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Analog Devices Inc. HMC260

Part No.:
HMC260
Manufacturer:
Analog Devices Inc.
Category:
RF Mixers
Package:
Die
Datasheet:
AetrixHMC260.pdf
Description:
IC MIXER FUNDAMENTAL GP-5 DIE
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:2,458

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Product details

Overview

HMC260LC3B from Analog Devices (formerly Hittite Microwave) is a GaAs MMIC double-balanced mixer operating from 14 to 26 GHz RF/LO and DC–8 GHz IF, with +20 dBm input IP3, 40 dB LO-to-RF isolation, and no DC bias required - ideal for Ka-band point-to-point radio up/downconversion.

For engineers reviewing the HMC260LC3B datasheet, HMC260LC3B pinout, HMC260LC3B application, or HMC260LC3B equivalent, key selection criteria include its 3×3 mm ceramic SMT package, passive operation, wide IF bandwidth, temperature-stable IP3 performance across –40°C to +85°C, and compatibility with surface-mount manufacturing without wire bonding.

Technical Context

The HMC260LC3B is a fundamental-mode passive double-balanced mixer using integrated balun structures to achieve high LO-to-RF and LO-to-IF suppression. It operates as either upconverter or downconverter without external matching components or DC bias.

Its RF and LO ports are DC-coupled and 50 Ω matched; the IF port is DC-coupled but limited to ±2 mA current handling. Spurious output levels are characterized up to m=4, n=4 harmonics, with measured IP2 ≥50 dBm and P1dB ≥14 dBm at +25°C.

Key Specifications

Parameter Value and Actual Design Meaning
RF/LO Frequency Range14–26 GHz - supports full Ka-band operation in both up- and downconversion modes
IF BandwidthDC–8 GHz - enables baseband through low-microwave IF processing without AC coupling constraints
Conversion Loss7.5–12 dB typical - defines signal path attenuation; impacts system noise figure and gain budget
Input IP3+20 dBm typical - determines third-order intermodulation distortion floor in multi-carrier systems
LO-to-RF Isolation40 dB typical - minimizes LO leakage into antenna or RF front-end, reducing desensitization
Package Size3×3 mm ceramic SMT - RoHS-compliant leadless package compatible with standard reflow assembly
Operating Temperature–40°C to +85°C - qualified for outdoor wireless infrastructure and military environmental stress

Pinout & Package

12-lead ceramic 3×3 mm leadless SMT package (alumina body, gold-over-nickel plating, MSL3); ground paddle must be soldered to PCB RF ground per datasheet mechanical notes.

Pin/Terminal Circuit Role Design Meaning
1, 3, 4, 6, 7, 9GNDRF/DC ground terminals - all must connect directly to PCB ground plane with multiple vias
2LODC-coupled 50 Ω matched input - accepts +9 to +15 dBm LO drive without external biasing
5IFDC-coupled output - supports DC operation only if current ≤±2 mA; otherwise requires external AC coupling
8RFDC-coupled 50 Ω matched port - bidirectional use as RF input (downconv) or output (upconv)
10, 11, 12N/CNo-connect terminals - may be grounded without performance impact

Key Features

Feature Design Value
No DC bias requiredPassive operation eliminates bias network design, reduces BOM count, and improves reliability
Optimized balun architectureDelivers 40 dB LO-to-RF and ≥30 dB LO-to-IF isolation without external filtering
Wide IF bandwidth (DC–8 GHz)Supports zero-IF, complex IF, and broadband modulation schemes including OFDM and QAM
RoHS-compliant 3×3 mm SMT packageEnables high-density RF layout and automated assembly without wire bonding
ESD rating Class 1A (HBM)Requires strict ESD handling but allows integration into production lines with standard precautions

Applications

Point-to-Point Radios VSAT Terminals

Use Scenario: High-capacity licensed Ka-band backhaul links between cell towers or enterprise sites.

IC Role / Device Role / Timing Role: Downconverter translating 23–26 GHz received RF to 1–4 GHz IF for ADC sampling.

Use Value: 40 dB LO-to-RF isolation prevents local oscillator radiation from interfering with adjacent channels or regulatory compliance testing.

Use Scenario: Two-way satellite communication terminals requiring simultaneous transmit and receive in shared aperture systems.

IC Role / Device Role / Timing Role: Dual-role mixer: upconverts 1–4 GHz IF to 14–18 GHz for transmission and downconverts 18–26 GHz receive signals.

Use Value: Passive architecture and DC–8 GHz IF enable direct interface with quadrature modulators/demodulators without additional filtering.

Test Equipment Signal Sources Military Radar Front-Ends

Use Scenario: Modular microwave signal generators needing fast frequency agility and low spurious output.

IC Role / Device Role / Timing Role: Upconverter stage driven by synthesizer LO to generate precise Ka-band output signals.

Use Value: Measured IP2 ≥50 dBm and IP3 ≥20 dBm ensure clean spectral output under two-tone test conditions.

Use Scenario: EW and radar receivers operating in harsh environments with wide temperature excursions.

IC Role / Device Role / Timing Role: First-stage downconverter in wideband digital receiver channel, preserving dynamic range over –40°C to +85°C.

Use Value: Stable conversion loss (±1.5 dB) and IP3 (±1 dB) across temperature enable calibrated amplitude response without real-time compensation.

Equivalent & Alternatives

The following parts are listed as comparable options for similar mixer applications.

Alternative Part Technical Difference Application Difference Selection Advice
HMC1048LP3EWider RF range (10–26 GHz), higher conversion loss (11.5 dB typ), same 3×3 mm packageBetter low-band coverage below 14 GHz; less suitable for narrowband Ka-band optimizationSelect when system requires dual-band (X/Ka) operation and can tolerate 1.5 dB higher loss
Qorvo QM11020Higher IF bandwidth (DC–12 GHz), +22 dBm IP3, but requires +17 dBm LO drive and different 4×4 mm packageEnables wider instantaneous bandwidth IF processing; incompatible footprint and LO drive architectureSelect when IF bandwidth >8 GHz is mandatory and board redesign is acceptable

Compared with HMC1048LP3E and QM11020, the HMC260LC3B offers optimal Ka-band conversion efficiency and thermal stability within its native 14–26 GHz band, with lower LO drive requirement (+13 dBm vs. +17 dBm) and smaller footprint - making it preferred for space-constrained, high-volume Ka-band radios.

Availability

HMC260LC3B is available at Aetrix Electronics and suitable for point-to-point radios, VSAT terminals, and military radar front-ends requiring stable component supply, long-lifecycle support, and traceable sourcing for production programs.

Supply support for HMC260LC3B includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Analog Devices acquired Hittite Microwave in 2014 and maintains its high-frequency RF portfolio, specializing in microwave ICs for communications, defense, and instrumentation.

The HMC260LC3B belongs to Hittite's legacy GaAs MMIC mixer product line, designed specifically for Ka-band wireless infrastructure where passive performance, small size, and manufacturability are critical.

FAQ

What is the recommended LO drive level for optimal performance of the HMC260LC3B?

The HMC260LC3B achieves best conversion loss and IP3 at +13 dBm LO drive, with functional operation from +9 dBm to +15 dBm. Below +9 dBm, conversion loss increases sharply; above +15 dBm, risk of compression rises. The HMC260LC3B datasheet specifies +13 dBm as the reference condition for all typical electrical specs including isolation and noise figure.

Can the HMC260LC3B be used for zero-IF (direct-conversion) architectures?

Yes, the HMC260LC3B supports zero-IF operation due to its DC–8 GHz IF bandwidth and DC-coupled IF port. However, the IF pin must not source or sink more than ±2 mA DC current. For true DC-coupled baseband interfaces, external current-limiting circuitry or bias tees are required to protect the HMC260LC3B while maintaining DC path integrity.

Does the HMC260LC3B require external matching components or baluns?

No, the HMC260LC3B integrates optimized on-chip balun structures and is fully matched to 50 Ω at RF, LO, and IF ports. No external matching networks, transformers, or baluns are needed - enabling simplified PCB layout and eliminating tuning steps during production. This is confirmed in the device's General Description and Functional Diagram sections.

What is the thermal resistance and power dissipation limit of the HMC260LC3B?

The HMC260LC3B has a junction-to-ground-paddle thermal resistance of 253 °C/W. Its maximum continuous power dissipation is 260 mW at +85°C ambient, derating linearly at 3.95 mW/°C above that temperature. The exposed ground paddle must be soldered to a thermally robust PCB ground plane with ≥6 vias to maintain safe junction temperatures under full LO drive.

Is the HMC260LC3B pin-compatible with other Hittite mixer variants like HMC261LC3B?

No, the HMC260LC3B is not pin-compatible with HMC261LC3B. While both use 3×3 mm ceramic packages, their pin functions differ: HMC261LC3B has separate RF and IF differential outputs, whereas HMC260LC3B uses single-ended RF and IF ports with distinct pin assignments (e.g., HMC260LC3B pin 5 = IF, HMC261LC3B pins 5/6 = IF+/-). PCB layout must be redesigned for substitution.

HMC260 Specifications

Product attributes
Attribute value
Manufacturer:
Analog Devices Inc.
Series:
-
Package/Case:
Die
Packaging:
Bulk
Product Status:
Obsolete
RF Type:
General Purpose
Frequency:
14GHz ~ 26GHz
Number of Mixers:
1
Gain:
-
Noise Figure:
9dB
Secondary Attributes:
Up/Down Converter
Current - Supply:
-
Voltage - Supply:
-
Mounting Type:
Surface Mount
Supplier Device Package:
Die

HMC260 FAQ

1.How can I place an order for HMC260 through Aetrix?

Please submit a Request for Quotation (RFQ) for HMC260 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for HMC260 reliable?

The price and inventory of HMC260 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for HMC260 is usually 5 days.

3.What payment methods are accepted for HMC260?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for HMC260 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for HMC260?

HMC260 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your HMC260 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for HMC260?

For technical support, including HMC260 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your HMC260 requirements.

6.How does Aetrix verify that HMC260 is sourced from the original manufacturer or authorized distributors?

All HMC260 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that HMC260 meets industry standards.

7.What is the process for return or replacement of HMC260?

All HMC260 units undergo pre-shipment inspection (PSI). If there is an issue with HMC260, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The HMC260 part is unused and in its original packaging.

Return procedure for HMC260:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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