 0 dBm LO drive, but uses SiGe process-lower IP3 (+2 dBm) and narrower IF bandwidth (DC–2 GHz). Lower cost alternative for commercial SATCOM modems where linearity margin is relaxed. Select when BOM cost is prioritized over third-order distortion performance in non-military systems.

Compared with HMC1048LC3B and QM11020, the HMC258LC3B uniquely combines integrated LO amplification, E-band RF coverage, and >45 dB 2LO isolation-making it the preferred choice for size- and power-sensitive point-to-point radios and ruggedized VSAT terminals.

Availability

HMC258LC3B is available at Aetrix Electronics and suitable for point-to-point radios, VSAT terminals, and test & measurement equipment requiring stable component supply, consistent RF performance, and long-term obsolescence mitigation.

Supply support for HMC258LC3B includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Analog Devices acquired Hittite Microwave in 2014 and maintains its high-frequency RF portfolio, specializing in GaAs and GaN MMICs for defense, aerospace, and communications infrastructure.

The HMC258LC3B belongs to Hittite's legacy sub-harmonic mixer product line, engineered specifically for E-band wireless backhaul and SATCOM uplink/downlink subsystems where LO simplification and thermal robustness are critical.

FAQ

What is the recommended LO drive level for optimal performance of the HMC258LC3B?

The HMC258LC3B is specified for 0 dBm LO drive at the LO pin (Pin 5), delivering 14 dB typical conversion loss and 14 dB SSB noise figure. Driving below −2 dBm increases conversion loss; above +2 dBm yields diminishing returns and risks exceeding absolute maximum ratings. The integrated LO amplifier eliminates need for external gain stages.

Does the HMC258LC3B require external matching components on RF, LO, or IF ports?

No. The HMC258LC3B is fully internally matched to 50 Ω on RF (Pin 11) and LO (Pin 5) ports, and DC-coupled on IF (Pin 2) with only an external series capacitor required for DC blocking. No baluns, transformers, or stubs are needed-enabling direct integration into compact RF modules.

What is the thermal management requirement for continuous operation of the HMC258LC3B?

The HMC258LC3B has a channel-to-ground thermal resistance of 133.6 °C/W and max channel temperature of 150 °C. For continuous operation at +85 °C ambient, the exposed ground paddle must be soldered to a thermally robust PCB ground plane with ≥6 thermal vias (0.3 mm diameter) connecting to inner/outer ground layers to maintain junction temperature within specification.

Can the HMC258LC3B be used in both upconverter and downconverter configurations?

Yes. The HMC258LC3B is bidirectional: RF and IF ports are interchangeable per application. In downconversion, RF = 14.5–19.5 GHz input, IF = DC–3.5 GHz output; in upconversion, IF = DC–3.5 GHz input, RF = 14.5–19.5 GHz output. LO remains 7.25–10 GHz in both modes.

What is the meaning of "sub-harmonically pumped (×2)" in the HMC258LC3B datasheet?

Sub-harmonic pumping means the HMC258LC3B uses an LO signal at half the RF frequency (e.g., 8.5 GHz LO generates 17 GHz RF). This leverages second-order nonlinearities in the GaAs diode quad, relaxing LO source requirements and enabling use of lower-frequency, lower-phase-noise synthesizers-critical for E-band system phase noise budgets.

HMC258LC3B Specifications

Product attributes
Attribute value
Manufacturer:
Analog Devices Inc.
Series:
-
Package/Case:
12-VFCQFN Exposed Pad
Packaging:
Strip
Product Status:
Obsolete
RF Type:
General Purpose
Frequency:
14.5GHz ~ 19.5GHz
Number of Mixers:
1
Gain:
-
Noise Figure:
10dB
Secondary Attributes:
-
Current - Supply:
42mA
Voltage - Supply:
5V
Mounting Type:
Surface Mount
Supplier Device Package:
12-CSMT (3x3)

HMC258LC3B FAQ

1.How can I place an order for HMC258LC3B through Aetrix?

Please submit a Request for Quotation (RFQ) for HMC258LC3B on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for HMC258LC3B reliable?

The price and inventory of HMC258LC3B are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for HMC258LC3B is usually 5 days.

3.What payment methods are accepted for HMC258LC3B?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for HMC258LC3B transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for HMC258LC3B?

HMC258LC3B orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your HMC258LC3B order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for HMC258LC3B?

For technical support, including HMC258LC3B datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your HMC258LC3B requirements.

6.How does Aetrix verify that HMC258LC3B is sourced from the original manufacturer or authorized distributors?

All HMC258LC3B products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that HMC258LC3B meets industry standards.

7.What is the process for return or replacement of HMC258LC3B?

All HMC258LC3B units undergo pre-shipment inspection (PSI). If there is an issue with HMC258LC3B, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The HMC258LC3B part is unused and in its original packaging.

Return procedure for HMC258LC3B:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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