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Analog Devices Inc. HMC258LC3BTR-R5
- Part No.:
- HMC258LC3BTR-R5
- Manufacturer:
- Analog Devices Inc.
- Category:
- RF Mixers
- Package:
- 12-VFCQFN Exposed Pad
- Datasheet:
-
HMC258LC3BTR-R5.pdf
- Description:
- IC MIXER FUNDAMENTAL 12SMD
- Quantity:
- Payment:
- Shipping:
Inventory:3,911
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Product details
Overview
HMC258LC3BTR-R5 from Analog Devices (formerly Hittite Microwave) is a GaAs MMIC sub-harmonically pumped (x2) mixer with integrated LO amplifier, operating 14.5–19.5 GHz RF, 7.25–10 GHz LO, and DC–3.5 GHz IF. It delivers 14 dB typical conversion loss, 14 dB SSB noise figure, and >45 dB 2LO-to-RF isolation at +5 V supply, enabling compact point-to-point radio and SATCOM front-ends without external matching.
For engineers reviewing the HMC258LC3BTR-R5 datasheet, HMC258LC3BTR-R5 pinout, HMC258LC3BTR-R5 application, or HMC258LC3BTR-R5 equivalent, key selection criteria include its 0 dBm LO drive requirement, RoHS-compliant 3×3 mm ceramic SMT package, integrated two-stage LO amplifier, and elimination of wire bonding in high-frequency subsystems.
Technical Context
The HMC258LC3BTR-R5 implements a sub-harmonic (x2) mixing architecture where the LO frequency is half the RF frequency, reducing LO generation complexity in Ka-band systems. Its monolithic GaAs design integrates an LO amplifier and passive diode-based mixer core on a single die.
It operates as a downconverter by default (IF = 1 GHz), supports upconversion per characterization data, and requires no external DC blocking or impedance-matching components at RF, LO, or IF ports-only a 100–330 pF bypass capacitor on Vdd and external DC blocking on IF.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| RF Frequency Range | 14.5 – 19.5 GHz: Covers full Ka-band satellite uplink and point-to-point backhaul channels. |
| LO Frequency Range | 7.25 – 10 GHz: Enables use of lower-cost, mature X-band synthesizers for Ka-band mixing. |
| IF Bandwidth | DC – 3.5 GHz: Supports wideband modulation schemes including 256-QAM and OFDM baseband signals. |
| Conversion Loss | 10 – 14 dB (typ. 14 dB): Defines signal path attenuation; impacts cascaded noise figure and gain budgeting. |
| Noise Figure (SSB) | 10 – 14 dB (typ. 14 dB): Directly affects receiver sensitivity in low-SNR SATCOM links. |
| 2LO to RF Isolation | 35 – 45 dB (typ. 45 dB): Reduces need for external 2LO filtering, simplifying front-end BOM and layout. |
| Supply Current (Idd) | 42 – 57 mA @ +5 V: Enables low-power operation in thermally constrained RF modules. |
Pinout & Package
Package: 3×3 mm leadless ceramic SMT package (alumina body, gold-over-nickel plating, MSL3, thermal resistance 133.6 °C/W). Ground paddle and all ground pins must be soldered to PCB RF ground plane.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1, 4, 6, 10, 12 | GND | RF ground connections; mandatory soldering to PCB ground plane for signal integrity and thermal dissipation. |
| 2 | IF | DC-coupled IF port requiring external series capacitor for DC blocking across DC–3.5 GHz bandwidth. |
| 3 | Vdd | +5 V supply for integrated LO amplifier; requires 100–330 pF RF bypass capacitor placed adjacent to pin. |
| 5 | LO | AC-coupled 50 Ω LO input; matched internally, no external matching needed. |
| 7–9 | N/C | No-connect pins; may be tied to housing ground or left floating per layout requirements. |
| 11 | RF | AC-coupled 50 Ω RF input; internally matched for 14.5–19.5 GHz operation. |
Key Features
| Feature | Design Value |
|---|---|
| Integrated LO amplifier | Two-stage GaAs design powered by single +5 V rail, accepting only 0 dBm LO drive-reduces external driver stage count. |
| Sub-harmonic (x2) pumping | Halves required LO frequency versus fundamental mixing, easing synthesis and filtering in Ka-band systems. |
| No external matching components | All RF, LO, and IF ports are internally 50 Ω matched; eliminates discrete matching networks and tuning complexity. |
| High 2LO-to-RF isolation | Typ. 45 dB isolation suppresses 2LO leakage into antenna path, reducing spurious emissions and filter burden. |
| RoHS-compliant ceramic SMT package | 3×3 mm hermetic ceramic package enables reflow assembly, stable performance from −40 to +85 °C, and repeatable RF interface. |
Applications
| Point-to-Point Radios | VSAT Terminals |
|---|---|
Use Scenario: High-capacity licensed microwave links operating at 18 GHz carrier frequency with 100+ MHz channel bandwidth. IC Role / Device Role / Timing Role: Downconverting received 18 GHz RF signal to 1 GHz IF for demodulation in compact outdoor unit (ODU) assemblies. Use Value: Eliminates external LO buffer and RF matching, reducing ODU size and assembly cost while maintaining >45 dB 2LO suppression. |
Use Scenario: Receive chain in Ku/Ka-band VSAT terminals for enterprise broadband, requiring DC–3.5 GHz IF output compatibility with standard demodulators. IC Role / Device Role / Timing Role: Sub-harmonic mixer translating 19.5 GHz satellite downlink to 1–2 GHz IF band with minimal added noise. Use Value: 14 dB typ. conversion loss and 14 dB SSB noise figure preserve link margin; integrated LO amplifier simplifies local oscillator design. |
| Test & Measurement Equipment | Military & Space Transceivers |
Use Scenario: Signal analyzer front-end covering 14.5–19.5 GHz with calibrated IF output for digitization and spectral analysis. IC Role / Device Role / Timing Role: First-stage mixer in broadband receiver architecture, providing wide IF bandwidth and stable conversion gain vs. temperature. Use Value: DC–3.5 GHz IF bandwidth supports real-time spectrum capture; ±0.5 dB conversion gain flatness over −40 to +85 °C ensures measurement repeatability. |
Use Scenario: Radar warning receiver (RWR) or electronic warfare (EW) front-end operating in contested Ka-band environments. IC Role / Device Role / Timing Role: Wideband sub-harmonic mixer enabling rapid frequency agility and low spurious generation under pulsed RF conditions. Use Value: >45 dB 2LO/RF isolation prevents LO feedthrough during sensitive receive windows; rugged ceramic package withstands shock/vibe per MIL-STD-883. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar sub-harmonic mixer applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| HMC1048LP3E | Wider RF range (10–22 GHz), higher conversion loss (15.5 dB typ.), no integrated LO amplifier. | Requires external LO driver; better suited for systems with existing high-power LO sources. | Select when broader RF coverage outweighs need for integrated LO amplification and lower loss. |
| QPC1006 | Higher IF bandwidth (DC–6 GHz), 17 dB conversion loss, GaN-based, +28 V supply. | Designed for high-power transmit/receive modules; not drop-in compatible due to voltage, bias, and thermal requirements. | Choose for high-dynamic-range T/R modules where power handling and linearity exceed HMC258LC3BTR-R5 capability. |
Compared with HMC1048LP3E and QPC1006, the HMC258LC3BTR-R5 uniquely combines integrated +5 V LO amplification, 0 dBm LO drive, and 45 dB 2LO/RF isolation in a 3×3 mm package-making it optimal for space-constrained, low-LO-power Ka-band receivers where simplicity and isolation are prioritized over ultimate bandwidth or power handling.
Availability
HMC258LC3BTR-R5 is available at Aetrix Electronics and suitable for point-to-point radios, VSAT terminals, and test & measurement equipment requiring stable component supply, consistent RF performance, and long-term obsolescence management.
Supply support for HMC258LC3BTR-R5 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Analog Devices acquired Hittite Microwave in 2014 and maintains its high-frequency RF portfolio, specializing in GaAs, GaN, and SiGe MMIC solutions for defense, aerospace, and communications.
The HMC258LC3BTR-R5 belongs to Hittite's legacy sub-harmonic mixer product line, engineered specifically for Ka-band wireless infrastructure and EW systems demanding high isolation, low LO drive, and surface-mount reliability.
FAQ
What is the recommended LO drive level for optimal performance of the HMC258LC3BTR-R5?
The HMC258LC3BTR-R5 is characterized and optimized for 0 dBm LO drive. At this level, it achieves 14 dB typical conversion loss and 45 dB 2LO-to-RF isolation. Driving below −2 dBm increases conversion loss; above +2 dBm yields diminishing returns and risks exceeding absolute maximum ratings. The integrated LO amplifier eliminates need for external drivers when fed with 0 dBm.
Does the HMC258LC3BTR-R5 require external DC blocking capacitors?
Yes-the IF port (Pin 2) is DC-coupled and requires an external series capacitor for DC blocking across the full DC–3.5 GHz IF bandwidth. RF and LO ports (Pins 5 and 11) are AC-coupled and internally matched; no additional DC blocking is needed there. Failure to DC-block the IF port may cause die non-function or permanent damage.
Can the HMC258LC3BTR-R5 be used in upconverter configurations?
Yes-characterization data confirms upconverter operation (e.g., IF = 1 GHz → RF = 18 GHz with LO = 8.5 GHz). Conversion gain remains within 10–14 dB range, and spurious outputs (e.g., 2LO/RF) are suppressed to ≥45 dBc. Layout and biasing remain identical; only signal routing direction changes.
What is the thermal management requirement for continuous operation of the HMC258LC3BTR-R5?
The HMC258LC3BTR-R5 has a channel-to-ground thermal resistance of 133.6 °C/W and max channel temperature of 150 °C. With 57 mA Idd at +5 V (285 mW dissipation), PCB design must ensure the exposed ground paddle and all GND pins (1,4,6,10,12) are soldered to a low-impedance, multi-via thermal pad connected to internal ground planes. Derating begins above +85 °C ambient.
Is the HMC258LC3BTR-R5 pin-compatible with other Hittite mixer variants like HMC258LC3?
Yes-the HMC258LC3BTR-R5 shares identical pinout, package dimensions, and terminal functions with HMC258LC3 and HMC258LC3B. Differences are limited to tape-and-reel packaging (R5 suffix denotes 500-piece reel) and MSL3 compliance; electrical and mechanical interfaces are fully interchangeable in existing designs.
HMC258LC3BTR-R5 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Analog Devices Inc.
- Series:
- -
- Package/Case:
- 12-VFCQFN Exposed Pad
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- RF Type:
- VSAT
- Frequency:
- 14.5GHz ~ 19.5GHz
- Number of Mixers:
- 1
- Gain:
- -
- Noise Figure:
- 10dB
- Secondary Attributes:
- -
- Current - Supply:
- 42mA
- Voltage - Supply:
- 5V
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 12-CSMT (3x3)
HMC258LC3BTR-R5 FAQ
1.How can I place an order for HMC258LC3BTR-R5 through Aetrix?
Please submit a Request for Quotation (RFQ) for HMC258LC3BTR-R5 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for HMC258LC3BTR-R5 reliable?
The price and inventory of HMC258LC3BTR-R5 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for HMC258LC3BTR-R5 is usually 5 days.
3.What payment methods are accepted for HMC258LC3BTR-R5?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for HMC258LC3BTR-R5 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for HMC258LC3BTR-R5?
HMC258LC3BTR-R5 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your HMC258LC3BTR-R5 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for HMC258LC3BTR-R5?
For technical support, including HMC258LC3BTR-R5 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your HMC258LC3BTR-R5 requirements.
6.How does Aetrix verify that HMC258LC3BTR-R5 is sourced from the original manufacturer or authorized distributors?
All HMC258LC3BTR-R5 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that HMC258LC3BTR-R5 meets industry standards.
7.What is the process for return or replacement of HMC258LC3BTR-R5?
All HMC258LC3BTR-R5 units undergo pre-shipment inspection (PSI). If there is an issue with HMC258LC3BTR-R5, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The HMC258LC3BTR-R5 part is unused and in its original packaging.
Return procedure for HMC258LC3BTR-R5:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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